HP HCPL4503, HCPL4502, HCPL0501, HCPL0500, HCPL0453 Datasheet

H

Single Channel, High Speed

Optocouplers

Technical Data

6N135/6

HCNW135/6

HCNW4502/3 HCPL-0452/3 HCPL-0500/1 HCPL-4502/3

Features

•15 kV/μs Minimum Common Mode Transient Immunity at VCM = 1500 V (4503/0453)

•High Speed: 1 Mb/s

•TTL Compatible

•Available in 8-Pin DIP, SO-8, Widebody Packages

•Open Collector Output

•Guaranteed Performance from Temperature: 0°C to 70°C

•Safety Approval

UL Recognized – 2500 V rms for 1 minute (5000 V rms for 1 minute for HCNW and Option 020 devices) per UL1577

CSA Approved

VDE 0884 Approved

–VIORM = 630 V peak for HCPL-4503#060

–VIORM = 1414 V peak for HCNW devices

BSI Certified (HCNW devices only)

•Dual Channel Version Available (253X/4534/053X/ 0534)

•MIL-STD-1772 Version Available (55XX/65XX/4N55)

Applications

•High Voltage Insulation

•Video Signal Isolation

•Power Transistor Isolation in Motor Drives

•Line Receivers

•Feedback Element in Switched Mode Power Supplies

•High Speed Logic Ground Isolation – TTL/TTL, TTL/ CMOS, TTL/LSTTL

•Replaces Pulse Transformers

•Replaces Slow Phototransistor Isolators

•Analog Signal Ground Isolation

Description

These diode-transistor optocouplers use an insulating layer between a LED and an integrated photodetector to provide electrical insulation between input and output. Separate connections for the photodiode bias and output-transistor collector increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base-collector capacitance.

	Functional Diagram
	NC 1	8	VCC
			*	TRUTH TABLE
	ANODE 2	7		(POSITIVE LOGIC)
			VB
				LED	VO
	CATHODE 3	6	VO	ON	LOW
				OFF	HIGH
	NC 4	5 GND

*NOTE: FOR 4502/3, 0452/3, PIN 7 IS NOT CONNECTED.

A 0.1 μF bypass capacitor must be connected between pins 5 and 8.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

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These single channel optocouplers are available in 8-Pin DIP, SO-8 and Widebody package configurations.

The 6N135, HCPL-0500, and HCNW135 are for use in TTL/ CMOS, TTL/LSTTL or wide bandwidth analog applications. Current transfer ratio (CTR) for these devices is 7% minimum at IF = 16 mA.

The 6N136, HCPL-0501, and HCNW136 are designed for high speed TTL/TTL applications. A standard 16 mA TTL sink current through the input LED will provide enough output current for 1 TTL load and a 5.6 kΩ pullup resistor. CTR for these devices is 19% minimum at IF = 16 mA.

The HCPL-4502, HCPL-0452, and HCNW4502 provide the electrical and switching performance of the 6N136, HCPL-0501, and HCNW136 with increased ESD protection.

The HCPL-4503, HCPL-0453, and HCNW4503 are similar to the HCPL-4502, HCPL-0452, and HCNW4502 optocouplers but have increased common mode transient immunity of 15 kV/μs minimum at VCM = 1500 V guaranteed.

Selection Guide

							Widebody
Minimum CMR			8-Pin DIP (300 Mil)		Small-Outline SO-8		(400 Mil)	Hermetic
		Current	Single	Dual	Single	Dual	Single	Single and
dV/dt	VCM	Transfer	Channel	Channel	Channel	Channel	Channel	Dual Channel
(V/μs)	(V)	Ratio (%)	Package	Package*	Package	Package*	Package	Packages*
1,000	10	7	6N135	HCPL-2530	HCPL-0500	HCPL-0530	HCNW135
		19	6N136	HCPL-2531	HCPL-0501	HCPL-0531	HCNW136
			HCPL-4502†		HCPL-0452†		HCNW4502†
15,000	1500	19	HCPL-4503†	HCPL-4534	HCPL-0453†	HCPL-0534	HCNW4503†
1,000	10	9						HCPL-55XX
								HCPL-65XX
								4N55

*Technical data for these products are on separate HP publications. †Pin 7, transistor base, is not connected.

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Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

HCPL-4503#XXX

020 = UL 5000 V rms/1 Minute Option*

060 = VDE 0884 VIORM = 630 V peak Option** 300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information.

*For 6N135/6 and HCPL-4502/3 only.

**For HCPL-4503 only. Combination of Option 020 and Option 060 is not available. †Gull wing surface mount option applies to through hole parts only.

Schematic

		ICC	8
			VCC
2	IF
ANODE
+
VF		IO	6
–
			VO
CATHODE
3
SHIELD			5
			GND
HCPL-4503/0453
HCNW4503		IB
	7	*
	VB

*NOTE: FOR HCPL-4502/-3, HCPL-0452/3, HCNW4502/3, PIN 7 IS NOT CONNECTED.

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Package Outline Drawings

8-Pin DIP Package (6N135/6, HCPL-4502/3)

9.65 ± 0.25

(0.380 ± 0.010)

TYPE NUMBER

8

7

6

5

OPTION CODE*

HP XXXXZ

DATE CODE

YYWW

UR

UL

1

2

3

4

RECOGNITION

1.19 (0.047) MAX.

1.78 (0.070) MAX.

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

1.080 ± 0.320

0.65 (0.025) MAX.

(0.043 ± 0.013)

2.54 ± 0.25

(0.100 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

5° TYP.				0.254	+ 0.076
					- 0.051
			(0.010		+ 0.003)
					- 0.002)

DIMENSIONS IN MILLIMETERS AND (INCHES).

* MARKING CODE LETTER FOR OPTION NUMBERS. "L" = OPTION 020

"V" = OPTION 060

OPTION NUMBERS 300 AND 500 NOT MARKED.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N135/6, HCPL-4502/3)

																													PAD LOCATION (FOR REFERENCE ONLY)
							9.65 ± 0.25																																	1.016 (0.040)
						(0.380 ± 0.010)
																																															1.194 (0.047)
			8					7							6				5
																																																										4.826					TYP.
																																																										(0.190)
																									6.350 ± 0.25
																									(0.250 ± 0.010)																																						9.398 (0.370)
																																																															9.906 (0.390)
		1				2							3					4
																																																																0.381 (0.015)
																													1.194 (0.047)																																			0.635 (0.025)
																													1.778 (0.070)
																		1.780											9.65 ± 0.25
1.19																						(0.070)																						(0.380 ± 0.010)
																								MAX.																					7.62 ± 0.25
(0.047)
																																									(0.300 ± 0.010)
MAX.																																																																			+ 0.076
																																																																	0.254
																																																																			- 0.051
																									4.19			MAX.																																			(0.010				+ 0.003)
																		(0.165)
																																																																			- 0.002)

1.080	± 0.320
																								0.635 ± 0.25
(0.043	± 0.013)
																						(0.025 ± 0.010)								12° NOM.
							2.54						0.635		± 0.130
	(0.100)												(0.025		± 0.005)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

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Small Outline SO-8 Package (HCPL-0500/1, HCPL-0452/3)

										8				7					6			5
																								5.842 ± 0.203
																		XXX				(0.236 ± 0.008)
3.937	± 0.127																														TYPE NUMBER
																	YWW
(0.155	± 0.005)
																															(LAST 3 DIGITS)
																															DATE CODE
										1				2					3			4
0.381	± 0.076
(0.016	± 0.003)																											1.270		BSG
																						(0.050)
											5.080 ± 0.127																			7°				45° X		0.432
											(0.200 ± 0.005)																									(0.017)

3.175 ± 0.127

(0.125 ± 0.005) 1.524

(0.060)

0.152 ± 0.051

(0.006 ± 0.002)

DIMENSIONS IN MILLIMETERS (INCHES).	0.305	MIN.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).	(0.012)

0.228 ± 0.025

(0.009 ± 0.001)

8-Pin Widebody DIP Package (HCNW135/6, HCNW4502/3)

						11.15 ± 0.15																						11.00
					(0.442 ± 0.006)																							(0.433) MAX.
																											9.00 ± 0.15
	8						7				6				5								(0.354 ± 0.006)
																				TYPE NUMBER
									HP											DATE CODE
					HCNWXXXX
									YYWW
	1						2				3				4
																										10.16 (0.400)
																												TYP.

1.55

(0.061)

MAX. 7° TYP. 0.254 + 0.076 - 0.0051

+ 0.003) (0.010 - 0.002)

																																					5.10 MAX.
																																			(0.201)
																														3.10 (0.122)
																															3.90 (0.154)				0.51 (0.021) MIN.
	2.54 (0.100)
	TYP.
1.78	± 0.15																						0.40 (0.016)														DIMENSIONS IN MILLIMETERS (INCHES).
(0.070	± 0.006)																												0.56 (0.022)

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8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6, HCNW4502/3)

						11.15 ± 0.15																	PAD LOCATION (FOR REFERENCE ONLY)
					(0.442 ± 0.006)
																	5
	8						7				6
																																							6.15			TYP.
																																							(0.242)
																				9.00 ± 0.15
																				(0.354 ± 0.006)
																																										12.30 ± 0.30
																																										(0.484 ± 0.012)
	1						2				3					4
																																							0.9
															1.3

(0.051)	(0.035)

1.78 ± 0.15

(0.070 ± 0.006)

																			1.55														12.30 ± 0.30
																						(0.061)																		(0.484 ± 0.012)
																							MAX.																		11.00 MAX.
																																			(0.433)
																								4.00				MAX.
																							(0.158)																1.00 ± 0.15
																	2.54											0.75 ± 0.25								(0.039 ± 0.006)																+ 0.076
(0.100)																												(0.030 ± 0.010)																							0.254 - 0.0051
																	BSC																																		(0.010	+ 0.003)
DIMENSIONS IN MILLIMETERS (INCHES).																																																				- 0.002)
																																																7° NOM.

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

Solder Reflow Temperature Profile (HCPL-0500/1, HCPL-0452/3, and Gull Wing Surface Mount Option Parts)

TEMPERATURE – °C

260

240

T = 145°C, 1°C/SEC

220

T = 115°C, 0.3°C/SEC

200

180

160

140

120

100

80

T = 100°C, 1.5°C/SEC

60

40

20

0

0

1

2

3

4

5

6

7

8

9

10

11

12

TIME – MINUTES

Note: Use of Non-Chlorine Activated Fluxes is Recommended.

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