HP HCPL-5401, HCPL-5400, HCPL-543K, HCPL-643K, HCPL-6431 Datasheet

H

Hermetically Sealed,

Very High Speed,

Logic Gate Optocouplers

Technical Data

Features

•Dual Marked with Device Part Number and DESC Drawing Number

•Manufactured and Tested on a MIL-PRF-38534 Certified Line

•QML-38534, Class H and K

•Three Hermetically Sealed Package Configurations

•Performance Guaranteed over -55°C to +125°C

•High Speed: 40 M bit/s

•High Common Mode Rejection 500 V/μs Guaranteed

•1500 Vdc Withstand Test Voltage

•Active (Totem Pole) Outputs

•Three Stage Output Available

•High Radiation Immunity

•HCPL-2400/30 Function Compatibility

•Reliability Data

•Compatible with TTL, STTL, LSTTL, and HCMOS Logic Families

Applications

•Military and Space

•High Reliability Systems

•Transportation, Medical, and Life Critical Systems

•Isolation of High Speed Logic Systems

•Computer-Peripheral Interfaces

•Switching Power Supplies

•Isolated Bus Driver (Networking Applications)- (5400/1 Only)

•Pulse Transformer Replacement

•Ground Loop Elimination

•Harsh Industrial Environments

•High Speed Disk Drive I/O

•Digital Isolation for A/D, D/A Conversion

Description

These units are single and dual channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.

HCPL-540X* HCPL-643X 5962-89570 5962-89571 HCPL-543X

*See matrix for available extensions.

Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. This combination results in very high

Truth Tables

(Positive Logic)

Multichannel Devices

Input		Output
On (H)			H
Off (L)			L
Single Channel DIP
Input	Enable		Output
On (H)		L	L
Off (L)		L	H
On (H)		H	Z
Off (L)		H	Z

Functional Diagram

Multiple Channel Devices

Available

VCC

VE

VO

GND

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

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5965-3004E

data rate capability. The detector has a threshold with hysteresis, which typically provides 0.25 mA of differential mode noise immunity and minimizes the potential for output signal chatter. The detector in the single channel units has a three state output stage which eliminates the need for a pull-up resistor and allows for direct drive of a data bus.

All units are compatible with TTL, STTL, LSTTL, and HCMOS logic families. The 35 ns pulse width distortion specification guarantees a 10 MBd signaling rate at +125°C with 35% pulse width

distortion. Figures 13 through 16 show recommended circuits for reducing pulse width distortion and optimizing the signal rate of the product. Package styles for these parts are 8 pin DIP through hole (case outlines P), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style.

Because the same electrical die (emitters and detectors) are used for each channel of each device

listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.

Selection Guide–Package Styles and Lead Configuration Options

Package	8 Pin DIP	8 Pin DIP	20 Pad LCCC
Lead Style	Through Hole	Through Hole	Surface Mount
Channels	1	2	2
Common Channel	None	VCC, GND	None
Wiring
HP Part # & Options
Commercial	HCPL-5400	HCPL-5430	HCPL-6430
MIL-PRF-38534, Class H	HCPL-5401	HCPL-5431	HCPL-6431
MIL-PRF-38534, Class K	HCPL-540K	HCPL-543K	HCPL-643K
Standard Lead Finish	Gold Plate	Gold Plate	Solder Pads
Solder Dipped	Option #200	Option #200
Butt Cut/Gold Plate	Option #100	Option #100
Gull Wing/Soldered	Option #300	Option #300
SMD Part #
Prescript for all below	5962-	5962-	5962-
Either Gold or Solder	8957001PX	8957101PX	89571022X
Gold Plate	8957001PC	8957101PC
Solder Dipped	8957001PA	8957101PA	89571022A
Butt Cut/Gold Plate	8957001YC	8957101YC
Butt Cut/Soldered	8957001YA	8957101YA
Gull Wing/Soldered	8957001XA	8957101XA

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Functional Diagrams

8 Pin DIP	8 Pin DIP	20 Pad LCCC
Through Hole	Through Hole	Surface Mount
1 Channel	2 Channels	2 Channels

							15
1	VCC	8	1	VCC	8		VCC2
						19	VO2		13
	VE			VO1
2		7	2		7	20			12
							GND2
3		6	3	VO2	6			VCC1
	VO					2	VO1		10
						3
4		5	4		5
	GND			GND			GND1
							7	8

Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

Outline Drawings

20 Terminal LCCC Surface Mount, 2 Channels

		8.70 (0.342)
		9.10 (0.358)
		4.95 (0.195)
	1.78 (0.070)	5.21 (0.205)
		1.02 (0.040) (3 PLCS)
	2.03 (0.080)
		1.14 (0.045)
	8.70 (0.342)	1.40 (0.055)
	9.10 (0.358)

	4.95 (0.195)	TERMINAL 1 IDENTIFIER
	5.21 (0.205)	2.16 (0.085)
	1.78 (0.070)	METALIZED
		CASTILLATIONS (20 PLCS)
	2.03 (0.080)
	0.64	0.51 (0.020)
	(0.025)
	(20 PLCS)
	1.52 (0.060)
	2.03 (0.080)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

SOLDER THICKNESS 0.127 (0.005) MAX.

8 Pin DIP Through Hole, 1 and 2 Channel

	9.40 (0.370)		8.13 (0.320)
	9.91 (0.390)		MAX.
	0.76 (0.030)		7.16 (0.282)
	1.27 (0.050)		7.57 (0.298)
		4.32 (0.170)
		MAX.
	0.51 (0.020)	3.81 (0.150)
	MIN.		0.20 (0.008)
		MIN.
			0.33 (0.013)
			7.36 (0.290)
	2.29 (0.090)	0.51 (0.020)	7.87 (0.310)
	2.79 (0.110)	MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

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Leaded Device Marking

Leadless Device Marking

HP LOGO

HP LOGO

HP QYYWWZ

COMPLIANCE INDICATOR,*

HP QYYWWZ

COMPLIANCE INDICATOR,*

HP P/N

XXXXXX

DATE CODE, SUFFIX (IF NEEDED)

HP P/N

XXXXXX

DATE CODE, SUFFIX (IF NEEDED)

DESC SMD*

XXXXXXX

PIN ONE/

* XXXX

DESC SMD*

DESC SMD*

XXX USA

COUNTRY OF MFR.

ESD IDENT

XXXXXX

DESC SMD*

PIN ONE/

* 50434

HP FSCN*

COUNTRY OF MFR.

USA 50434

HP FSCN*

ESD IDENT

* QUALIFIED PARTS ONLY

* QUALIFIED PARTS ONLY

Hermetic Optocoupler Options

Option

Description

100Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).

4.32 (0.170) MAX.

0.51 (0.020)										1.14					(0.045)
MIN.																										0.20 (0.008)
													1.40 (0.055)
																					0.33 (0.013)
2.29 (0.090)												0.51 (0.020)
																				7.36 (0.290)
2.79 (0.110)													MAX.
			NOTE: DIMENSIONS IN MILLIMETERS (INCHES).																					7.87 (0.310)

200Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.

300Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.

	5.57 (0.180)		5.57 (0.180)
	MAX.		MAX.
			0.20 (0.008)
0.51 (0.020)	1.40 (0.055)	5° MAX.	0.33 (0.013)
MIN.	1.65 (0.065)
2.29 (0.090)	0.51 (0.020)		9.65 (0.380)
			9.91 (0.390)
2.79 (0.110)	MAX.

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

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