HP HCPL-2730, HCPL-4701, HCPL-2731, HCPL-073A, HCPL-0731 Datasheet

Low Input Current, High Gain

Optocouplers

Technical Data

6N139	6N138
HCPL-0701	HCPL-0700
HCNW139	HCNW138

Features

•High Current Transfer Ratio

– 2000% Typical (4500% Typical for HCNW139/138)

•Low Input Current Requirements – 0.5 mA

•TTL Compatible Output – 0.1 V VOL Typical

•Performance Guaranteed over Temperature 0°C to 70°C

•Base Access Allows Gain Bandwidth Adjustment

•High Output Current – 60 mA

•Safety Approval

UL Recognized – 2500 V rms for 1 Minute and 5000 V rms* for 1 Minute per UL 1577

CSA Approved

VDE 0884 Approved with

VIORM = 1414 V peak for HCNW139 and HCNW138

BSI Certified (HCNW139 and HCNW138)

•Available in 8-Pin DIP or SOIC-8 Footprint or Widebody Package

•MIL-STD-1772 Version

Available (HCPL-5700/1)

Applications

•Ground Isolate Most Logic Families – TTL/TTL, CMOS/ TTL, CMOS/CMOS, LSTTL/ TTL, CMOS/LSTTL

•Low Input Current Line Receiver

•High Voltage Insulation (HCNW139/138)

•EIA RS-232C Line Receiver

•Telephone Ring Detector

•117 V ac Line Voltage Status Indicator – Low Input Power Dissipation

•Low Power Systems – Ground Isolation

Functional Diagram

NC	1	8	VCC
ANODE	2	7	VB
CATHODE	3	6	VO
NC	4	5	GND

Description

These high gain series couplers use a Light Emitting Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage result in TTL compatible saturation voltages and high speed operation. Where desired the VCC and VO terminals may be tied together to achieve conventional photodarlington operation. A base access terminal allows a gain bandwidth adjustment to be made.

TRUTH TABLE

LED	VO
ON	LOW
OFF	HIGH

*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only. A 0.1 μF bypass capacitor connected between pins 8 and 5 is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

2

The 6N139, HCPL-0701, and CNW139 are for use in CMOS, LSTTL or other low power applications. A 400% minimum current transfer ratio is guaranteed over 0 to 70°C operating range for only 0.5 mA of LED current.

The 6N138, HCPL-0700, and HCNW138 are designed for use mainly in TTL applications. Current Transfer Ratio (CTR) is 300% minimum over 0 to 70°C for an LED current of 1.6 mA

(1 TTL Unit load ). A 300% minimum CTR enables operation with 1 TTL Load using a 2.2 kΩ pull-up resistor.

Selection for lower input current down to 250 μA is available upon request.

The HCPL-0701 and HCPL-0700 are surface mount devices packaged in an industry standard SOIC-8 footprint.

The SOIC-8 does not require “through holes” in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes.

The HCNW139 and HCNW138 are packaged in a widebody encapsulation that provides creepage and clearance dimensions suitable for safety approval by regulatory agencies worldwide.

Selection Guide

				Widebody
8-Pin DIP				Package				Hermetic
(300 Mil)		Small Outline SO-8		(400 mil)				Single and
					Minimum		Absolute	Dual
	Dual	Single	Dual
Single	Channel	Channel	Channel	Single	Input ON		Maxi-	Channel
Channel	Package	Package	Package	Channel	Current	Minimum	mum	Packages
Package	HCPL-	HCPL-	HCPL-	Package	(IF)	CTR	VCC	HCPL-
6N139	2731[1]	0701	0731	HCNW139	0.5 mA	400%	18 V
6N138	2730[1]	0700	0730	HCNW138	1.6 mA	300%	7 V
HCPL-4701[1]	4731[1]	070A[1]	073A[1]		40 μA	800%	18 V
					0.5 mA	300%	20 V	5701[1]
								5700[1]
								5731[1]
								5730[1]

Note:

1. Technical data are on separate HP publications.

3

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

6N139#XXX

020 = 5000 V rms/1 Minute UL Rating Option*

300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for information.

*For 6N139 and 6N138 only.

†Gull wing surface mount option applies to through hole parts only.

Schematic

	VCC
	8
	ICC
2	IF
ANODE
+
VF
–
CATHODE	IO 6
3

VO

5

GND

SHIELD

IB

7

VB

4

Package Outline Drawings

8-Pin DIP Package (6N139/6N138)**

9.65 ± 0.25

(0.380 ± 0.010)

TYPE NUMBER

8

7

6

5

OPTION CODE*

HP XXXXZ

DATE CODE

YYWW

UR

UL

1

2

3

4

RECOGNITION

1.19 (0.047) MAX.

1.78 (0.070) MAX.

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

1.080 ± 0.320

0.65 (0.025) MAX.

(0.043 ± 0.013)

2.54 ± 0.25

(0.100 ± 0.010)

**JEDEC Registered Data.

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

5° TYP.				0.254	+ 0.076
					- 0.051
			(0.010		+ 0.003)
					- 0.002)

DIMENSIONS IN MILLIMETERS AND (INCHES).

*MARKING CODE LETTER FOR OPTION NUMBERS "L" = OPTION 020

OPTION NUMBERS 300 AND 500 NOT MARKED.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)

																													PAD LOCATION (FOR REFERENCE ONLY)
							9.65 ± 0.25																																	1.016 (0.040)
						(0.380 ± 0.010)
																																															1.194 (0.047)
			8					7							6				5
																																																										4.826					TYP.
																																																										(0.190)
																									6.350 ± 0.25
																									(0.250 ± 0.010)																																						9.398 (0.370)
																																																															9.906 (0.390)
		1				2							3					4
																																																																0.381 (0.015)
																													1.194 (0.047)																																			0.635 (0.025)
																													1.778 (0.070)
																		1.780											9.65 ± 0.25
1.19																						(0.070)																						(0.380 ± 0.010)
																								MAX.																					7.62 ± 0.25
(0.047)
																																									(0.300 ± 0.010)
MAX.																																																																	0.254		+ 0.076
																																																																			- 0.051
																									4.19			MAX.																																			(0.010				+ 0.003)
																		(0.165)
																																																																			- 0.002)

1.080	± 0.320
																									0.635 ± 0.25
(0.043	± 0.013)
																							(0.025 ± 0.010)								12° NOM.
							2.54						0.635		± 0.130
	(0.100)												(0.025		± 0.005)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

5

Small Outline SO-8 Package (HCPL-0701/HCPL-0700)

8

7

6

5

5.994 ± 0.203

XXX

(0.236 ± 0.008)

3.937 ± 0.127

TYPE NUMBER

YWW

(0.155 ± 0.005)

(LAST 3 DIGITS)

DATE CODE

PIN ONE

1

2

3

4

0.406 ± 0.076

1.270 BSG

(0.016 ± 0.003)

(0.050)

* 5.080 ± 0.127

7°

45° X

0.432

(0.200 ± 0.005)

(0.017)

3.175 ± 0.127

0 ~ 7°

(0.125 ± 0.005)

1.524

(0.060)

0.203 ± 0.102

(0.008 ± 0.004)

	* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)	0.305	MIN.
	5.207 ± 0.254 (0.205 ± 0.010)	(0.012)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

0.228 ± 0.025

(0.009 ± 0.001)

8-Pin Widebody DIP Package (HCNW139/HCNW138)

						11.15 ± 0.15																							11.00
					(0.442 ± 0.006)																								(0.433) MAX.
																												9.00 ± 0.15
	8						7				6				5									(0.354 ± 0.006)
																				TYPE NUMBER
									HP											DATE CODE
					HCNWXXXX
									YYWW
	1						2				3				4
																											10.16 (0.400)
																													TYP.

1.55

(0.061)

MAX. 7° TYP. 0.254 + 0.076 - 0.0051

+ 0.003) (0.010 - 0.002)

																																					5.10 MAX.
																																			(0.201)
																														3.10 (0.122)
																															3.90 (0.154)				0.51 (0.021) MIN.
	2.54 (0.100)
	TYP.
1.78	± 0.15																						0.40 (0.016)														DIMENSIONS IN MILLIMETERS (INCHES).
(0.070	± 0.006)																												0.56 (0.022)