HIT 2SK3141 Datasheet
2SK3141
Silicon N Channel MOS FET
High Speed Power Switching
Features
• Low on-resistance
R
= 4 mΩ typ.
DS(on)
• Low drive current
• 4 V gate drive device can be driven from 5 V source
Outline
ADE-208-680B (Z)
3rd. Edition
February 1999
TO–220AB
G
D
3
1. Gate
2. Drain(Flange)
3. Source
1
2
S
2SK3141
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Avalanche current I
Avalanche energy E
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note 3
AP
Note 3
AR
Note 2
Note 1
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10 µs, duty cycle ≤ 1%
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50 Ω
30 V
±20 V
75 A
300 A
75 A
35 A
122 mJ
100 W
2
2SK3141
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source leak current I
Zero gate voltege drain current I
Gate to source cutoff voltage V
Static drain to source on state R
(BR)DSS
GSS
DSS
GS(off)
DS(on)
30——V I
——±0.1 µAVGS = ±20 V, VDS = 0
——10µAVDS = 30 V, VGS = 0
1.0 — 2.5 V ID = 1 mA, VDS = 10 V
— 4.0 5.0 mΩ ID = 40 A, VGS = 10 V
resistance — 5.5 8.5 mΩ ID = 40 A, VGS = 4 V
Forward transfer admittance |yfs|5080—S ID = 40 A, VDS = 10 V
Input capacitance Ciss — 6800 — pF VDS = 10 V
Output capacitance Coss — 1550 — pF VGS = 0
Reverse transfer capacitance Crss — 500 — pF f = 1 MHz
Total gate charge Qg — 130 — nc VDD = 10 V
Gate to source charge Qgs — 16 — nc VGS = 10 V
Gate to drain charge Qgd — 30 — nc ID = 75 A
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body–drain diode forward voltage V
Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
— 50 — ns VGS = 10 V, ID = 40 A
— 370 — ns RL = 0.25 Ω
— 550 — ns
— 380 — ns
— 1.05 — V IF = 75 A, VGS = 0
— 80 — ns IF = 75 A, VGS = 0
recovery time
Note: 1. Pulse test
= 10 mA, VGS = 0
D
diF/ dt = 50 A/ µs
Note 1
Note 1
Note 1
Note 1
3
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