TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
TOSHIBA PHOTOCOUPLER
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
ATTACHMENT |
: SPECIFICATIONS FOR VDE0884 OPTION: (D4) |
Types |
: TLP721, TLP721F, TLP733, TLP733F, TLP734, TLP734F, TLP747G, TLP747GF, TLP747J, |
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TLP747JF |
This data sheet refers to black mold-resin devices, TLPxxx (D4xxx, M) that previously has a white-resin mold and have been changed. When designing new products please use black mold-resin devices.
Type designations for 'Option: (D4)', which are tested under VDE0884 requirements. |
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Ex. : TLP734F (D4-GR-LF4, M) |
D4 |
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VDE0884 option |
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GR |
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CTR rank name |
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LF4 : |
standard lead bend name |
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M |
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black mold-resin devices |
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Note : Use Toshiba standard type number for safety standard application. |
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Ex. TLP734(FD4-GR-LF4, M) → TLP734F |
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VDE0884 ISOLATION CHARACTERISTICS |
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DESCRIPTION |
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SYMBOL |
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RATING |
UNIT |
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Application Classification (DIN VDE0110 Teil 2 / 01.89, Table 1) |
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for rated mains voltage ≤ 300 VRMS |
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I- IV |
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for rated mains voltage ≤ 600 VRMS |
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I- III |
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Climatic Classification (DIN IEC68 Teil 1 / 09.80) |
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40 / 100 / 21 |
― |
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Pollution Degree (DIN VDE0110 Teil 2 / 01.89) |
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2 |
― |
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Maximum Operating Insulation Voltage |
TLPxxx |
type |
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VIORM |
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890 |
Vpk |
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TLPxxxF |
type |
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1130 |
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Input to output Test Voltage, Method A |
TLPxxx |
type |
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Vpr |
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1335 |
Vpk |
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Vpr = 1.5 × VIORM, Type and Sample Test |
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TLPxxxF |
type |
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1695 |
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tp = 60s, Partial Discharge < 5pC |
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Input to output Test Voltage, Method B |
TLPxxx |
type |
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Vpr |
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1670 |
Vpk |
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Vpr = 1.875 × VIORM, 100% Production Test |
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TLPxxxF |
type |
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2120 |
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tp = 1s, Partial Discharge < 5pC |
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Highest Permissible Overvoltage (Transient Overvoltage, tpr = 10s) |
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VTR |
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8000 |
Vpk |
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Safety Limiting Values (Max. permissible ratings in case of fault, also refer to |
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thermal derating curve) |
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Current (Input current IF, Psi = 0) |
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Isi |
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400 |
mA |
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Power (Output or Total Powr Dissipation) |
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Psi |
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700 |
mW |
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Temperature |
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Tsi |
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150 |
°C |
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Insulation Resistance, VIO = 500V, Ta = 25°C |
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Rsi |
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≥1012 |
Ω |
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VIO = 500V, Ta = Tsi |
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≥109 |
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1 |
2001-05-14 |
TLP721(D4,M)SERIES,TLP733(D4,M)SERIES,TLP747(D4,M)SERIES
INSULATION RELATED SPECIFICATIONS
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7.62mm pitch |
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10.16mm pitch |
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TLPxxx type |
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TLPxxxF type |
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Minimum Creepage Distance (*) |
Cr |
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7.0 mm |
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8.0 mm |
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Minimun Clearance (*) |
Cl |
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7.0 mm |
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8.0 mm |
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Minimum Insulation Thickness |
ti |
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0.5 mm |
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Comperative Tracking Index |
CTI |
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175 |
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(DIN IEC112 / VDE0303, Part 1) |
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(VDE0110 Teil 2 / 01.89 Group IIIa) |
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*: |
in accordance with DIN VDE0110 Teil 1 / 01.89, Table 2, & 4 |
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1.If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value (e. g. at a standard distance between soldering eye centres of 7.5mm). If this is not permissible, the user shall take suitable measures.
2.This photocoupler is suitable for 'safe electrical isolation' only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits.
TLP721 SERIES |
TLP733 SERIES |
TLP747 SERIES |
2 |
2001-05-14 |
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