TOSHIBA TLPGE19TPF, TLFGE19TPF, TLGE19TPF, TLPYE19TPF Technical data

TLGE19TPF

TLPGE19TP(F),TLFGE19TP(F),TLGE19TP(F),TLPYE19TP(F)

TOSHIBA InGaAℓP LED

TLPGE19TP(F),TLFGE19TP(F),TLGE19TP(F),TLPYE19TP(F)

Panel Circuit Indicator

•Lead(Pb)-free products (lead: Sn-Ag-Cu)

•5mm package

•InGaAℓP technology

•All plastic mold type

•Transparent lens

•Lineup: 3colors (pure green, green, pure yellow)

•High intensity light emission

•Excellent low current light output

•Applications: Traffic signals, Safety equipment, Backlight

•Stopper lead type is also available

TLPGE19T(F), TLFGE19T(F), TLGE19T(F), TLPYE19T(F)

Lineup

	Product Name	Color	Material
	TLPGE19TP(F)	Pure Green
	TLFGE19TP(F)	Green	InGaAlP
	TLGE19TP(F)	Green
	TLPYE19TP(F)	Pure Yellow

Unit: mm

JEDEC ―

JEITA

―

TOSHIBA 4-5AM2

Weight: 0.31 g(Typ.)

Absolute Maximum Ratings (Ta = 25°C)

		Forward Current	Reverse Voltage	Power Dissipation	Operating	Storage
	Product Name				Temperature	Temperature
		IF (mA)	VR (V)	PD (mW)
					Topr (°C)	Tstg (°C)
	TLPGE19TP(F)	50	4	120
	TLFGE19TP(F)	50	4	120	−40~100	−40~120
	TLGE19TP(F)	50	4	120
	TLPYE19TP(F)	50	4	120

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).

1	2007-10-01

TLPGE19TP(F),TLFGE19TP(F),TLGE19TP(F),TLPYE19TP(F)

Electrical and Optical Characteristics (Ta = 25°C)

	Typ. Emission Wavelength				Luminous Intensity					Forward Voltage				Reverse Current
Product Name							IV					VF			IR
	λd	λP	Δλ	IF	Min		Typ.		IF	Typ.		Max	IF	Max		VR
TLPGE19TP(F)	558	(562)	14	20	153		500	20		2.1		2.4	20	50		4
TLFGE19TP(F)	565	(568)	15	20	272		800	20		2.0		2.4	20	50		4
TLGE19TP(F)	571	(574)	17	20	476		1300	20		2.0		2.4	20	50		4
TLPYE19TP(F)	580	(583)	14	20	476		2000	20		2.0		2.4	20	50		4
Unit		nm		mA		mcd			mA		V		mA	μA		V

Precautions

Please be careful of the following:

•Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: up to 1.6 mm from the body of the device)

•If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to the resin. Soldering should be performed after lead forming.

•This visible LED lamp also emits some IR light.

If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.

2	2007-10-01

TLPGE19TP(F),TLFGE19TP(F),TLGE19TP(F),TLPYE19TP(F)

TLPGE19TP(F)

Forward current IF (mA)

Relative luminous intensity IV

100								IF – VF													5000								IV – IF
50		Ta = 25°C																		(mcd)			Ta = 25°C
30																				V	1000
																				I
10																				intensity	100
5																				Luminous
3
1																					10
		1.7			1.8			1.9		2.0		2.1				2.2		2.3					3			5		10					30		50		100
1.6																					1
					Forward voltage							VF (V)												Forward current IF									(mA)

10	IV – Tc		1.0	Relative luminous intensity – Wavelength
					IF = 20 mA
5		intensity	0.8		Ta = 25°C
3
		luminous	0.6
0.5			0.4
1		Relative
0.3			0.2

0.1	0		20		40		60		80		0	540	560	580		600	620	640
−20											520
	Case temperature				Tc	(°C)							Wavelength		λ	(nm)
		Radiation pattern												IF – Ta
											80
						Ta = 25°C
										(mA)
										F	60
										I
		20°	10°	0°	10°	20°				current
	30°						30°
40°											40
								40°		forward
50°								50°
60°									60°
										Allowable	20
70°									70°
80°									80°
90°				0	0.2	0.4	0.6	0.8	90°		0	20	40	60		80	100	120
									1.0		0
												Ambient temperature				Ta	(°C)
										3								2007-10-01