Rockwell Automation 1747-OS302 User Manual
Installation Instructions
SLC 5/03™ and SLC 5/04™ Processors
Firmware/Operating System Upgrade
Introduction
Enclosed in this package is a firmware/operating system upgrade for
your SLC 5/03 or SLC 5/04 processor. Take anti-static precautions
when upgrading the firmware.
ATTENTION
The Flash EPROMs are electrostatic sensitive devices.
Do not handle without proper grounding
precautions. Do not install PROM with power
applied to the SLC 5/03 or SLC 5/04 processor.
!
If you upgrade an SLC 5/03 or SLC 5/04 processor, you receive
anomaly fixes as well as added functionality. During the upgrade, the
ladder logic program inside the processor is erased. Therefore, the
first step in upgrading the firmware/operating system is to save the
processor’s ladder logic program.
This product is CE compliant for all applicable directives when
product or packaging is marked.
Installation Procedure
1 Publication 1747-IN007C-EN-P - October 2002
Follow these instructions carefully. Refer to page 3 for component
placement information.
1. Save the current user program to your hard drive using your
programming software, to a memory module, or to a 1747-PSD
Program Storage Device.
IMPORTANT
2. Remove the communication cable between the processor and
your programming terminal.
The user program is cleared as part of the
firmware/operating system upgrade process.
You must restore your program after loading
the upgrade. Also, all communication ports are
returned to the default parameters.
2 SLC 5/03™ and SLC 5/04™ Processors Firmware/Operating System Upgrade
3. Remove power from the chassis containing the processor.
ATTENTION
Do not remove the processor from the SLC 500
chassis until all power is removed from the SLC
500 power supply.
!
4. Remove the processor from the chassis.
5. Plug the firmware/operating system upgrade pack into the
memory module socket.
6. Move the operating system write-protect jumper (J4) to the
unprotected, or program, position.
IMPORTANT
Jumper J4, located in the bottom right corner of
the motherboard, provides write protection from
any download of a new operating system. The
“out of the box” position of this jumper is
“PROTECT,” or write protect. Without the
jumper, the processors are write protected.
Publication 1747-IN007C-EN-P - October 2002
Catalog and Serial
Number Label
SLC 5/03™ and SLC 5/04™ Processors Firmware/Operating System Upgrade 3
Figure 1 Component Placement Information
Place the firmware
upgrade label here.
The SLC 5/03 and SLC 5/04
processors are
protected
from the
firmware download when jumper J4
is in this position:
OR
The SLC 5/03 and SLC 5/04
processors accept the firmware
download when jumper J4 is in this
position:
SLC 500
PROCESSOR UNIT
CAT
SERIAL NO.
SER
FAC
PROC. REV.
PLACE FRN UPGRADE LABEL HERE
OPERATING SYSTEM INFO
OS #
SER
FRN
WHITE
RED
BATTERY
+
-
PROTECT
1
PROGRAM
J4
3
CURRENT REQUIREMENTS: 1A @ 5 VDC
LISTED IND. CONT. EQ.
U
L
FOR HAZ. LOC. A196
CLASS 1, GROUPS A, B, C AND D, DIV
OPERATING TEMPERATURE CODE T3C
SA
c
Daughter Board
Mother Board
Firmware
Upgrade/Memory
Jumper J4
Module Socket
7. Firmly seat the processor back into the chassis.
8. Apply power to the chassis containing the processor while
watching the LED display. All the LEDs should turn on and then
turn off. The download process of the firmware takes up to 2.5
minutes. While the download is in progress, the RUN and FLT
LEDs remain off. The other four LEDs – RS232, DH485 (DH+ on
the SLC 5/04), FORCE, and BATT – turn on and off in a walking
bit sequence. If the download is successful, these four LEDs
remain on together. If the FLT LED turns on and a combination
of LEDs flash on and off indicating an error condition, refer to
the troubleshooting information on page 4.
R
200mA @ 24 VDC
. 2
MADE IN USA
9. After completing the download, remove power from the chassis
containing the processor.
ATTENTION
Do not remove the processor from the SLC 500
chassis until all power is removed from the SLC
500 power supply.
!
10. Remove the processor from the chassis.
11. Carefully remove the firmware upgrade pack and place it in the
anti-static packaging it was shipped in.
Publication 1747-IN007C-EN-P - October 2002
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