H
Hermetically Sealed,
Low IF, Wide VCC,
Logic Gate Optocouplers
Technical Data
HCPL-520X* 5962-88768 HCPL-523X HCPL-623X HCPL-625X 5962-88769
*See matrix for available extensions.
Features
•Dual Marked with Device Part Number and DESC Drawing Number
•Manufactured and Tested on a MIL-PRF-38534 Certified Line
•QML-38534, Class H and K
•Four Hermetically Sealed Package Configurations
•Performance Guaranteed over -55°C to +125°C
•Wide VCC Range (4.5 to 20 V)
•350 ns Maximum Propagation Delay
•CMR: > 10,000 V/μs Typical
•1500 Vdc Withstand Test Voltage
•Three State Output Available
•High Radiation Immunity
•HCPL-2200/31 Function Compatibility
•Reliability Data
•Compatible with LSTTL, TTL, and CMOS Logic
Applications
•Military and Space
•High Reliability Systems
•Transportation and Life Critical Systems
•High Speed Line Receiver
•Isolated Bus Driver (Single Channel)
•Pulse Transformer Replacement
•Ground Loop Elimination
•Harsh Industrial Environments
•Computer-Peripheral Interfaces
Description
These units are single, dual and quad channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.
Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. The detector has a threshold with hysteresis which provides differential mode noise immunity and
eliminates the potential for output signal chatter. The detector in the single channel units has a tri-state output stage
Truth Tables
(Positive Logic)
Multichannel Devices
Input |
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Output |
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On (H) |
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H |
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Off (L) |
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L |
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Single Channel DIP |
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Input |
Enable |
Output |
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On (H) |
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H |
Z |
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Off (L) |
H |
Z |
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On (H) |
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L |
H |
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Off (L) |
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L |
L |
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Functional Diagram
Multiple Channel Devices
Available
VCC |
VO |
VE |
GND |
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
1-512 |
5965-3005E |
which allows for direct connection to data buses. The output is noninverting. The detector IC has an internal shield that provides a guaranteed common mode transient immunity of up to 10,000 V/μs. Improved power supply rejection eliminates the need for special power supply bypass precautions.
Package styles for these parts are 8 pin DIP through hole (case outline P), 16 pin DIP flat pack (case outline F), and leadless
ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options, see Selection Guide Table for details. Standard Military drawing (SMD) parts are available for each package and lead style.
Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical
specifications, and performance characteristics shown in the figures are identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package |
8 Pin DIP |
8 Pin DIP |
16 Pin Flat Pack |
20 Pad LCCC |
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Lead Style |
Through Hole |
Through Hole |
Unformed Leads |
Surface Mount |
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Channels |
1 |
2 |
4 |
2 |
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Common Channel |
None |
VCC, GND |
VCC, GND |
None |
Wiring |
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HP Part # & Options |
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Commercial |
HCPL-5200 |
HCPL-5230 |
HCPL-6250 |
HCPL-6230 |
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MIL-PRF-38534, Class H |
HCPL-5201 |
HCPL-5231 |
HCPL-6251 |
HCPL-6231 |
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MIL-PRF-38534, Class K |
HCPL-520K |
HCPL-523K |
HCPL-625K |
HCPL-623K |
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Standard Lead Finish |
Gold Plate |
Gold Plate |
Gold Plate |
Soldered Pads |
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Solder Dipped |
Option #200 |
Option #200 |
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Butt Cut/Gold Plate |
Option #100 |
Option #100 |
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Gull Wing/Soldered |
Option #300 |
Option #300 |
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SMD Part # |
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Prescript for all below |
5962- |
5962- |
5962- |
5962- |
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Either Gold or Solder |
8876801PX |
8876901PX |
8876903FX |
88769022X |
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Gold Plate |
8876801PC |
8876901PC |
8876903FC |
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Solder Dipped |
8876801PA |
8876901PA |
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88769022A |
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Butt Cut/Gold Plate |
8876801YC |
8876901YC |
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Butt Cut/Soldered |
8876801YA |
8876901YA |
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Gull Wing/Soldered |
8876801XA |
8876901XA |
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1-513
Functional Diagrams
8 Pin DIP |
8 Pin DIP |
16 Pin Flat Pack |
20 Pad LCCC |
Through Hole |
Through Hole |
Unformed Leads |
Surface Mount |
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1 Channel |
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2 Channels |
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4 Channels |
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2 Channels |
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1 |
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16 |
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15 |
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VCC2 |
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1 |
VCC |
8 |
1 |
VCC |
8 |
2 |
VCC |
15 |
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19 |
VO2 |
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13 |
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VO |
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VO1 |
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3 |
VO1 |
14 |
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2 |
7 |
2 |
7 |
20 |
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12 |
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VO2 |
13 |
GND2 |
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VO2 |
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4 |
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3 |
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6 |
3 |
6 |
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VCC1 |
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VE |
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5 |
VO3 |
12 |
2 |
VO1 |
10 |
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4 |
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5 |
4 |
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5 |
6 |
VO4 |
11 |
3 |
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GND |
GND |
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GND1 |
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7 |
GND |
10 |
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8 |
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9 |
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7 |
8 |
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Note: Multichannel DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 6. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.
Outline Drawings |
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7.24 (0.285) |
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6.99 (0.275) |
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2.29 (0.090) |
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16 Pin Flat Pack, 4 Channels |
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MAX. |
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1.27 (0.050) REF.
11.13 (0.438)
10.72 (0.422)
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0.46 (0.018) |
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0.36 (0.014) |
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8.13 (0.320) |
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2.85 (0.112) |
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MAX. |
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MAX. |
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0.88 (0.0345) |
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0.31 (0.012) |
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MIN. |
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0.23 (0.009) |
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0.89 (0.035) |
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5.23 |
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9.02 (0.355) |
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0.69 (0.027) |
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(0.206) |
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8.76 (0.345) |
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MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES). |
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20 Terminal LCCC Surface Mount, 2 Channels |
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8 Pin DIP Through Hole, 1 and 2 Channel |
8.70 (0.342) |
9.40 (0.370) |
8.13 (0.320) |
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9.10 (0.358) |
9.91 (0.390) |
MAX. |
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4.95 (0.195) |
0.76 (0.030) |
7.16 (0.282) |
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5.21 (0.205) |
1.27 (0.050) |
7.57 (0.298) |
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1.78 (0.070) |
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1.02 (0.040) (3 PLCS) |
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2.03 (0.080) |
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1.14 (0.045) |
4.32 (0.170) |
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8.70 (0.342) |
1.40 (0.055) |
MAX. |
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9.10 (0.358) |
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4.95 (0.195) |
TERMINAL 1 IDENTIFIER |
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5.21 (0.205) |
2.16 (0.085) |
0.51 (0.020) |
3.81 (0.150) |
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MIN. |
0.20 (0.008) |
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METALIZED |
MIN. |
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0.33 (0.013) |
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1.78 (0.070) |
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CASTILLATIONS (20 PLCS) |
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2.03 (0.080) |
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0.64 |
0.51 (0.020) |
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(0.025) |
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(20 PLCS) |
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7.36 (0.290) |
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1.52 (0.060) |
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2.29 (0.090) |
0.51 (0.020) |
7.87 (0.310) |
2.03 (0.080) |
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2.79 (0.110) |
MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.
1-514
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Leaded Device Marking |
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Leadless Device Marking |
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HP LOGO |
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HP QYYWWZ |
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COMPLIANCE INDICATOR,* |
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HP LOGO |
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HP QYYWWZ |
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COMPLIANCE INDICATOR,* |
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HP P/N |
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XXXXXX |
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DATE CODE, SUFFIX (IF NEEDED) |
HP P/N |
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XXXXXX |
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DATE CODE, SUFFIX (IF NEEDED) |
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DESC SMD* |
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XXXXXXX |
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PIN ONE/ |
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* XXXX |
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DESC SMD* |
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DESC SMD* |
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XXX USA |
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COUNTRY OF MFR. |
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ESD IDENT |
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XXXXXX |
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DESC SMD* |
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PIN ONE/ |
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* 50434 |
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HP FSCN* |
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COUNTRY OF MFR. |
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USA 50434 |
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HP FSCN* |
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ESD IDENT |
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*QUALIFIED PARTS ONLY |
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*QUALIFIED PARTS ONLY |
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Hermetic Optocoupler Options |
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Option |
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Description |
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100Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).
4.32 (0.170) MAX.
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0.51 (0.020) |
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1.14 |
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(0.045) |
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MIN. |
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0.20 (0.008) |
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1.40 (0.055) |
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0.33 (0.013) |
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2.29 (0.090) |
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0.51 (0.020) |
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7.36 (0.290) |
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2.79 (0.110) |
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MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES). |
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7.87 (0.310) |
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200Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.
300Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.
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5.57 (0.180) |
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5.57 (0.180) |
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MAX. |
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MAX. |
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0.20 |
(0.008) |
0.51 (0.020) |
1.40 (0.055) |
5° MAX. |
0.33 |
(0. |
MIN. |
1.65 (0.065) |
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2.29 (0.090) |
0.51 (0.020) |
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9.65 |
(0.380) |
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9.91 |
(0.390) |
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2.79 (0.110) |
MAX. |
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NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-515