Datasheet STTH208, STTH208U Datasheet (SGS Thomson Microelectronics)

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®
HIGH VOLTAGE ULTRAFAST RECTIFIER
MAIN PRODUCT CHARACTERISTICS
STTH208/U
I
F(AV)
V
RRM
2A
800 V
Tj (max) 175 °C
(max) 1.25 V
V
F
FEATURES AND BENEFITS
Low forward voltage drop
High reliability
High surge current capability
Soft switching for reducedEMI disturbances
Planar technology
DO-15
STTH208
DESCRIPTION
The STTH208, which is using ST ultrafast high voltage planar technology, is specially suited for free-wheeling, clamping, snubbering, demagneti­zationinpowersuppliesandother power switching
SMB
STTH208U
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
V
V
(RMS)
I
F(AV)
RRM
Repetitive peak reverse voltage 800 V RMS voltage 560 V Average forward current Tl = 60°C δ =0.5 DO-15 2 A
Tl = 100°C δ =0.5 SMB 2
I
FSM
Forward surge current t = 8.3 ms DO-15 45 A
SMB 35
T
stg
Storage temperature range - 50 + 175 °C
Tj Maximum operating junction temperature + 175 °C
January 2003 - Ed: 1
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STTH208/U
THERMAL PARAMETERS
Symbol Parameter Value Unit
R
th (j-l)
Junction to lead L = 10 mm DO-15 40 °C/W
SMB 25
R
th (j-a)
Junction to ambient L = 10 mm DO-15 110
STATIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
I
R
Reverse leakage current VR= 800V Tj = 25°C 5 µA
Tj = 125°C 50
V
Forward voltage drop IF= 2 A Tj = 25°C 1.65 V
F
Tj = 150°C 0.89 1.25
To evaluate the maximum conduction losses use the following equation : P=1.05xI
F(AV)
+0.10xI
F2(RMS)
DYNAMIC ELECTRICAL CHARACTERISTICS
Symbol Parameter Tests conditions Min. Typ. Max. Unit
t
rr
Reverse recovery time IF= 0.5 A
Tj = 25°C 75 ns
Irr = 0.25 A IR=1A
t
fr
V
FP
Forward recovery time IF=2A Forward recovery voltage 9 V
dIF/dt = 50 A/µs VFR=1.1xVFmax
Tj = 25°C 200 ns
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STTH208/U
Fig.1: Conduction losses versusaverage current.
P(W)
3.5
δ = 0.2
3.0
δ = 0.05
2.5
2.0
1.5
1.0
0.5
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
δ = 0.1
I (A)
F(AV)
δ = 0.5
δ
=tp/T
δ = 1
T
tp
Fig. 3-1: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, L
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
= 10mm) (DO-15).
leads
Single pulse
t (s)
p
δ
=tp/T
T
tp
Fig. 2: Forward voltage drop versus forward current.
I (A)
FM
100.0
T=150°C
j
(maximum values)
T=150°C
10.0
1.0
0.1
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
j
(typical values)
V (V)
FM
T=25°C
j
(maximum values)
Fig. 3-2: Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4, S=1cm
Z/R
th(j-c) th(j-c)
1.0
0.9
0.8
0.7
δ = 0.5
0.6
0.5
0.4
δ = 0.2
0.3
δ = 0.1
0.2
0.1
Single pulse
0.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
2
) (SMB).
t (s)
p
δ
=tp/T
T
tp
Fig. 4: Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board FR4, copper thickness: 35µm).
R (°C/W)
th(j-a)
110 100
90 80 70 60 50 40 30 20 10
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
L =10mm
leads
DO-15
SMB
S(cm²)
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STTH208/U
PACKAGE MECHANICAL DATA
SMB
DIMENSIONS
E1
E
C
L
FOOTPRINT (in millimeters)
REF.
Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016
A1
A2
b
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.60 0.030 0.063
2.3
1.52 2.75
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PACKAGE MECHANICAL DATA
DO-15
STTH208/U
DIMENSIONS
A
CC
REF.
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266 B 2.95 3.53 0.116 0.139
D
B
C 26 31 1.024 1.220 D 0.71 0.88 0.028 0.035
Ordering code Marking Package Weight Base qty Delivery mode
STTH208 STTH208 DO-15 0.4 g 1000 Ammopack
STTH208U U08 SMB 0.11 g 2500 Tape& reel
STTH208RL STTH208 DO-15 0.4 g 6000 Tape& reel
Epoxy meets UL 94,V0
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