3M™ Chip Carrier Sockets
Surfacemount |
8400 Series |
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• Accepts chip carriers conforming to JEDEC |
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outline MO-047 for square and MO-052 for |
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rectangular |
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• High temperature insulator compatible with IR |
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reflow and wave soldering |
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• Compatible with automated loading equipment |
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• Open top design allows unrestricted air flow |
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• Molded slots for ease of device extraction |
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• Available with optional PCB locating posts |
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RoHS* compliant |
Date Modified: December 7, 2006
TS-2147-04
Sheet 1 of 2
Physical
Insulation
Material: Glass Filled Polyphenylene Sulfide (PPS)
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 50 µ″, [ 1.27 µm ] Nickel - Overall
Wiping Area: 160 µ″, [ 4.06 µm ] Matte Tin
Electrical
Contact Resistance: |
15 mΩ |
Capacitance: |
1 pF |
Insulation Resistance: |
>103 MΩ minimum |
Environmental
Temperature Rating: |
-40°C to +105°C |
Process Rating: |
Maximum 260° C, single pass, (profile per J-STD-020C) |
Moisture Sensitivity Level: |
1 (per J-STD-020C) |
*"RoHS compliant" means that the product or part does not contain any of the following substances in excess of the following maximum concentration values in any homogeneous material, unless the substance is in an application that is exempt under RoHS: (a) 0.1% (by weight) for lead, mercury, hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers; or (b) 0.01% (by weight) for cadmium. Unless otherwise stated in writing by 3M, this information represents 3M's knowledge and belief based on information provided by third party suppliers to 3M.
3
Interconnect Solutions http://www.3M.com/interconnects/
3M is a trademark of 3M Company. For technical, sales or ordering information call
800-225-5373
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