HP HCPL-6230, HCPL-6251, HCPL-6250, HCPL-623K, HCPL-6231 Datasheet

H

Hermetically Sealed,

Low IF, Wide VCC,

Logic Gate Optocouplers

Technical Data

HCPL-520X* 5962-88768 HCPL-523X HCPL-623X HCPL-625X 5962-88769

*See matrix for available extensions.

Features

•Dual Marked with Device Part Number and DESC Drawing Number

•Manufactured and Tested on a MIL-PRF-38534 Certified Line

•QML-38534, Class H and K

•Four Hermetically Sealed Package Configurations

•Performance Guaranteed over -55°C to +125°C

•Wide VCC Range (4.5 to 20 V)

•350 ns Maximum Propagation Delay

•CMR: > 10,000 V/μs Typical

•1500 Vdc Withstand Test Voltage

•Three State Output Available

•High Radiation Immunity

•HCPL-2200/31 Function Compatibility

•Reliability Data

•Compatible with LSTTL, TTL, and CMOS Logic

Applications

•Military and Space

•High Reliability Systems

•Transportation and Life Critical Systems

•High Speed Line Receiver

•Isolated Bus Driver (Single Channel)

•Pulse Transformer Replacement

•Ground Loop Elimination

•Harsh Industrial Environments

•Computer-Peripheral Interfaces

Description

These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.

Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. The detector has a threshold with hysteresis which provides differential mode noise immunity and

eliminates the potential for output signal chatter. The detector in the single channel units has a tri-state output stage

Truth Tables

(Positive Logic)

Multichannel Devices

Input		Output
On (H)			H
Off (L)			L
Single Channel DIP
Input	Enable		Output
On (H)		H	Z
Off (L)	H		Z
On (H)		L	H
Off (L)		L	L

Functional Diagram

Multiple Channel Devices

Available

VCC

VO

VE

GND

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

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5965-3005E

which allows for direct connection to data buses. The output is noninverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity of up to 10,000 V/μs. Improved power supply rejection eliminates the need for special power supply bypass precautions.

Package styles for these parts are 8 pin DIP through hole (case outline P), 16 pin DIP flat pack (case outline F), and leadless

ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Military drawing (SMD) parts are available for each package and lead style.

Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical

specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.

Selection Guide–Package Styles and Lead Configuration Options

Package	8 Pin DIP	8 Pin DIP	16 Pin Flat Pack	20 Pad LCCC
Lead Style	Through Hole	Through Hole	Unformed Leads	Surface Mount
Channels	1	2	4	2
Common Channel	None	VCC, GND	VCC, GND	None
Wiring
HP Part # & Options
Commercial	HCPL-5200	HCPL-5230	HCPL-6250	HCPL-6230
MIL-PRF-38534, Class H	HCPL-5201	HCPL-5231	HCPL-6251	HCPL-6231
MIL-PRF-38534, Class K	HCPL-520K	HCPL-523K	HCPL-625K	HCPL-623K
Standard Lead Finish	Gold Plate	Gold Plate	Gold Plate	Soldered Pads
Solder Dipped	Option #200	Option #200
Butt Cut/Gold Plate	Option #100	Option #100
Gull Wing/Soldered	Option #300	Option #300
SMD Part #
Prescript for all below	5962-	5962-	5962-	5962-
Either Gold or Solder	8876801PX	8876901PX	8876903FX	88769022X
Gold Plate	8876801PC	8876901PC	8876903FC
Solder Dipped	8876801PA	8876901PA		88769022A
Butt Cut/Gold Plate	8876801YC	8876901YC
Butt Cut/Soldered	8876801YA	8876901YA
Gull Wing/Soldered	8876801XA	8876901XA

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Functional Diagrams

8 Pin DIP	8 Pin DIP	16 Pin Flat Pack	20 Pad LCCC
Through Hole	Through Hole	Unformed Leads	Surface Mount

	1 Channel			2 Channels			4 Channels			2 Channels
						1		16		15
										VCC2
1	VCC	8	1	VCC	8	2	VCC	15
									19	VO2		13
	VO			VO1		3	VO1	14
2		7	2		7				20			12
							VO2	13		GND2
				VO2		4
3		6	3		6						VCC1
	VE					5	VO3	12	2	VO1		10
4		5	4		5	6	VO4	11	3
	GND			GND						GND1
						7	GND	10
						8		9		7	8

Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

Outline Drawings				7.24 (0.285)
							6.99 (0.275)				2.29 (0.090)
16 Pin Flat Pack, 4 Channels
												MAX.

1.27 (0.050) REF.

11.13 (0.438)

10.72 (0.422)

																												0.46 (0.018)
																												0.36 (0.014)
										8.13 (0.320)
2.85 (0.112)															MAX.
MAX.
																							0.88 (0.0345)
																												0.31 (0.012)
																								MIN.				0.23 (0.009)
0.89 (0.035)												5.23												9.02 (0.355)
0.69 (0.027)
															(0.206)
																					8.76 (0.345)
															MAX.
						NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels																			8 Pin DIP Through Hole, 1 and 2 Channel

	8.70 (0.342)	9.40 (0.370)	8.13 (0.320)
	9.10 (0.358)	9.91 (0.390)	MAX.
	4.95 (0.195)	0.76 (0.030)	7.16 (0.282)
	5.21 (0.205)	1.27 (0.050)	7.57 (0.298)
	1.78 (0.070)
		1.02 (0.040) (3 PLCS)
	2.03 (0.080)
		1.14 (0.045)	4.32 (0.170)
	8.70 (0.342)	1.40 (0.055)	MAX.
	9.10 (0.358)

4.95 (0.195)	TERMINAL 1 IDENTIFIER
5.21 (0.205)	2.16 (0.085)	0.51 (0.020)	3.81 (0.150)
		MIN.		0.20 (0.008)
	METALIZED		MIN.
				0.33 (0.013)
1.78 (0.070)
	CASTILLATIONS (20 PLCS)
2.03 (0.080)
0.64	0.51 (0.020)
(0.025)
(20 PLCS)				7.36 (0.290)
1.52 (0.060)		2.29 (0.090)	0.51 (0.020)	7.87 (0.310)
2.03 (0.080)
		2.79 (0.110)	MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.

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Leaded Device Marking

Leadless Device Marking

HP LOGO

HP QYYWWZ

COMPLIANCE INDICATOR,*

HP LOGO

HP QYYWWZ

COMPLIANCE INDICATOR,*

HP P/N

XXXXXX

DATE CODE, SUFFIX (IF NEEDED)

HP P/N

XXXXXX

DATE CODE, SUFFIX (IF NEEDED)

DESC SMD*

XXXXXXX

PIN ONE/

* XXXX

DESC SMD*

DESC SMD*

XXX USA

COUNTRY OF MFR.

ESD IDENT

XXXXXX

DESC SMD*

PIN ONE/

* 50434

HP FSCN*

COUNTRY OF MFR.

USA 50434

HP FSCN*

ESD IDENT

*QUALIFIED PARTS ONLY

*QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

Description

100Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).

4.32 (0.170) MAX.

0.51 (0.020)										1.14					(0.045)
MIN.																										0.20 (0.008)
													1.40 (0.055)
																					0.33 (0.013)
2.29 (0.090)												0.51 (0.020)
																				7.36 (0.290)
2.79 (0.110)													MAX.
			NOTE: DIMENSIONS IN MILLIMETERS (INCHES).																					7.87 (0.310)

200Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.

300Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.

	5.57 (0.180)			5.57 (0.180)
	MAX.			MAX.
			0.20	(0.008)
0.51 (0.020)	1.40 (0.055)	5° MAX.	0.33	(0.
MIN.	1.65 (0.065)
2.29 (0.090)	0.51 (0.020)		9.65	(0.380)
			9.91	(0.390)
2.79 (0.110)	MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

1-515