Sony MHC-V11 Service Manual

MHC-V11

SERVICE MANUAL

Ver. 1.2 2016.05

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS

POWER OUTPUT AND TOTAL HARMONIC DISTORTION: (The United States model only)

Left/Right Channel: With 3ohms loads, both channels driven, from 120 30watts per channel minimum RMS power, with no more than

0.7% total harmonic distortion from 250milliwatts to rated output.

10,000Hz; rated

–

Speaker section

Speaker system:

Tweeter + Woofer

Tweeter L/R:

50 mm (2in), c one type

Woofer:

200 mm (7  in),

cone type

Inputs

AUDIO/PARTY CHAIN IN L/R:

Voltage 2 V, impedance 10kilohms

MIC 1, MIC 2:

Sensitivity 1 mV, impedance 10kilohms

Outputs

AUDIO/PARTY CHAIN OUT L/R:

V V, impedance 600 ohmsoltage 2

Disc player section

System:

Compact disc and digital audio system

Laser Diode Properties

Emission Duration: Continuous Laser Output*: Less than 44.6μW

* This output is the value

measurement at a distance of 200mm from the objective lens surface on the Optical Pick-up Block with 7mm aperture.

USB section

(USB) port:

Type A, maximum current 1 A

Supported audio formats (MP3 discs and USB devices only)

Supported bit rate:

MP3 (MPEG1 Audio Layer- 3): 32kbps

320kbps, VBR

WMA*: 32kbps

Sampling frequencies:

MP3 (MPEG1 Audio Layer-3): 32/44.1/48 kHz WMA*: 44.1 kHz

* USB devices only

192kbps, VBR

Tuner section

FM stereo

FM superheterodyne tuner

Antenna:

FM lead antenna

FM tuner section:

Tuning range: North American model: 87.5MHz –

108.0MHz (100kHz step) Other models: 87.5MHz – 108.0MHz (50kHz step)

BLUETOOTH section

Communication system:

BLUETOOTH Standard version 3.0

Output:

BLUETOOTH Standard Power Class 2

Maximum communication range:

Line of sight approx. 10 m (33 feet)

Frequency band:

2.4 GHz band (2.4000 GHz –

2.4835 GHz)

Modulation method:

FHSS (Freq Hopping Spread Spectrum)

Compatible BLUETOOTH proles

A2DP (Advanced Audio Distribution Prole) AVRCP (Audio Video Remote Control Prole) SPP (Serial Port Prole)

Supported codecs:

SBC (Sub Band Codec) AAC (Advanced Audio Coding) LDAC

US Model

Canadian Model

AEP Model

UK Model

Australian Model

Model Name Using Similar Mechanism NEW Mechanism Type TDL-5W

The actual range will vary depending

on factors such as obstacles between devices, magnetic elds around a microwave oven, static electricity, reception sensitivity, antenna’s performance, operating system, software application, etc.

BL UETOOTH standard proles indicate the

purpose of BLUETOOTH communication between devices.

General

Power requirements:

North American model: AC 120V , 60 Hz Other models: AC 120V 50/60Hz

Power consumption:

45 W Standby power consumption (at the Standby Mode):

When BLUETOOTH standby mode is

set to o: 0.5 W (eco mode)

When BLUETOOTH standby mode is

set to on: 2.8 W (all wireless network

ports on) Dimensions (W/H/D) (Approx.):

290 mm × 600 mm × 265 mm

Mass (Approx.):

Quantity of the system:

1 piece Supplied accessories:

Remote control (1)

R03 (size AAA) batteries* (2)

RU model:

* Рекомендуемый срок годности

указан на о трицательной стороне батарейки.

FM lead antenna (1)

AC power cord (1)

AC plug adaptor* (1) (E4, LA, SP6)

(supplied only for certain areas)

* This plug adaptor is not for the use

in Chile, Paraguay and Uruguay. Use this plug adaptor in the countries where it is necessary.

240V ,

RU model (RUSSIAN): Условия хранения:

Товары сохраняют в упакованном виде в темных, сухих, чистых, хорошо вентилируемых помещениях, изолированных от мест хранения кислот и щелочей. Температура хранения: от -10°C до + 45°C Относительная влажность хранения: от 30% до 70% Рабочая температура: от 5°C до 35°C Рабочая относительная влажность:

от 30% до 70% RU model (UKRAINIAN): Умови зберігання:

Продукцію зберігають в

упакованому виді в темних, сухих,

чистих, добре вентильованих

приміщеннях, ізольованих від

місць зберігання кислот і лугів.

Температура зберігання:

від -10°C до + 45°C

Відносна вологість зберігання:

від 30% до 70%

Робоча температура:

від 5°C до 35°C

Робоча відносна вологість:

від 30% до 70%

Design and specications are subject to change without notice.

HOME AUDIO SYSTEM

E Model

9-896-262-03

2016E33-1

2016.05

Sony Video & Sound Products Inc.

Published by Sony Techno Create Corporation

MHC-V11

Ver. 1.2

License and Trademark Notice

• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.

• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries.

• This product is protected by certain intellectual property rights of Microsoft Corporation. Use or distribution of such technology outside of this product is prohibited without a license from Microsoft or an authorized Microsoft subsidiary.

• The BLUETOOTH® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is under license. Other trademarks and trade names are those of their respective owners.

• The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and in other countries.

• Android™ is a trademark of Google Inc.

• Google Play™ is a trademark of Google Inc.

• LDAC™ and LDAC logo are trademarks of Sony Corporation.

• Apple, the Apple logo, iPhone, and iPod touch are trademarks of Apple Inc., registered in the U.S. and other countries. App Store is a service mark of Apple Inc.

• “Made for iPod” and “Made for iPhone” mean that an electronic accessory has been designed to connect specically to iPod or iPhone, respectively, and has been certied by the developer to meet Apple performance standards. Apple is not responsible for the operation of this device or its compliance with safety and regulatory standards. Please note that the use of this accessory with iPod or iPhone may aect wireless performance.

• All other trademarks and registered trademarks are of their respective holders. In this manual, marks are not specied.

CAUTION

The use of optical instruments with this product will increase eye hazard.

and

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes.). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter . The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2 V AC range are suitable. (See Fig. A)

To Exposed Metal Parts on Set

1.5 kΩ0.15 μF

voltmeter (0.75 V)

Earth Ground

Fig. A. Using an AC voltmeter to check AC leakage.

CAUTION

Use of controls or adjustments or performance of procedures other than those speciﬁ ed herein may result in hazardous radia- tion exposure.

For customers in Europe

his appliance is classied as a CLASS 1 LASER product. This marking is located on the rear exterior.

For customers in the United Arab Emirates

his product is classied as a Class 1 Laser product under IEC 60825-1:2007. This label is located on rear surface of the product.

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

SECTION 1

SERVICING NOTES

MHC-V11

1. SERVICING NOTES ............................................. 3

2. DISASSEMBLY

2-1. Disassembly Flow ........................................................... 5

2-2. Left Side Cover, Right Side Cover ................................. 6

2-3. Top Cover Block ............................................................. 7

2-4. Main Volume Knob, MIC Volume Knob ........................ 8

2-5. CONTROL Board ........................................................... 9

2-6. Top Cover Assy, NFC Board .......................................... 9

2-7. Loader (CDM1) .............................................................. 10

2-8. BT Board ......................................................................... 11

2-9. Chassis Block .................................................................. 12

2-10. Front Panel Block ........................................................... 13

2-11. Tweeter Unit Wire ........................................................... 14

2-12. Tweeter Unit (SP2, SP3) ................................................. 15

2-13. LED A Board, LED B Board .......................................... 16

2-14. Woofer Unit (SP1) .......................................................... 17

2-15. Loader Block ................................................................... 18

2-16. MAIN Board ................................................................... 19

2-17. PSU Board ...................................................................... 19

3. TEST MODE ............................................................ 20

4. ELECTRICAL CHECKS ...................................... 21

The SERVICING NOTES contains important information for servicing. Be sure to read this section before repairing the unit.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body . During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The ﬂ exible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reﬂ ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

5. DIAGRAMS

5-1. Block Diagram - OVERALL Section - ........................... 22

5-2. Block Diagram - POWER SUPPLY Section - ................ 23

5-3. Printed Wiring Board - MAIN Board - ........................... 25

5-4. Schematic Diagram - MAIN Board (1/9) - ..................... 26

5-5. Schematic Diagram - MAIN Board (2/9) - ..................... 27

5-6. Schematic Diagram - MAIN Board (3/9) - ..................... 28

5-7. Schematic Diagram - MAIN Board (4/9) - ..................... 29

5-8. Schematic Diagram - MAIN Board (5/9) - ..................... 30

5-9. Schematic Diagram - MAIN Board (6/9) - ..................... 31

5-10. Schematic Diagram - MAIN Board (7/9) - ..................... 32

5-11. Schematic Diagram - MAIN Board (8/9) - ..................... 33

5-12. Schematic Diagram - MAIN Board (9/9) - ..................... 34

5-13. Printed Wiring Board - BT Board - ................................. 35

5-14. Schematic Diagram - BT Board - ................................... 35

5-15. Printed Wiring Board - NFC Board - ............................... 35

5-16. Schematic Diagram - NFC Board - ................................. 35

5-17. Printed Wiring Board - KARAOKE (MIC) Board - ....... 36

5-18. Schematic Diagram - KARAOKE (MIC) Board - .......... 36

5-19. Printed Wiring Board - LED A Board - .......................... 37

5-20. Schematic Diagram - LED A Board - ............................. 37

5-21. Printed Wiring Board - LED B Board - .......................... 37

5-22. Schematic Diagram - LED B Board - ............................. 37

5-23. Printed Wiring Board - CONTROL Board - ................... 38

5-24. Schematic Diagram - CONTROL Board - ...................... 39

5-25. Printed Wiring Board - PSU Board - .............................. 40

5-26. Schematic Diagram - PSU Board - ................................. 41

6. EXPLODED VIEWS

6-1. Side Cover Section .......................................................... 47

6-2. Top Cover Section........................................................... 48

6-3. Woofer Unit Section ....................................................... 49

6-4. Front Panel Section ......................................................... 50

6-5. Main Section ................................................................... 51

7. ACCESSORIES ........................................................ 52

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 °C. Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to ﬂ ow)

than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.

REPAIRING THE BOARDS

When each boards installed in this unit are defective, replace the mounted board. Individual electrical parts that mounted on the each boards cannot be replaced. Printed wiring board and schematic diagram that have been described on this service manual are for reference.

NOTE OF REPLACING THE BT BOARD OR THE NFC BOARD

When replacing the BT board or the NFC board, be sure to replace the BT board and the NFC board simultaneously. The BT board or the NFC board cannot replace with single. Among the repair parts, the BT board and the NFC board is supplied as one unit.

TEST DISCS

Use following TEST DISC (for CD) when this unit conﬁ rms the operation and checks it.

Part No. Description

3-702-101-01 DISC (YEDS-18), TEST 4-225-203-01 DISC (PATD-012), TEST

MHC-V11

Ver. 1.2

MODEL IDENTIFICATION

Distinguish by Part No. and destination code on the rear side of the main unit.

MODEL NUMBER LABEL

US, CND, RU, E4, LA, SP6, AR, TH

Part No. Destination code

AEP, UK, E93, AUS

– Rear view –

Part No. Destination code

Destination Part No. Destination code

US, CND models (UC2) AEP, UK, AUS models (CEL, CEK, AU1) RU, E4, SP6 models (RU1, E4, SP6) E93 model (E93) TH model (TH1) AR model (AR2) LA model (LA9)

4-589-649-0[] 4-589-650-0[] 4-589-651-0[] 4-589-652-0[] 4-589-653-0[] 4-589-655-0[] 4-589-656-0[]

UC2 CEL/CEK/AU1 E4/E12/RU1/SP6 E93 TH1 AR2 LA9

DESTINATION ABBREVIATIONS

The following abbreviations for model destinations are used in this service manual.

• Abbreviations AR : Argentina model AUS : Australian model CND : Canadian model E4 : Middle East area (Bahrain, Lebanon, Libya, Oman, Pakistan, Qatar, Syria, Yemen) and African (Algeria, Angola, Egypt, Ethiopia,

E93 : Middle East area (Iraq, Kuwait, Saudi Arabia, UAE) and African (Kenya, Nigeria, Tanzania) models LA : Latin American (Except Brazilian and Argentina) model RU : Russian model SP6 : South East Asian area (Except Indian, Thai) model TH : Thai model

Morocco, Tunisia) models

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF

Note: Refer to “2. DISASSEMBLY” to remove the loader (CDM1) from the unit.

loader (CDM1)

2 Draw out the tray.

gear

tray

– Bottom view –

1 Rotate the gear in the direction of the arrow.

DISASSEMBLY

• This set can be disassembled in the order shown below.

2-1. DISASSEMBLY FLOW

SET

SECTION 2

MHC-V11



JIG When disassembling the unit, use the following jig for speaker removal.

2-2. LEFT SIDE COVER, RIGHT SIDE COVER (Page 6)

2-3. TOP COVER BLOCK (Page 7)

2-4. MAIN VOLUME KNOB, MIC VOLUME KNOB (Page 8)

2-5. CONTROL BOARD (Page 9)

2-6. TOP COVER ASSY, NFC BOARD (Page 9)

2-11. TWEETER UNIT WIRE (Page 14)

2-12. TWEETER UNIT (SP2, SP3) (Page 15)

2-7. LOADER (CDM1) (Page 10)

2-10. FRONT PANEL BLOCK (Page 13)

2-13. LED A BOARD, LED B BOARD (Page 16)

2-14. WOOFER UNIT (SP1) (Page 17)

Part No. Description J-2501-238-A JIG FOR SPEAKER REMOVAL

2-8. BT BOARD (Page 11)

2-9. CHASSIS BLOCK (Page 12)

2-15. LOADER BLOCK (Page 18)

2-16. MAIN BOARD (Page 19)

2-17. PSU BOARD (Page 19)

MHC-V11

Note: Follow the disassembly procedure in the numerical order given.

2-2. LEFT SIDE COVER, RIGHT SIDE COVER

4 right side cover

1 screw

2 two screws

3 claw

2 two screws

4 left side cover

3 claw

1 two screws

2-3. TOP COVER BLOCK

MHC-V11

This side is the terminal side.

1 FFC (20P) (XP10)

6 three claws

front side

2 connector (4P) (XP7)

3 two screws

Lift up the top cover block

in the direction of the arrow.

front side

wire

4 screw

– Left view –

8 connector (5P) (XP6)

9 top cover block

7 Remove the top cover

block in the direction of the arrow.

MHC-V11

2-4. MAIN VOLUME KNOB, MIC VOLUME KNOB

Note 1: The MIC volume knob can be removed even without remov-

ing the main volume knob.

2 main volume knob

4 MIC volume knob

3 Insert a flathead screwdriver at both sides of

the MIC volume knob and lift at the same time.

Note 2: When using a flathead screwdriver, work carefully so that you do not damage the MIC volume knob and top cover block.

top cover block

front side

Push the main volume knob

by a flathead screwdriver.

hole

 How to install the volume knob

When installing the volume knob to the rotary encoder, align the directions of the D-shaped tip of the rotary encoder and the D-shaped notch at the inner side of the volume knob.

flathead screwdriver

Place soft pieces of cloth between

Note 3:

the MIC volume knob and the top cover block to avoid damaging the top cover block.

flathead screwdriver

main volume knob

rotary encoder

top cover block

MIC volume knob

rotary encoder

2-5. CONTROL BOARD

MHC-V11

1 seven screws

top cover block

5 CONTROL board

1 seven screws

1 four screws

This side is the terminal side.

4 FFC (20P) (XP1)

3 connector (2P) (XP2)

rear side

2-6. TOP COVER ASSY, NFC BOARD

Note: When replacing the NFC board, be sure to replace the BT board

and the NFC board simultaneously. The NFC board cannot replace with single. Among the repair parts, the BT board and the NFC board is supplied as one unit.

top cover assy

top side

Lift up the CONTROL board block

in the direction of the arrow.

5 NFC board

4 connector (2P)

(XP15)

1 two claws

rear side

2 Peel the NFC board block off of the adhesive sheet.

top side

MHC-V11

2-7. LOADER (CDM1)

5 two screws

1 cushion

3 connector (6P)

(XP5)

2 FFC (24P) (XP4)

The opposite side is the terminal side.

WireVHWWLQJ

loader (CDM1)

three hooks

cushion

6 loader (CDM1)

4 connector (2P)

(XP6)

front side

–5LJKWYLHZ–

MAIN board

2-8. BT BOARD

Note 1: When replacing the BT board, be sure to replace the BT board

and the NFC board simultaneously. The BT board cannot replace with single. Among the repair parts, the BT board and the NFC board is supplied as one unit.

MHC-V11

3 handle block

1 FFC (24P)

(XP35)

The opposite side is the terminal side.

2 two screws

5 screw

7 BT board

Note 2: board, align the two holes and the two bosses.

When installing the BT

This side is the terminal side.

6 handle

rear side

two bosses

two holes

5 screw

4 FFC (24P)

(XP1)

MHC-V11

2-9. CHASSIS BLOCK

1 connector (7P) (XP11)

3 screw

3 three screws

2 screw

wire

front side

6 connector (4P) (XP13)

5 connector (2P) (XP14)

7 connector (4P) (XP9)

8 chassis block

4 rib

2-10. FRONT PANEL BLOCK

4 All bosses are removed while moving jig in the direction of the arrow, and front panel block is removed.

3 Insert the jig into the space and slowly remove the front panel block.

Note 1: When using a jig, please work carefully so as not to damage the front panel block and speaker cabinet.

2 Insert a flathead screwdriver in two notches at bottom of the unit, and lift the front panel block a little.

1 screw

bottom side

MHC-V11

total eleven bosses

1 three screws

speaker cabinet

4 All bosses are removed while moving jig in the direction of the arrow, and front panel block is removed.

3 Insert the jig into the space and slowly remove the front panel block.

Note 1: When using a jig, please work carefully so as not to damage the front panel block and speaker cabinet.

5 front panel block

Note 2: When installing the front panel block, remove the used bond and use a new bond to fix the front panel block.

MHC-V11

2-11. TWEETER UNIT WIRE

protrusion

7ZHHWHUXQLWZLUHVHWWLQJ

1 Push the protrusion, and remove the terminal (wide side).

tweeter unit (R-ch) (SP3)

front side

front panel block

1 Push the protrusion, and remove the terminal (narrow side).

short wire

tweeter unit

(R-ch)

long wire

2 tweeter unit wire

1 Push the protrusion, and remove

the terminal (narrow side).

1 Push the protrusion, and remove the terminal (wide side).

tweeter unit (L-ch) (SP2)

protrusion

tweeter unit

(L-ch)

2-12. TWEETER UNIT (SP2, SP3)

 ,nVtallation Girection Ior tKe tweeter Xnit 5cK 63

Install so that the terminal (narrow side) of the tweeter unit aligns with the direction of the arrow.

MHC-V11

front side

– Front panel block rear view –

3 tweeter unit (R-ch) (SP3)

1 two screws

2 bracket

1 two screws

arrow

front panel block

3 tweeter unit (L-ch) (SP2)

2 bracket

 ,nVtallation Girection Ior tKe tweeter Xnit /cK 63

Install so that the terminal (wide side) of the tweeter unit aligns with the direction of the arrow.

arrow

– Front panel block rear view –

MHC-V11

2-13. LED A BOARD, LED B BOARD

front side

front panel block

3 Remove the LED B board block in the direction of the arrow.

4 connector (2P) (XP4)

WireVeWWiQJ

top side

2 screw

1 Draw the cable out

of the groove.

1 Draw the cable out of the groove.

5 cushion

6 LED B

board 4 connector (2P)

(XP3)

groove

2 screw

groove

6 LED A board

3 Remove the LED A board block in the direction of the arrow.

groove

LED B board

white line

LED B board

–)rRQWSDQeOEORFNreDrYieZ–

LED A board

white line

LED A board

groove

2-14. WOOFER UNIT (SP1)

,QVWDOODWLRQGLUHFWLRQIRUWKHZRRIHUXQLW63

When installing the woofer unit (SP1),

Note:

make the position of terminals as shown in the figure below.

top side

woofer unit (SP1)

terminal position

MHC-V11

speaker cabinet block

front side

– Speaker cabinet block front view –

4 woofer unit (SP1)

1 three screws

Pull out the woofer unit block

in the direction of the arrow.

narrow side

wide side

3 Push the protrusion, and remove the terminal (narrow side).

protrusion

3 Push the protrusion, and remove the terminal (wide side).

+ 37 hidden pages

Sony MHC-V11 Service Manual

SERVICING NOTES

TABLE OF CONTENTS

DISASSEMBLY

2-1. DISASSEMBLY FLOW

2-2. LEFT SIDE COVER, RIGHT SIDE COVER

2-3. TOP COVER BLOCK

2-4. MAIN VOLUME KNOB, MIC VOLUME KNOB

2-5. CONTROL BOARD

2-6. TOP COVER ASSY, NFC BOARD

2-7. LOADER (CDM1)

2-8. BT BOARD

2-9. CHASSIS BLOCK

2-10. FRONT PANEL BLOCK

2-11. TWEETER UNIT WIRE

2-12. TWEETER UNIT (SP2, SP3)

2-13. LED A BOARD, LED B BOARD

2-14. WOOFER UNIT (SP1)