Rockwell Automation 1746-MPM User Manual

Installation Instructions

Mold Pressure Module

(catalog number 1746-MPM)

Before you begin

Use this document as a guide to installing and powering-up your Mold Pressure Module. We assume that you are already familiar with the SLC

™

500

family of Small Logic Controllers and associated I/O modules.

Tools that you need

•

1/4” slotted (#2) or phillips screwdriver

•

needle-nose pliers

Handling the module

Take these precautions to guard against ESD damage:

ATTENTION:

module. Follow these guidelines:

• touch a grounded object to discharge potential static

• wear an approved grounding wriststrap

• do not touch circuit components inside the module

• if available, use a static-safe work station

• when not in use, store the module in its anti-static bag.

ATTENTION:

backplane power is on. An electrical arc may occur that can cause an explosion in a hazardous environment and/or cause damage to the module or degrade its performance.

Electrostatic discharge can damage the

Do not insert or remove this module while

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2 Mold Pressure Module

Recommendation for using associated software

We recommend the following software to use this module effectively:

•

To display molding parameters processed by the module,

your personal opuer  us e euppe  n soare ro  ! enolo"es# $n% ra&erse y# ’$

on using the software, refer to DARTWin Software Installation and Use manual.

•

To program the SLC processor to interface the module with molding machine operation, your PC should be equipped with programming software RSLogix 500™ from Rockwell Software. For instructions on using the software, refer to the documentation that accompanied it.

. For instructions

What you need to do to set up and operate the module

This document covers installing, powering up, and operating the module.

Section Description Page

1 what the module does 3 2 wire module I/O 4 3 module I/O 5 4 configure the module with jumper plugs 7 5 configure the SLC processor’s I/O, G file, and M0/M1 files 8 6 set sensor inputs to zero 11 7 check channel operation 11 8 write ladder logic 12 9 troubleshoot the module 15 10 use DartWin software to display processed data 15 11 listing of M0/M1 file words 16 12 specifications 18 13 compliance with European Union directives 19 14 CSA hazardous location approval 20

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Mold Pressure Module 3

1. What the module does

The module processes and extracts cyclic injection molding data for display on your PC, and responds to alarms that you set to monitor critical molding parameters.

When used with the Pro-Set 200 Injection Molding Control System, the module helps you:

•

achieve a quicker setup time to obtain optimum part quality

•

maintain that quality over the production run

The module and associated DARTWin software help you to set up the injection molding machine for optimum performance. Then you set alarm limits on critical parameters to detect deviations while making parts. You can also set a critical mold pressure to transfer the injection process each machine cycle.

The module is designed for use with the SLC 5/03 (or later) processor. You program it to interface with the injection molding machine. The module has two independent channels to accept analog pressure inputs from sensors or from the SLC processor across the backplane. It returns alarm signals and processed molding parameters to the SLC processor for your application programming and to your PC for graphic display. We show the module in a typical Pro-Set 200 system.

Power Supply

PanelView 550 Operator Interface

SLC 500 Processor System with I/O and special-purpose modul es

SLC 5/04P

Fast Analog I/O Modules

I/O for Injector, Clamp, & Ejectors

Empty

Barrel Temp

Slot

Modules

4-wire sensor (mold pressure)

Personal Computer with DARTWin Software

1746- MPM

Digital I/O

Modules

2-wire sensor

(hydraulic pressure)

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4 Mold Pressure Module

2. Wire the module

ATTENTION:

Disconnect all power to the SLC system before wiring.

Use the terminal block for connecting these devices:

Terminal # Device

1, 2 RS-485 cable to your PC 3, 7, 9 calibration wiring for channel 1(see section 7) 3, 8, 10 calibration wiring for channel 2 (see section 7) 4 connection used to zero both channels (see section 6) 5, 6 cable shield s (connected internally to chassis ground) 13, 15 2-wire sensor input to channel 1 11, 13, 15, 17 4-wire sensor input to channel 1 14, 16 2-wire sensor input to channel 2 12, 14, 16, 18 4-wire sensor input to channel 2

RS-485 Converter



+T/R

-T/R

Zero

Shld

Cal2 R

Cal 2

+Exc 2

+Sgnl 2

-Sgnl 2

-Exc 2

2-wire sensor (hydraulic pressure)

4-wire sensor (mold pressure)

Cal

Shld

Cal1 R

Cal 1

+Exc 1

+Sgnl 1

-Sgnl 1

-Exc 1

3 5

11 13

another 1746-MPM module

Wiring Notes

•

Ground cable shields at one end only.

•

Isolate signal wiring from power lines and sources of electrical noise.

•

Do not exceed 10V dc on any input terminal.

•

Outputs +Exc, +T/R, and -T/R must have a minimum load of 1K ohms. referenced to analog common.

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Mold Pressure Module 5

3. Module I/O

Inputs

The module has two independent channels that you configure to process signals from machine sensors (default) or from the SLC output image table across the backplane. Types of machine sensors include::

level: range application:

low 2mV/V sensitivity mold pressure

4-20mA general purpose

-100 to +100mV bi-directional

high 0-10V hydraulic pressure

Outputs (Summary Data)

The module processes a frame of summary data for each molding cycle, and alternately makes available the previous frame for display. It does this for channels 1 and 2. Your ladder logic can read summary data from the module’s M0/M1 files. You can observe summary data displayed on a PC equipped with DARTWin software. The PC must be linked to the module with DARTNet



network from RJG Te chnolo gi es , Inc.

A list of summary data follows. For a complete list with word addresses, see the M0/M1 File Listing in section 11.

Summary Data Displayed on Your PC and Read by SLC in M0/M1 Files

injection cycle time peak injection pressure minimum cycle pressure time to peak pressure trigger time (off to on to off) for T1 (injection forward - fill, pack, and hold) trigger time (off to on to off) for T2 (fill) trigger time (off to on to off) for T3 (screw backup) trigger time (off to on to off) for T4 (mold closed) integral to peak pressure in units of PSIxSec integral of trigger 1 (injection forward) in units of PSIxSec integral of trigger 2 (fill) in units of PSIsec integral of trigger 3 (screw backup) in units of PSIxSec integral of trigger 4 (mold closed) in units of PSIxSec integral of injection cycle in units of PSIxSec

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6 Mold Pressure Module

Commands and status via the I/O image table

The module uses I/O image word 0 for bit-level commands from the SLC processor and returns bit-level status to the SLC processor. You will use these command and status bits in your ladder logic. Addresses: Comm ands = O:e.0/xx, Status = I: e.0/ xx (e = slot #)

Bit commands to the module Bit status from the module

00 trigger 1, start machine cycle 00 channel 1 alarm 01 trigger 2, injection fill time 01 channel 2 alarm 02 trigger 3, screw backup time 02 cycle time alarm 03 trigger 4, mold closed time 03 channel 1 loss of sensor 04 set channel 1 zero offset 04 channel 2 loss of sensor 05 set channel 2 zero offset 05-07 spare 06 shunt calibration bit - Never set

concurrently with bit 04 or 05

07-15 reserved 10 reading chnl 2 zero offset

08 trigger 1 is ON 09 reading chnl 1 zero offset

11 reading redundant permissive 12-15 reserved

(

Scaled data transferred from the module

The SLC processor reads mold pressure as counts (0-4095) from the module’s A/D converter. Your ladder logic must convert counts to PSI.

Important:

For low-level sensor signals (module gain = 450)

PSI

For the computation rung, see section 10, ladder example 5.



× x



Counts

9vdc

------------

4095xCounts

----------------------------------

10vdc

Where: D = diameter of the ejector pin L = full-load rating of the sensor

--------------------------------------------------------------------------



--- -



This equation can be re-arranged to:

Counts L×

------------------------------- -

PSI

2894.58×

For high-level sensor signals (module gain = 1)



× x



3612.2×

Counts

10vdc

---------------

4095xCounts

----------------------------------

10vdc

Important:

For a sensor with 20mA full-load output, use this same computation.

-----------------------------------------------------------------------------

PSI



--- -



Counts L×

-----------------------------

PSI

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Mold Pressure Module 7

Pressure values transferred from the SLC data table to the module must be integer numbers in units of PSI. If using the Pro-Set 200 Injection Control System , the ladder logic provides pressur e val ues in the corre ct format.

4. Configure the module with jumper plugs

Each channel is independently configurable. Jumper-plug configurations selected here must match G-file bit selections done next in section 5. The module’s default channel input configurations are:

•

channel 1: mold pressure sensor (low-level) connected to the module

•

channel 2: injection pressure sensor (high-level) connected to module

You may use these default configurations or change them as needed.

Chnl Gain Jmpr 0-ref Jmpr 1 JP5 @ 450 JP1 @ 5%FS 2 JP6 @ 1 (NC) JP2 @ 0V

Select gain and zero-reference with jumper plugs

For this sensor Select Gain: Select 0- ref: Notes:

lo-level (2mV/V) 450 5% FS

(see Important) lo-level (4-20mA) 1 0V For 4-20mA sensors, set channel to hi-level. bi-directional (±) 450 mid point For sensor outputs such as -100 to +100mV hi-level (0-10V) 1 0V For gain = 1 (NC), store jumper as shown.

Gain settings of 250 and 100 are available for sensor sensitivities of 6 and 9 mV/V.

Channel 1 Default Jumpers

JP5 Gain JP6 Gain

* *

- 4-20mA

- 450

* *

- 250

* *

- 100

- 1 (NC)

Important:

JP1 0-ref

* *

- 0V

- 5% FS

- mid pt

* *

For a 5% FS zero reference, a 2mv/V sensitivity and gain of

Channel 2 Default Jumpers

* * * * * * * *

JP2 0-ref

- 4-20mA

- 450

- 250

- 100

- 1 (NC) For a gain of 1 (NC), rotate jumper and store as shown.

* * * *

- 0V

- 5% FS

- mid pt

Jumper Locations

JP6 JP2 JP5 JP1

Module

450 give an amplified 9.0V operating range of 0.5-9.5V dc. This lets the module and software continuously autozero the lo-end signal for variations due to pre-load and/or changes in temperature.

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8 Mold Pressure Module

Select the calibration resistor with jumper plugs

Select the module’s internal calibration resistor or external resistor located in the sensor or separately wired to the module’s terminal block.

Channel 1 Jumper

JP3 Cal Res JP4 Cal Res

* *

Internal 200K

default position

* *

Channel 2 Jumper

* *

External

* * * * * *

Jumper Locations

Module

JP3 JP4

5. Configure the SLC Processor (including I/O, M0/M1, and G file)

This procedure is based on RSLogix500 programming software, version

2.0 or later. For other software, the procedure may vary.

Configure the SLC processor, I/O, size of M0/M1 files, and G file offline to match your system lay o ut.

With the File pull-down window, open the ladder file associated wit h this project, or create a project (ladder file) for it.

If you have not already done so, selec t the Contr ol le r Prope rt ie s icon and launch it. Then select/enter the type of SLC proce s so r.

Select the I/O Configuration icon and launch it. Then select/enter :

Slot number in the I/O chassis for this module If using this module in a Pro-Set 200 Injection Control System , assign this module to slot 7.

Module ID (12935), entered under “Other” in the I/O Module window.

Important:

When you enter the module ID, the processor automatically reserves the required number of I/O image table words. The location of those words in the I/O image table is determined by the module’s slot location in the I/O chassis. Slot location is a required addressing unit. For example, I:e.6 locates the 6th word in the block of input image table words assigned to the module in slot e that you entered in A, above.

If you have not already done so, enter the size of I/O chassis and the type of power supply.

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