SEMICONDUCTOR TECHNICAL DATA
2–1
REV 2
Motorola, Inc. 1996
12/93
The MC10E/100E101 is a quad 4-input OR/NOR gate.
• 500ps Max. Propagation Delay
• Extended 100E V
EE
Range of – 4.2V to – 5.46V
• 75kΩ Input Pulldown Resistors
PIN NAMES
Pin
Function
D0a– D
3d
Data Inputs
Q0– Q3 True Outputs
Q0– Q
3
Inverting Outputs
QUAD 4-INPUT
OR/NOR GATE
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
V
CCO
D
2d
D
2c
D
2b
V
EE
D
2a
D
1d
D
1c
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
116 7 8 9 10
D3aD3bD3cD
3d
Q
3
Q
3
Q
2
Q
2
V
CC
Q
1
Q
1
Q
0
Q
0
D
0a
D
0b
D
0c
D
0d
D
1a
D
1b
D
1c
D
1d
D
2a
D
2b
D
2c
D
2d
D
3a
D
3b
D
3c
D
3d
Q
0
Q
0
Q
1
Q
1
Q
2
Q
2
Q
3
Q
3
1
LOGIC DIAGRAM
* All VCC and V
CCO
pins are tied together on the die.
Pinout: 28-Lead PLCC (Top View)
5
D
1b
D
0d
1a
0b
0c
D
D
D
V
D
CCO
0a
MC10E101 MC100E101
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–2
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
I
IH
Input HIGH Current 150 150 150 µA
I
EE
Power Supply Current mA
10E 30 36 30 36 30 36
100E 30 36 30 36 35 42
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = V
CCO
= GND)
0°C 25°C 85°C
Symbol Characteristic min typ max min typ max min typ max Unit Condition
t
PLH
Propagation Delay to Output ps
t
PHL
D to Q 200 350 500 200 350 500 200 350 500
t
SKEW
Within-Device Skew 50 50 50 ps 1
t
SKEW
Within-Gate Skew 25 25 25 2
t
r
Rise/Fall Time ps
t
f
20 - 80% 300 380 575 300 380 575 300 380 575
1. Within-device skew is defined as identical transitions on similar paths through a device.
2. Within-gate skew is defined as the variation in propagation delays of a gate when driven from its different inputs.
MC10E101 MC100E101
2–3 MOTOROLAECLinPS and ECLinPS Lite
DL140 — Rev 4
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.010 (0.250) T L
–M
SNSS
0.007 (0.180) T L
–M
SNSM
0.007 (0.180) T L
–M
SNSM
0.004 (0.100)
SEATING
PLANE
-T-
12.32
12.32
4.20
2.29
0.33
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
—
2
°
10.42
1.02
12.57
12.57
4.57
2.79
0.48
0.81
—
—
11.58
11.58
1.21
1.21
1.42
0.50
10
°
10.92
—
1.27 BSC
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
VIEW S
B
U
Z
G1
X
VIEW D-D
H
K
F
VIEW S
G
C
Z
A
R
E
J
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
—
2
°
0.410
0.040
0.495
0.495
0.180
0.110
0.019
0.032
—
—
0.456
0.456
0.048
0.048
0.056
0.020
10
°
0.430
—
0.050 BSC
-N-
Y BRK
D
D
W
-M-
-L-
28 1
V
G1
K1
MC10E101 MC100E101
MOTOROLA ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–4
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MC10E101/D
*MC10E101/D*
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