MOTOROLA MC10E131, MC100E131 Technical data

5 6 7 8 9 10 11

Q

3

Q

3

V

CCO

R

2

CE

2

D

2

R

3

LOGIC DIAGRAM

CE

3

D

3

S

12

V

EE

C

C

S

03

D

0

26

27

28

2

3

4

25 24 23 22 21 20 19

18

17

16

15

14

13

12

Q

2

Q

2

V

CC

Q

1

Q

1

Q

0

Q

0

CE

0

R0D1CE1R1NC V

CCO

D

3

CE

3

R

3

D

2

CE

2

R

2

S

03

S

12

C

C

R

1

CE

1

D

1

R

0

CE

0

D

0

Q

3

Q

3

Q

2

Q

2

Q

1

Q

1

Q

0

Q

0

S

D

Q

Q

R

S

D

Q

Q

R

R

D

Q

Q

S

R

D

Q

Q

S

1

Pinout: 28-Lead PLCC (Top View)

* All VCC and V

CCO

pins are tied together on the die.



SEMICONDUCTOR TECHNICAL DATA

2–1

REV 3

 Motorola, Inc. 1996

7/96

  

The MC10E/100E131 is a quad master-slave D-type flip-flop with
differential outputs. Each flip-flop may be clocked separately by holding
Common Clock (CC) LOW and using the Clock Enable (CE

) inputs for

clocking. Common clocking is achieved by holding the CE

inputs LOW

and using CC to clock all four flip-flops. In this case, the CE

inputs perform

the function of controlling the common clock, to each flip-flop.

Individual asynchronous resets are provided (R). Asynchronous set
controls (S) are ganged together in pairs, with the pairing chosen to
reflect physical chip symmetry.

Data enters the master when both CC and CE

are LOW, and transfers

to the slave when either CC or CE

(or both) go HIGH.

• 1100MHz Min. Toggle Frequency

• Differential Outputs

• Individual and Common Clocks

• Individual Resets (asynchronous)

• Paired Sets (asynchronous)

• Extended 100E V

EE

Range of – 4.2V to – 5.46V

• 75kΩ Input Pulldown Resistors

PIN NAMES

Pin Function

D0– D

3

Data Inputs

CE

0

– CE

3

Clock Enables (Individual)

R0– R

3

Resets

C

C

Common Clock

S03, S

12

Sets (paired)

Q0– Q

3

True Outputs

Q

0

– Q

3

Inverting Outputs





4-BIT

D FLIP-FLOP

FN SUFFIX

PLASTIC PACKAGE

CASE 776-02

查询MC100E131供应商

MC10E131 MC100E131

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

–40°C 0°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Min Typ Max Unit Cond

I

IH

Input HIGH
Current C

C
S

R, CE

D

350
450
300
150

350
450
300
150

350
450
300
150

350
450
300
150

µA

I

IEE

Power Supply
Current 10E

100E

585870

70

585870

70

585870

70

586770

81

mA

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V

CCO

= GND)

–40°C 0°C to 85°C

Symbol Characteristic Min Typ Max Min Typ Max Unit Condition

f

MAX

Maximum Toggle Frequency 1000 1400 1100 1400 MHz

t

PLH

t

PHL

Propagation Delay to Output CE

C

C
R

S

310
275
300
300

600
600
625
550

750
725
775
775

360
325
350
350

500
500
550
550

700
675
725
725

ps

t

S

Setup Time D 200 20 150 20 ps 1

t

H

Hold Time D 225 –20 175 –20 ps 1

t

RR

Reset Recovery Time 450 150 400 150 ps

t

PW

Minimum Pulse Width CLK

R, S

400
400

400
400

ps

t

SKEW

Within-Device Skew 60 60 ps 2

tr/t

f

Rise/Fall Time 275 460 725 300 480 675 ps 20–80%

1. Setup/hold times guaranteed for both CC and CE.

2. Within-device skew is defined as identical transitions on similar paths through a device.

MC10E131 MC100E131

2–3 MOTOROLAECLinPS and ECLinPS Lite

DL140 — Rev 4

OUTLINE DIMENSIONS

FN SUFFIX

PLASTIC PLCC PACKAGE

CASE 776–02

ISSUE D

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.010 (0.250) T L

–M

SNSS

0.007 (0.180) T L

–M

SNSM

0.007 (0.180) T L

–M

SNSM

0.004 (0.100)

SEATING
PLANE

-T-

12.32

12.32

4.20

2.29

0.33

0.66

0.51

0.64

11.43

11.43

1.07

1.07

1.07
—
2

°

10.42

1.02

12.57

12.57

4.57

2.79

0.48

0.81
—
—

11.58

11.58

1.21

1.21

1.42

0.50

10

°

10.92
—

1.27 BSC

A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y

Z
G1
K1

MIN MINMAX MAX

INCHES MILLIMETERS

DIM

NOTES:

1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.

2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.

3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.

4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).

VIEW S

B

U

Z

G1

X

VIEW D-D

H

K

F

VIEW S

G

C

Z

A

R

E

J

0.485

0.485

0.165

0.090

0.013

0.026

0.020

0.025

0.450

0.450

0.042

0.042

0.042
—
2

°

0.410

0.040

0.495

0.495

0.180

0.110

0.019

0.032
—
—

0.456

0.456

0.048

0.048

0.056

0.020

10

°

0.430
—

0.050 BSC

-N-

Y BRK

D

D

W

-M-

-L-

28 1

V

G1

K1

MC10E131 MC100E131

MOTOROLA ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–4

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specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
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MC10E131/D

*MC10E131/D*

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