MOTOROLA MC10EL13, MC100EL11 Technical data

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1:2 Differential Fanout Buffer
The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device is functionally similar to the E111 device but with higher performance capabilities. Having within-device skews and output transition times significantly improved over the E111, the EL11 is ideally suited for those applications which require the ultimate in AC performance.
The differential inputs of the EL11 employ clamping circuitry to maintain stability under open input conditions. If the inputs are left open (pulled to VEE) the Q outputs will go LOW.
265ps Propagation Delay
5ps Skew Between Outputs
High Bandwidth Output Transitions
75kInternal Input Pulldown Resistors
>1000V ESD Protection
LOGIC DIAGRAM AND PINOUT ASSIGNMENT
MC10EL11
MC100EL11
8
1
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751-05
1
Q
0
2
Q
0
3
1
4
Q
1
V
8
CC
D
7
PIN DESCRIPTION
DQ
6
PIN FUNCTION
5
V
EE
D Data Inputs Q0, Q1 Data Outputs
12/93
Motorola, Inc. 1996
3–1
REV 4
MC10EL11 MC100EL11
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = GND)
–40°C 0°C 25°C 85°C
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
I
EE
V
EE
I
IH
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = GND)
Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit
t
PLH
t
PHL
t
SKEW
V
PP
V
CMR
t
r
t
f
1. Within-device skew defined as identical transitions on similar paths through a device.
2. Duty cycle skew is the difference between a TPLH and TPHL propagation delay through a device.
3. Minimum input swing for which AC parameters guaranteed. The device has a DC gain of 40.
4. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within
the specified range and the peak-to-peak voltage lies between VPPmin and 1V . The lower end of the CMR range is dependent on VEE and is equal to VEE + 2.5V.
Power Supply Current
Power Supply Voltage
Input HIGH Current 150 150 150 150 µA
Propagation Delay to Output
Within-Device Skew Duty Cycle Skew
Minimum Input Swing Common Mode Range Output Rise/Fall Times Q
(20% – 80%)
10EL
100EL
10EL
100EL
1
2
262631
31
–4.75 –4.20
3
4
–5.2
–5.5 –5.5
–4.75 –4.20
–4.5
–40°C 0°C 25°C 85°C
135 260 385 185 260 335 190 265 340 215 290 365 ps
5 5
150 150 150 150 mV
–0.4 See4–0.4 See4–0.4 See4–0.4 See4V
100 225 350 100 225 350 100 225 350 100 225 350 ps
262631
–5.2 –4.5
5 5
31
–5.5 –5.5
20 20
–4.75 –4.20
262631
–5.2 –4.5
5 5
31
–5.5 –5.5
20 20
–4.75 –4.20
263031
–5.2 –4.5
5 5
mA
36
–5.5 –5.5
2020ps
V
MOTOROLA ECLinPS and ECLinPS Lite
3–2
DL140 — Rev 3
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE P
MC10EL11 MC100EL11
–T–
–B–
–A–
M
B
58
1
4
M
4X P
J
_
X 45
R
0.25 (0.010)
_
M
G
F
C
SEATING
K
8X D
PLANE
SS
A0.25 (0.010)MTB
NOTES:
1. DIMENSIONS A AND B ARE DATUMS AND T IS A DATUM SURFACE.
2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
3. DIMENSIONS ARE IN MILLIMETER.
4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
6. DIMENSION D DOES NOT INCLUDE MOLD PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
MILLIMETERS
DIM MIN MAX
A 4.80 5.00 B 3.80 4.00 C 1.35 1.75 D 0.35 0.49
F 0.40 1.25 G 1.27 BSC J 0.18 0.25 K 0.10 0.25 M 0 7 P 5.80 6.20 R 0.25 0.50
__
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MC10EL11/D
DL140 — Rev 3
3–3 MOTOROLAECLinPS and ECLinPS Lite
*MC10EL11/D*
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