LG LHS-55-TBC, LHS-55-TBS, LHS-55-TBW, LHTK-551-TB Service manual

4.3 (3)
DVD/CD & KARAOKE RECEIVER
SERVICE MANUAL
MODELS : LH-TK551TB/LH-T551TB
LHS-55TBC, LHS-55TBS,
LHS-55TBW
MODELS : LH-TK551TB/LH-T551TB LHS-55TBC, LHS-55TBS, LHS-55TBWSERVICE MANUAL
1-1
[CONTENTS]
SECTION 1.GENERAL
• SERVICING PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
• ESD PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
• SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5
SECTION 2. AUDIO PART
• AUDIO TROUBLESHOOTING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
• WIRING DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
• BLOCK DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
• SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8
• PRINTED CIRCUIT DIARGAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22
SECTION 3.DVD & AMP PART
• ELECTRICAL TROUBLESHOOTING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-1
• DVD PART SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-22
SECTION 4. EXPLODED VIEWS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
SECTION 5. SPEAKER PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
SECTION 6. REPLACEMENT PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-1
1-2
SERVICING PRECAUTIONS
NOTES REGARDING HANDLING OF THE PICK-UP
1. Notes for transport and storage
1) The pick-up should always be left in its conductive bag until immediately prior to use.
2) The pick-up should never be subjected to external pressure or impact.
2. Repair notes
1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.
2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and
impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or
damage to the printed-circuit board.
3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason
the adjustment point and installation screws should absolutely never be touched.
4) Laser beams may damage the eyes!
Absolutely never permit laser beams to enter the eyes!
Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.
5) Cleaning the lens surface
If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used
for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a cot-
ton swab should be used, taking care not to distort this.
6) Never attempt to disassemble the pick-up.
Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab.
(Do not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much
of this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.
Storage in conductive bag
Drop impact
NEVER look directly at the laser beam, and don’t let
contact fingers or other exposed skin.
Magnet
How to hold the pick-up
Conductive Sheet
Cotton swab
Pressure
Pressure
SECTION 1. GENERAL
1-3
NOTES REGARDING COMPACT DISC PLAYER REPAIRS
1. Preparations
1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These components
are sensitive to, and easily affected by, static electricity. If such static electricity is high voltage, components
can be damaged, and for that reason components should be handled with care.
2) The pick-up is composed of many optical components and other high-precision components. Care must be
taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong magnet-
ism is present, or where there is excessive dust.
2. Notes for repair
1) Before replacing a component part, first disconnect the power supply lead wire from the unit
2) All equipment, measuring instruments and tools must be grounded.
3) The workbench should be covered with a conductive sheet and grounded.
When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is
because there is the possibility of damage by static electricity.)
4) To prevent AC leakage, the metal part of the soldering iron should be grounded.
5) Workers should be grounded by an armband (1M Ω)
6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent
static electricity changes in the clothing to escape from the armband.
7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.
Resistor
(1 Mohm)
Conductive
Sheet
Resistor
(1 Mohm)
Armband
1-4
ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface
such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER
SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gener-
ate static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED
“DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
1-5
GENERAL
Power supply Refer to main label
Power consumption Refer to main label
Mass 3.9 kg
External dimensions (W x H x D) 430 x 54 x 350 mm
Operating conditions Temperature: 5°C to 35°C, Operation status: Horizontal
Operating humidity 5% to 85%
CD/DVD
Laser Semiconductor laser, wavelength 650 nm
Signal system PAL 625/50, NTSC 525/60
Frequency response (audio) 200 Hz to 20 kHz
Signal-to-noise ratio (audio) More than 75 dB (1 kHz, NOP, 20 kHz LPF/A-Filter)
Dynamic range (audio) More than 70 dB
Harmonic distortion (audio) 0.5 % (1 kHz, at 12W position) (20 kHz LPF/A-Filter)
VIDEO
Video input 1.0 V (p-p), 75 Ω, negative sync., RCA jack x 1/ SCART (TO TV)
Video output 1.0 V (p-p), 75 Ω, negative sync., RCA jack x 1/ SCART (TO TV)
S-video output (Y) 1.0 V (p-p), 75 Ω, negative sync., Mini DIN 4-pin x 1
(C) 0.3 V (p-p), 75
Component Video output (Y) 1.0 V (p-p), 75 Ω, negative sync., RCA jack x 1
(Pb)/(Pr) 0.7 V (p-p), 75 Ω, RCA jack x 1
TUNER
FM
Tuning Range 87.5 - 108.0 MHz or 65.0 - 74.0 MHz, 87.5 - 108.0 MHz
Intermediate Frequency 10.7 MHz
Signal-to Noise Ratio 60 dB (Mono)
Frequency Response 140 - 10,000 Hz
AM [MW]
Tuning Range 522 - 1,620 kHz or 520 - 1,720 kHz
Intermediate Frequency 450 kHz
AMPLIFIER(LH-TK551TB/LH-T552TB)
Stereo mode 70W + 70W (8Ω at 1 kHz, THD 10 %)
Surround mode Front: 70W + 70W (THD 10 %)
Centre*: 70W
Surround*: 70W + 70W (8Ω at 1 kHz, THD 10 %)
Subwoofer*: 150W (4Ω at 30 Hz, THD 10 %)
SPEAKERS
Satellite Speaker Centre speaker Passive Subwoofer
(LHS-55TBS) (LHS-55TBC) (LHS-55TBW)
Type 1 Way 2 Speaker 1 Way 2 Speaker 1 Way 1 Speaker
Impedance 8 8 Ω 4 Ω
Frequency Response 150 - 20,000 Hz 150 - 20,000 Hz 40 - 1,500 Hz
Sound Pressure Level 86 dB/W (1m) 86 dB/W (1m) 82 dB/W (1m)
Rated Input Power 70 W 70 W 150 W
Max. Input Power 140 W 140 W 300 W
Net Dimensions
(WxHxD) 280 x 1200 x 280 mm 500 x 83 x 90 mm 195 x 402 x 360 mm
Net Weight 2.38kg 0.71kg 6.2kg
(* Depending on the sound mode
settings and the source, there
may be no sound output.)
SPECIFICATIONS
2-1
SECTION 2. AUDIO PART
AUDIO TROUBLESHOOTING GUIDE
1. POWER SUPPLY CIRCUIT
2-2
2. FRONT CIRCUIT (1/2)
PIN3
PIN4
PIN9
: -27.5 FL-
: -32.4 VKK
: -23.7 FL+
: +5.0
CN902 CN902
2-3
3. FRONT CIRCUIT (2/2)
2-4 2-5
WIRING DIAGRAM
WIRELESS
OPTICAL
IN
SCART
JACK
OPTION
SW
AV1,2
COMPONENT
MONITOR OUT
S-VIDEO OUT
TUNER
SPEAKER TERMINAL
MAIN PCB
AMP PCB
SMPS PCB
MD
FRONT
PCB
FRONT
PCB
MIC&USB PCB
VFD
H/P JACK
USB JACK
MIC
JACK
MIC
JACK
CN001
PN005
CN350
PN801
6PIN
5PIN
23PIN 11PIN 24PIN 23PIN
14PIN 14PIN
30PIN
PN103
PN104
PN001
PN002
PN902 PN303
PDM01 PDM03
PN105
PN302
2-6 2-7
BLOCK DIAGRAM
Audio s/w
Bu 4052
ADC
CS 5340
Fs = 48kHz
Fx
DIT
CS 8406
(slave)
PS 9818
(PWM)
Video S/W
NJM 2279
out
(CVBS-S/W)
+
Slide
S/W
Video
S/W
NJM2279
(Y-S/W)
USB Controller
ALC
BA 3308
CS 5340
ADC
DVD BLOCK
(ES 6698)
Mic Volume : OSD CTL
MIC1
MIC2
Optical
Tuner
AV1
AV2
(option)
Monitor Out
S-AV
Component
Scart
(option)
USB Port
MIC
7V
Wireless
L
R
V
L
R
V
G
B
R
L
R
L
R
G
B
R
8
16
V
SW1, SW2,MUTE1
(A)
P
b
(R) ,P
r
(R)
CTL-A/B
(B)
VIDEO-SW
(A)
Tuner-L/R
AV1-L/R
AV2-L/R
SCART-L/R
AV1-CVBS
AV2-CVBS
Monitor out
SCART-CVBS out
C
Y
SCART-ID
SCART-FB
/RST-AD
AD-DATA
AD-BCK
AD-LRCK
(A)
SPDI
F
12.288MHz
LRCK
BCK
ADAT 0,1,2,3
(FL/R,RL/R,C/SW
)
MUTE
TR Mute
/RST-AD
(A)
Mixing
ALRCK,ABCK
MCLK,AMDAT
SPDIF
8406_SDI,8406_SD
O
8406_CLK,8406_CE
8406_RST,8406_IN
T
H/P
Y(G)
Y
YY
C
DVD-CVBS
CVB
S
(A)(T_CE,T_DO,T_DI,T_CLK,T_RDS_DATA,T_RDS,CLK)
(A)
AUDIO MICOM
LC876B48
(PIN MAP )
SS
T
OPTION
FRONT
STA510A
AMP IC
MIC1_DET(A)
MIC2_DET(A)
(A) HP_DET
AM
PDN
TH_W
FAN1
FAN2
(A)
FAN1_CTL
FAN2_CTL
OPTION
2-8 2-9
SCHEMATIC DIAGRAMS
1. POWER SCHEMATIC DIAGRAM_1
A B C D E F G H I J K L M N O P Q R ST
2-10 2-11
2. POWER SCHEMATIC DIAGRAM_2
A B C D E F G H I J K L M N O P Q R ST
2-12 2-13
3. MICOM SCHEMATIC DIAGRAM
A B C D E F G H I J K L M N O P Q R ST
2-14 2-15
4. FRONT SCHEMATIC DIAGRAM
A B C D E F G H I J K L M N O P Q R ST
2-16 2-17
5. DSP& SCHEMATIC DIAGRAM
A B C D E F G H I J K L M N O P Q R ST
2-18 2-19
6. I/O SCHEMATIC DIAGRAM
A B C D E F G H I J K L M N O P Q R ST
2-20 2-21
7. MAIN MIC SCHEMATIC DIAGRAM
A B C D E F G H I J K L M N O P Q R ST
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