HP HCPL-553K, HCPL-5531, HCPL-5530, HCPL-550K, HCPL-655K Datasheet

H

Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications

Technical Data

Features

•Dual Marked with Device Part Number and DESC Drawing Number

•Manufactured and Tested on a MIL-PRF-38534 Certified Line

•QML-38534, Class H and K

•Five Hermetically Sealed Package Configurations

•Performance Guaranteed, Over -55°C to +125°C

•High Speed: Typically 400 kBit/s

•9 MHz Bandwidth

•Open Collector Output

•2-18 Volt VCC Range

•1500 Vdc Withstand Test Voltage

•High Radiation Immunity

•6N135, 6N136, HCPL-2530/ -2531, Function Compatibility

•Reliability Data

Applications

•Military and Space

•High Reliability Systems

•Vehicle Command, Control, Life Critical Systems

•Line Receivers

•Switching Power Supply

•Voltage Level Shifting

•Analog Signal Ground Isolation (see Figures 7, 8, and 13)

•Isolated Input Line Receiver

•Isolated Output Line Driver

•Logic Ground Isolation

•Harsh Industrial Environments

•Isolation for Test Equipment Systems

Description

These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.

Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectors

4N55*

5962-87679 HCPL-655X HCPL-553X 5962-90854 HCPL-653X HCPL-550X

*See matrix for available extensions.

improve the speed up to a hundred times that of a conventional phototransistor optocoupler by reducing the base-collector capacitance.

These devices are suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF = 16 mA. The 18 V VCC

Truth Table

(Positive Logic)

Input	Output
On (H)	L
Off (L)	H

Functional Diagram

Multiple Channel Devices

Available

VCC

VB

VO

GND

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

5965-3002E

1-559

capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/ bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers.

These products are also available with the transistor base node connected to improve common mode noise immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request.

Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respectively), 16 pin DIP flat pack (case outline F), and leadless ceramic

chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style.

similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.

Because the same functional die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These

8 Pin Ceramic DIP Single

Channel Schematic

		ICC	8
	2	IF	VCC
	ANODE	IB
	+		7
	VF		VB
		IO	6
	–
			VO
	CATHODE
	3
			5
			GND

Note base pin 7.

Selection Guide–Package Styles and Lead Configuration Options

Package	16 Pin DIP	8 Pin DIP	8 Pin DIP	16 Pin Flat Pack	20 Pad LCCC
Lead Style	Through Hole	Through Hole	Through Hole	Unformed Leads	Surface Mount
Channels	2	1	2	4	2
Common Channel Wiring	None	None	VCC GND	VCC GND	None
HP Part # & Options
Commercial	4N55*	HCPL-5500	HCPL-5530	HCPL-6550	HCPL-6530
MIL-PRF-38534, Class H	4N55/883B	HCPL-5501	HCPL-5531	HCPL-6551	HCPL-6531
MIL-PRF-38534, Class K	HCPL-257K	HCPL-550K	HCPL-553K	HCPL-655K	HCPL-653K
Standard Lead Finish	Gold Plate	Gold Plate	Gold Plate	Gold Plate	Solder Pads
Solder Dipped	Option #200	Option #200	Option #200
Butt Cut/Gold Plate	Option #100	Option #100	Option #100
Gull Wing/Soldered	Option #300	Option #300	Option #300
SMD Part #
Prescript for all below	5962-	5962-	5962-	5962-	5962-
Either Gold or Solder	8767901EX	9085401HPX	8767902PX	8767904FX	87679032X
Gold Plate	8767901EC	9085401HPC	8767902PC	8767904FC
Solder Dipped	8767901EA	9085401HPA	8767902PA		87679032A
Butt Cut/Gold Plate	8767901UC	9085401HYC	8767902YC
Butt Cut/Soldered	8767901UA	9085401HYA	8767902YA
Gull Wing/Soldered	8767901TA	9085401HXA	8767902XA

*JEDEC registered part.

1-560

Functional Diagrams

16 Pin DIP	8 Pin DIP	8 Pin DIP	16 Pin Flat Pack	20 Pad LCCC
Through Hole	Through Hole	Through Hole	Unformed Leads	Surface Mount
2 Channels	1 Channel	2 Channels	4 Channels	2 Channels

1	VB1	16					1		16		15	14
											VCC2	VB2
		1	VCC	8	1	VCC	8
										19			13
2	VOC1	15					2	VCC	15			VO2
						VO1				20			12
		2	VB	7	2		7					GND2
3	VO1	14	VOUT			VO2	3	VO1	14			VCC1
		3		6	3		6			2			10
											VO1
4	GND	13					4	VO2	13	3		VB1	9
		4		5	4		5				GND1
5	VB2	12	GND			GND	5	VO3	12
											7	8
6	VCC2	11					6	VO4	11
7	GND	10					7	GND	10
8	VO2	9					8		9

Note: 8 pin DIP and flat pack devices have common VCC and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated channels with separate VCC and ground connections.

Outline Drawings

16 Pin DIP Through Hole, 2 Channels

	20.06 (0.790)		8.13 (0.320)
	20.83 (0.820)		MAX.
	0.89 (0.035)
	1.65 (0.065)
		4.45 (0.175)
		MAX.
	0.51 (0.020)	3.81 (0.150)	0.20 (0.008)
	MIN.
		MIN.	0.33 (0.
	2.29 (0.090)	0.51 (0.020)	7.36 (0.290)
			7.87 (0.310)
	2.79 (0.110)	MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

Leaded Device Marking

Leadless Device Marking

HP LOGO			HP QYYWWZ				COMPLIANCE INDICATOR,*	HP LOGO
HP P/N			XXXXXX				DATE CODE, SUFFIX (IF NEEDED)	HP P/N
DESC SMD*			XXXXXXX					PIN ONE/
DESC SMD*			XXX USA				COUNTRY OF MFR.	ESD IDENT
PIN ONE/			* 50434				HP FSCN*	COUNTRY OF MFR.
ESD IDENT
	* QUALIFIED PARTS ONLY

		HP QYYWWZ				COMPLIANCE INDICATOR,*
		XXXXXX				DATE CODE, SUFFIX (IF NEEDED)
		* XXXX				DESC SMD*
		XXXXXX				DESC SMD*
		USA 50434				HP FSCN*
		ONLY
*QUALIFIEDPARTS ONLY

1-561

Outline Drawings (contd.)

16 Pin Flat Pack, 4 Channels

7.24 (0.285)

6.99 (0.275) 2.29 (0.090) MAX.

1.27 (0.050) REF.

11.13 (0.438)

10.72 (0.422)

																												0.46 (0.018)
																												0.36 (0.014)
										8.13 (0.320)
2.85 (0.112)															MAX.
MAX.
																							0.88 (0.0345)					0.31 (0.012)
																								MIN.				0.23 (0.009)
0.89 (0.035)												5.23												9.02 (0.355)
0.69 (0.027)
															(0.206)
																					8.76 (0.345)
															MAX.
						NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

20 Terminal LCCC Surface Mount, 2

Channels

1.78 (0.070)

2.03 (0.080)

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

8.70 (0.342)

9.10(0.358)

4.95(0.195)

5.21(0.205)

1.02 (0.040) (3 PLCS)

1.14 (0.045)

1.40 (0.055)

TERMINAL 1 IDENTIFIER 2.16 (0.085)

	1.78 (0.070)	METALIZED
		CASTILLATIONS (20 PLCS)
	2.03 (0.080)

0.64 (0.025) 0.51 (0.020)

(20 PLCS)

1.52 (0.060)

2.03 (0.080)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

SOLDER THICKNESS 0.127 (0.005) MAX.

8 Pin DIP Through Hole, 1 and 2

Channel

	9.40 (0.370)		8.13 (0.320)
	9.91 (0.390)		MAX.
	0.76 (0.030)		7.16 (0.282)
	1.27 (0.050)		7.57 (0.298)
		4.32 (0.170)
		MAX.
	0.51 (0.020)	3.81 (0.150)
	MIN.		0.20 (0.008)
		MIN.
			0.33 (0.013)
			7.36 (0.290)
	2.29 (0.090)	0.51 (0.020)	7.87 (0.310)
	2.79 (0.110)	MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

1-562