H
Hermetically Sealed,
Very High Speed,
Logic Gate Optocouplers
Technical Data
Features
•Dual Marked with Device Part Number and DESC Drawing Number
•Manufactured and Tested on a MIL-PRF-38534 Certified Line
•QML-38534, Class H and K
•Three Hermetically Sealed Package Configurations
•Performance Guaranteed over -55°C to +125°C
•High Speed: 40 M bit/s
•High Common Mode Rejection 500 V/μs Guaranteed
•1500 Vdc Withstand Test Voltage
•Active (Totem Pole) Outputs
•Three Stage Output Available
•High Radiation Immunity
•HCPL-2400/30 Function Compatibility
•Reliability Data
•Compatible with TTL, STTL, LSTTL, and HCMOS Logic Families
Applications
•Military and Space
•High Reliability Systems
•Transportation, Medical, and Life Critical Systems
•Isolation of High Speed Logic Systems
•Computer-Peripheral Interfaces
•Switching Power Supplies
•Isolated Bus Driver (Networking Applications)- (5400/1 Only)
•Pulse Transformer Replacement
•Ground Loop Elimination
•Harsh Industrial Environments
•High Speed Disk Drive I/O
•Digital Isolation for A/D, D/A Conversion
Description
These units are single and dual channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.
HCPL-540X* HCPL-643X 5962-89570 5962-89571 HCPL-543X
*See matrix for available extensions.
Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. This combination results in very high
Truth Tables
(Positive Logic)
Multichannel Devices
Input |
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Output |
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On (H) |
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H |
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Off (L) |
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L |
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Single Channel DIP |
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Input |
Enable |
Output |
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On (H) |
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L |
L |
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Off (L) |
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L |
H |
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On (H) |
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H |
Z |
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Off (L) |
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H |
Z |
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Functional Diagram
Multiple Channel Devices
Available
VCC |
VE |
VO |
GND |
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
1-524 |
5965-3004E |
data rate capability. The detector has a threshold with hysteresis, which typically provides 0.25 mA of differential mode noise immunity and minimizes the potential for output signal chatter. The detector in the single channel units has a three state output stage which eliminates the need for a pull-up resistor and allows for direct drive of a data bus.
All units are compatible with TTL, STTL, LSTTL, and HCMOS logic families. The 35 ns pulse width distortion specification guarantees a 10 MBd signaling rate at +125°C with 35% pulse width
distortion. Figures 13 through 16 show recommended circuits for reducing pulse width distortion and optimizing the signal rate of the product. Package styles for these parts are 8 pin DIP through hole (case outlines P), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style.
Because the same electrical die (emitters and detectors) are used for each channel of each device
listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package |
8 Pin DIP |
8 Pin DIP |
20 Pad LCCC |
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Lead Style |
Through Hole |
Through Hole |
Surface Mount |
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Channels |
1 |
2 |
2 |
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Common Channel |
None |
VCC, GND |
None |
Wiring |
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HP Part # & Options |
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Commercial |
HCPL-5400 |
HCPL-5430 |
HCPL-6430 |
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MIL-PRF-38534, Class H |
HCPL-5401 |
HCPL-5431 |
HCPL-6431 |
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MIL-PRF-38534, Class K |
HCPL-540K |
HCPL-543K |
HCPL-643K |
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Standard Lead Finish |
Gold Plate |
Gold Plate |
Solder Pads |
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Solder Dipped |
Option #200 |
Option #200 |
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Butt Cut/Gold Plate |
Option #100 |
Option #100 |
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Gull Wing/Soldered |
Option #300 |
Option #300 |
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SMD Part # |
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Prescript for all below |
5962- |
5962- |
5962- |
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Either Gold or Solder |
8957001PX |
8957101PX |
89571022X |
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Gold Plate |
8957001PC |
8957101PC |
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Solder Dipped |
8957001PA |
8957101PA |
89571022A |
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Butt Cut/Gold Plate |
8957001YC |
8957101YC |
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Butt Cut/Soldered |
8957001YA |
8957101YA |
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Gull Wing/Soldered |
8957001XA |
8957101XA |
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1-525
Functional Diagrams
8 Pin DIP |
8 Pin DIP |
20 Pad LCCC |
Through Hole |
Through Hole |
Surface Mount |
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1 Channel |
2 Channels |
2 Channels |
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15 |
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1 |
VCC |
8 |
1 |
VCC |
8 |
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VCC2 |
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19 |
VO2 |
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13 |
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VE |
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VO1 |
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2 |
7 |
2 |
7 |
20 |
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12 |
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GND2 |
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3 |
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6 |
3 |
VO2 |
6 |
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VCC1 |
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VO |
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2 |
VO1 |
10 |
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3 |
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4 |
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5 |
4 |
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5 |
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GND |
GND |
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GND1 |
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7 |
8 |
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Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.
Outline Drawings
20 Terminal LCCC Surface Mount, 2 Channels
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8.70 (0.342) |
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9.10 (0.358) |
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4.95 (0.195) |
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1.78 (0.070) |
5.21 (0.205) |
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1.02 (0.040) (3 PLCS) |
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2.03 (0.080) |
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1.14 (0.045) |
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8.70 (0.342) |
1.40 (0.055) |
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9.10 (0.358) |
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4.95 (0.195) |
TERMINAL 1 IDENTIFIER |
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5.21 (0.205) |
2.16 (0.085) |
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1.78 (0.070) |
METALIZED |
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CASTILLATIONS (20 PLCS) |
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2.03 (0.080) |
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0.64 |
0.51 (0.020) |
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(0.025) |
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(20 PLCS) |
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1.52 (0.060) |
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2.03 (0.080) |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370) |
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8.13 (0.320) |
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9.91 (0.390) |
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MAX. |
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0.76 (0.030) |
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7.16 (0.282) |
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1.27 (0.050) |
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7.57 (0.298) |
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4.32 (0.170) |
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MAX. |
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0.51 (0.020) |
3.81 (0.150) |
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MIN. |
0.20 (0.008) |
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MIN. |
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0.33 (0.013) |
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7.36 (0.290) |
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2.29 (0.090) |
0.51 (0.020) |
7.87 (0.310) |
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2.79 (0.110) |
MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-526
Leaded Device Marking |
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Leadless Device Marking |
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HP LOGO |
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HP LOGO |
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HP QYYWWZ |
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COMPLIANCE INDICATOR,* |
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HP QYYWWZ |
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COMPLIANCE INDICATOR,* |
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HP P/N |
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XXXXXX |
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DATE CODE, SUFFIX (IF NEEDED) |
HP P/N |
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XXXXXX |
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DATE CODE, SUFFIX (IF NEEDED) |
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DESC SMD* |
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XXXXXXX |
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PIN ONE/ |
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* XXXX |
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DESC SMD* |
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DESC SMD* |
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XXX USA |
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COUNTRY OF MFR. |
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ESD IDENT |
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XXXXXX |
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DESC SMD* |
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PIN ONE/ |
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* 50434 |
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HP FSCN* |
COUNTRY OF MFR. |
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USA 50434 |
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HP FSCN* |
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ESD IDENT |
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* QUALIFIED PARTS ONLY |
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* QUALIFIED PARTS ONLY |
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Hermetic Optocoupler Options
Option |
Description |
100Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).
4.32 (0.170) MAX.
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0.51 (0.020) |
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1.14 |
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(0.045) |
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MIN. |
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0.20 (0.008) |
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1.40 (0.055) |
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0.33 (0.013) |
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2.29 (0.090) |
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0.51 (0.020) |
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7.36 (0.290) |
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2.79 (0.110) |
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MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES). |
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7.87 (0.310) |
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200Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.
300Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.
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5.57 (0.180) |
5.57 (0.180) |
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MAX. |
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MAX. |
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0.20 (0.008) |
0.51 (0.020) |
1.40 (0.055) |
5° MAX. |
0.33 (0.013) |
MIN. |
1.65 (0.065) |
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2.29 (0.090) |
0.51 (0.020) |
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9.65 (0.380) |
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9.91 (0.390) |
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2.79 (0.110) |
MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-