LG GW520 Service Manual

Service Manual Model : GW520

Internal Use Only

Service Manual

GW520

Date: July, 2009 / Issue 1.1

- 3 -

LGE Internal Use Only

Table Of Contents

1. INTRODUCTION ...............................................5

1.1 Purpose ......................................................................5

1.2 Regulatory Information .................................................5

1.3. ABBREVIATION ...........................................................7

2. PERFORMANCE ...............................................9

2.1 Supporting Standard ....................................................9

2.2 Main Parts : Solution ..................................................10

2.3 H/W features .............................................................10

2.4 HW Spec. ................................................................12

3. BB CIRCUIT TECHNICAL BRIEF ..................... 17

3.1 Functional Block Diagram ..........................................17

3.2 Baseband Processor Introduction ...............................18

3.3 Power management IC...............................................31

3.4. Power ON/OFF .........................................................39

3.5 SIM Interface .............................................................40

3.6 MICRO SD connector .................................................41

3.7 Memory ....................................................................42

3.8 LCD Display ..............................................................43

3.9 Keypad switching & scanning .....................................44

3.10 keypad back-light illumination ..................................45

3.11 LCD back-light illumination ......................................47

3.12 Battery voltage monitor ............................................48

3.13 Audio ......................................................................49

3.14 Bluetooth/FM (RBCA-B561A)....................................51

3.15 5PIN Interface connector ..........................................53

4. RF Circuit Technical Brief ............................54

4.1 General Description ...................................................54

4.2 GSM Part ..................................................................58

4.3 WCDMA Part .............................................................62

4.4 GSM Power Ampliﬁ er Module .....................................65

4.5 WCDMA Band1/8 Power Ampliﬁ er Module ..................66

4.6 WCDMA Band1/8 Low Noise Ampliﬁ er ........................67

4.7 WCDMA Band1 Duplexer ...........................................68

4.8 WCDMA Band8 Duplexer ...........................................68

5. Trouble shooting .......................................... 69

5.1 Trouble shooting test setup ........................................69

5.2. Power on trouble ......................................................70

5.3 Charging Trouble .......................................................73

5.4 USB Trouble ..............................................................75

5.5 SIM Detect Trouble ....................................................78

5.6 Qwerty Key Sense Trouble ..........................................81

5.7 Slide Key sense Trouble .............................................83

5.8 Keypad backlight Trouble ...........................................84

5.9 Micro SD Trouble .......................................................86

5.10 Audio Trouble ..........................................................88

5.11 Microphone Trouble .................................................92

5.12 Camera Trouble .......................................................94

5.13 Main LCD Trouble ....................................................96

5.14 Bluetooth Trouble .....................................................98

5.15 RF Component ......................................................101

5.16 GSM PATH ............................................................103

5.17 Trouble Shooting of GSM Part .................................103

5.18 Trouble Shooting of WCDMA Part ............................112

6. Download & S/W upgrade ......................... 118

7. BLOCK DIAGRAM ........................................ 148

8. CIRCUIT DIAGRAM ...................................... 149

9. BGA Pin Map .............................................. 157

10. PCB LAYOUT .............................................161

11. RF Calibration .......................................... 167

11.1. Test Equipment Setup ...........................................167

11.2. Calibration Step ....................................................167

12. EXPLODED VIEW & REPLACEMENT

PART LIST ................................................ 173

12.1 EXPLODED VIEW ...................................................173

12.2 Replacement Parts ................................................175

12.3 Accessory ............................................................. 201

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Only for training and service purposes

- 5 -

LGE Internal Use Only

1. INTRODUCTION

1.1.Purpose

This manual provides the information necessary to repair, calibration, description and download the

features of the GW520.

1.2.Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,

persons other than your company’s employees, agents, subcontractors, or person working on your

company’s behalf) can result in substantial additional charges for your telecommunications services.

System users are responsible for the security of own system.

There might be risks of toll fraud associated with your telecommunications system. System users are

responsible for programming and configuring the equipment to prevent unauthorized use. LGE does

not warrant that this product is immune from the above case but will prevent unauthorized use of

common carrier telecommunication service of facilities accessed through or connected to it. LGE will

not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly

causing harm or interruption in service to the telephone network, it should disconnect telephone

service until repair can be done. A telephone company may temporarily disconnect service as long as

repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these

changes could reasonably be expected to affect the use of the GW520 or compatibility with the net

work, the telephone company is required to give advanced written notice to the user, allowing the user

to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the GW520 must be performed only by the LGE or its authorized agent.

The user may not make any changes and/or repairs expect as specifically noted in this manual.

Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system

and may void any remaining warranty.

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Only for training and service purposes

1. INTRODUCTION

GW520 service manual

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local

regulatory agencies. In accordance with these agencies, you may be required to provide information

such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly

different.

G. Interference and Attenuation

GW520 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from

unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following

information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards.

• When repairs are made to a system board, they should spread the floor with anti-static mat which is

also grounded.

• Use a suitable, grounded soldering iron.

• Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as

described.

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LGE Internal Use Only

1. INTRODUCTION

GW520 service manual

1.3. ABBREVIATION

For the purposes of this manual, following abbreviations apply:

◆

APC Automatic Power Control

◆

BB Baseband

◆

BER Bit Error Ratio

◆

CC-CV Constant Current – Constant Voltage

◆

CLA Cigar Lighter Adapter

◆

DAC Digital to Analog Converter

◆

DCS Digital Communication System

◆

dBm dB relative to 1 milli-watt

◆

DSP Digital Signal Processing

◆

EEPROM Electrical Erasable Programmable Read-Only Memory

◆

EGPRS Enhanced General Packet Radio Service

◆

EL Electroluminescence

◆

ESD Electrostatic Discharge

◆

FPCB Flexible Printed Circuit Board

◆

GMSK Gaussian Minimum Shift Keying

◆

GPIB General Purpose Interface Bus

◆

GPRS General Packet Radio Service

◆

GSM Global System for Mobile Communications

◆

IPUI International Portable User Identity

◆

IF Intermediate Frequency

◆

LCD Liquid Crystal Display

◆

LDO Low Drop Output

◆

LED Light Emitting Diode

◆

LGE LG Electronics

◆

OPLL Offset Phase Locked Loop

◆

PAM Power Amplifier Module

◆

PCB Printed Circuit Board

◆

PGA Programmable Gain Amplifier

◆

PLL Phase Locked Loop

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Only for training and service purposes

1. INTRODUCTION

GW520 service manual

◆

PSTN Public Switched Telephone Network

◆

RF Radio Frequency

◆

RLR Receiving Loudness Rating

◆

RMS Root Mean Square

◆

RTC Real Time Clock

◆

SAW Surface Acoustic Wave

◆

SIM Subscriber Identity Module

◆

SLR Sending Loudness Rating

◆

SRAM Static Random Access Memory

◆

STMR Side Tone Masking Rating

◆

TA Travel Adapter

◆

TDD Time Division Duplex

◆

TDMA Time Division Multiple Access

◆

UART Universal Asynchronous Receiver/Transmitter

◆

VCO Voltage Controlled Oscillator VCTCXO

◆

Voltage Control Temperature Compensated Crystal

Oscillator

◆

WAP Wireless Application Protocol

◆ 8PSK 8 Phase Shift Keying

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LGE Internal Use Only

2. PERFORMANCE

GW520 service manual

2.1 Supporting Standard

2.2 Main Parts : Solution

Item Part name Comment

Baseband Chip PMB8878 (Infineon)

PMIC PMB6821 (Infineon)

RF chip PMB6952 (Infineon)

Item Feature Comment

Supporting Standard WCDMA 900 / WCDMA 2100

GSM850/EGSM/DCS/PCS with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, A-E

Frequency Range GSM850 TX : 824 - 849MHz

GSM850 RX : 869 - 894MHz EGSM TX : 880 - 915 MHz EGSM RX : 925 - 960 MHz DCS TX : 1710 - 1785 MHz DCS RX : 1805 - 1880 MHz PCS TX : 1850 - 1910 MHz PCS RX : 1930 - 1990 MHz WCDMA900 TX : 880 - 915 MHz WCDMA900 RX : 925 - 960 MHz WCDMA2100 TX : 1920 - 1980 MHz WCDMA2100 RX : 2110 - 2170 MHz

Application Standard WAP 2.0, JAVA 2.0

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Only for training and service purposes

2. PERFORMANCE

2.3 H/W features

Item Feature Comment

Form Factor Color LCD – Slide

1)Capacity : Li-Polymer, 950mAh

Battery

2) Packaging Type : Standard

Item Feature Comment

Size 104.5 x 54 x 16.75 mm

Weight 130 g With Battery

GSM > 250 hours @paging period 5 Stand-by

time

WCDMA > 250hours @DRX=7

GSM >160mins @ Tx level 5

WCDMA >160mins @Tx=12dBm

Talk time

Charging

time

3 hours @power OFF/950mAh

Rx sensitivity GSM850 : < -105dBm

EGSM900 : < -105 dBm

DCS1800 : < -105 dBm

PCS1900 : < -105 dBm

WCDMA 900/2100 : < -106.7 dBm

GSM/

GPRS

GSM850 : 32.5 dBm

EGSM900 : 32.5 dBm

DCS1800 : 29.5 dBm

PCS1900 : 29.5 dBm

Class4(GSM850)

Class4 (EGSM900)

Class1(DCS)

Class1(PCS)

TX output

power

EDGE GSM850 : 27dBm

EGSM900 : 27 dBm

DCS1800 : 26 dBm

PCS1900 : 26 dBm

E2(GSM850)

E2 (EGSM900)

E2 (DCS)

E2 (PCS)

GPRS compatibility GPRS Class 12

EDGE compatibility EDGE Class 12

Display Main LCD

(2.8”, 240 x 400 Pixels)/TFT

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LGE Internal Use Only

2. PERFORMANCE

GW520 service manual

Built-in Camera 5 Mega pixel

ANT Main & Sub : Internal Fixed Type

System connector 5 Pin uUSB

Ear Phone Jack 5pin uUSB Type

PC synchronization Yes

Speech coding FR, EFR, HR, AMR

Vibrator Built in Vibrator

Blue Tooth V2.1 with A2DP

Voice Recording Yes

Speaker Phone mode

Support

Yes

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable No TBD

T-Flash Yes Not Equipped

3 Mega pixel

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Only for training and service purposes

2. PERFORMANCE

GW520 service manual

2.4 HW Spec.

GSM Transmitter/Receiver spec.

Item Specification

Frequency

GSM 850 TX : 824 - 849 MHz RX : 869 - 894 MHz

EGSM TX : 880 - 915 MHz RX : 925 - 960 MHz

DCS TX : 1710 - 1785 MHz RX : 1805 - 1880 MHz

PCS TX : 1850 - 1910 MHz RX : 1930 - 1990 MHz

Phase Error

Rms : 5°

Peak : 20 °

Frequency Error

GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission

Disturbance)

GSM/DCS : < -28dBm

Transmitter Output power and

Burst Timing

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

Burst Timing <3.69us

Spectrum due to modulation out

to less than 1800kHz offset

200kHz : -36dBm

600kHz : -51dBm/-56dBm

Spectrum due to modulation out

to larger than 1800kHz offset to

the edge of the transmit band

GSM : 1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS : 1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching

transient

400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection –

Speech channels

± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)

AM Suppression

- GSM : -31dBm - DCS : 29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T

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LGE Internal Use Only

2. PERFORMANCE

GW520 service manual

WCDMA Transmitter spec.

Item Specification

Transmit Frequency WCDMA900 : 880 MHz ~915 MHz

WCDMA2100 : 1920 ~1980 MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage

Power Ratio (ACLR)

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

Spurious Emissions

|f-fc| > 12.5 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz

< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBc

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error

< -15 dB at Pout t -20 dBm

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Only for training and service purposes

2. PERFORMANCE

GW520 service manual

WCDMA Receiver spec.

Item Specification

Receive Frequency WCDMA900 : 925 MHz ~ 960 MHz

WCDMA2100 : 2110 ~2170 MHz

Reference Sensitivity Level BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

A

djacent Channel Selectivity

(ACS)

ACS > 33 dB where BER < 0.001

when Îor = -92.7 dBm / 3.84 MHz &

Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

Spurious Response BER < 0.001 when Îor = -103.7 dBm /

3.84 MHz & Iblocking = -44 dBm

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control In

Uplink

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24

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LGE Internal Use Only

2. PERFORMANCE

GW520 service manual

Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

Maximum Output Power

3GPP Not CompleteError Vector Magnitude

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

Adjacent Channel Leakage Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Spectrum Emission Mask

HS-DPCCH

880 MHz ~ 915 MHz 1920MHz ~ 1980 MHz

Transmit Frequency

SpecificationItem

+/- 2.35End of CQI4

+/- 0.60Middle of CQI3

+/- 0.61Start of CQI2

+/- 2.36Start of Ack/Nack1

5

Transmitter power step

tolerance

[dB]

Power

step size,

P [dB]

Power step slot boundary

Power

step

Sub-

test in

table

C.10.1.

4

1 MHz-49dBc8.5 ~ 12.5 MHz

1 MHz-35-10×(△f-7.5)dBc7.5 ~ 8.5 MHz

1 MHz-35-1×(△f-3.5)dBc3.5 ~ 7.5 MHz

30 kHz-35-15×(△f-2.5)dBc2.5 ~ 3.5 MHz

Measurement

Bandwidth

Minimum requirement

Frequency offset from

carrier △f

Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz

Maximum Output Power

3GPP Not CompleteError Vector Magnitude

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz

Adjacent Channel Leakage Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Spectrum Emission Mask

HS-DPCCH

880 MHz ~ 915 MHz 1920MHz ~ 1980 MHz

Transmit Frequency

SpecificationItem

+/- 2.35End of CQI4

+/- 0.60Middle of CQI3

+/- 0.61Start of CQI2

+/- 2.36Start of Ack/Nack1

5

Transmitter power step

tolerance

[dB]

Power

step size,

P [dB]

Power step slot boundary

Power

step

Sub-

test in

table

C.10.1.

4

1 MHz-49dBc8.5 ~ 12.5 MHz

1 MHz-35-10×(△f-7.5)dBc7.5 ~ 8.5 MHz

1 MHz-35-1×(△f-3.5)dBc3.5 ~ 7.5 MHz

30 kHz-35-15×(△f-2.5)dBc2.5 ~ 3.5 MHz

Measurement

Bandwidth

Minimum requirement

Frequency offset from

carrier △f

HSDPA Tx Frequency spec.

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

Maximum Input Level (BLER or R), 16QAM Only

925 MHz ~ 960 MHz 2110 MHz ~2170 MHz

Receive Frequency

SpecificationItem

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

Maximum Input Level (BLER or R), 16QAM Only

925 MHz ~ 960 MHz 2110 MHz ~2170 MHz

Receive Frequency

SpecificationItem

GW520 service manual

HSDPA Tx Frequency spec.

HSDPA Rx Frequency spec.

- 16 -

Only for training and service purposes

2. PERFORMANCE

Bluetooth spec.

Item Specification

Output Power(TRM/CA/01/C) Class2 : -6 dBm < Pav < 4 dBm

Power Density(TRM/CA/02/C) Power density < 100mW(20dBm) per 100kHz EIRP

Power Control(TRM/CA/03/C) Step size of the power control : 2dB <step size<8dB

TX Output Spectrum-Frequency Range(TRM/CA/04/C)

2.4000 GHz ~ 2.4835 GHz

TX Ouptut Spectrum-20 dB Bandwidth(TRM/CA/05/C)

│ f (H) - f (L) │≤ 1.0MHz

TX Output Spectrum-Adjacent Channel power(TRM/CA/06/C)

PTX(f) ≤ -20dBm for │M – N │ = 2 PTX(f) ≤ -40dBm for │M – N │≥3

Modulation Characteristics(TRM/CA/07/C)

140KHz ≤ delta f1 max ≤ 175KHz △ f2 max ≥ 115KHz (△ f2 avg /△ f1 avg) ≥ 0.8

Initial Carrier Frequency Tolerance(TRM/CA/08/C) Ftx – 75kHz ≤ f0 ≤ ftx + 75kHz

Carrier Frequency Drift(TRM/CA/09/C)

DH 1 ≤±25 kHz DH 2 ≤±40 kHz DH 3 ≤±40 kHz Max. Drift Rate (DH 1/DH3/DH5) ( / 50 us) ≤ 20 kHz

Sensitivity-Single Slot PaCKET(RCV/CA/01/C)

BER ≤ 0.1% (min # of samples, 1600000 returned payload bits)

Sensitivity-Multi Slot Packet(RCV/CA/02/C)

BER ≤ 0.1% (min # of samples, 1600000 returned payload bits)

C/I Performance(RCV/CA/03/C) BER ≤ 0.1%

Blocking Performance(RCV/CA/04/C)

BER ≤ 0.1% (min # of samples, 1600000 returned payload bits)

# of freq. recorded in step v ≤ 24 # of freq. recorded in step v1 ≤ 5

Intermodulation Performance(RCV/CA/05/C) BER ≤ 0.1%

Maximum Input Level(RCV/CA/06/C)

BER ≤ 0.1% (min # of samples, 1600000 returned payload bits)

페이지삭제후아래 삽입

- 17 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

3.1 Functional Block Diagram

[Figure 3.1] Functional Block Diagram

XMM6080

(HSDPA)

CAMERA (3M)

USB2.0

FULL

Micro

SD

Main key

LED

SPEAKER

MOTOR

LCD(WqVGA)

USIM

NAND DATA

I2C

UART1

RX ADC

TX DAC

UART

VIB_DRV_N

MMC I/F

SDRAM_ DATA

EBU_ ADDR

UART0

D(0:15)

I2S

RF

PAM

FEM

Filter

BT

அ

FM Radio

Audio AMP

I2C

USIM I/F

Audio Out

SDRAM

1Gbit

NAND

Flash 2Gbit

USB

A(0:24)

D(0:7)

8bit

LCD

32K

26M

FM Audio

Touch

Screen

3-Axis

Sensor

32K

PMB

6821

(PMIC)

I2C

Battery

QWERTY

KEY

Encoder

I2C

MIC

Mic In

I2C

MUIC

Receiver

I2C

- 18 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

3.2 Baseband Processor Introduction

[Figure 3.2] Top level block diagram of S-GOLD®3H(PMB8878)

- 19 -

LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

3.2.1 General description

S-GOLD®3H is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a

mixed signal baseband IC combined with a 3G coprocessor IC, providing all analog and digital

functionality for a dual mode mobile phone in a single chip. Both ICs building up the S-GOLD®3H SiP are manufactured in infineon Technologies` 1.35V 90nm

CMOS technology to meet the ever increasing demands of the market for feature rich and high

performance terminals at low costs.

The chip will support the FR, EFR, HR and AMR-NB vocoding.

S-GOLD®3H support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data

application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external

hardware.

3.2.2. Block Description

z Processing core

- ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,

and the Jazelle Java extension for Java acceleration and a MOVE co-processor to accelerate

Motion Estimation algorithms with based video encoding schemes..

- TEAKLite DSP core

z ARM9-Memory

- 32k Byte Boot ROM on the AHB

- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM

- 32k Byte Instruction Cache

- 32k Byte Data Cache

- 8k Byte Instruction Tightly coupled Memory (I-TCM)

- 8k Byte Data tightly coupled memory (D-TCM)

z TEAKLite®-Memory

- 120k x 16bit Program ROM

- 8k x 16bit Program RAM

- 72k x 16bit Data ROM

- 48k x 16bit Data XRAM

- 5k x 16bit Data YRAM

- Incremental Redundancy(IR) Memory of 35904 words of 16bit

- 20 -

Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

z Shared Memory Block

1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite®.

z Controller Bus system

The processor cores and their peripherals are connected by powerful buses.

- Multi-layer AHB for connecting the ARM and the other master capable building blocks with the

internal and external memories and with the peripheral buses.

- An FPI-Bus for connecting GSM peripherals, called hereafter FPI3 bus.

- A controller FPI bus for connecting the low performance controller peripherals such as keypad

etc. called hereafter fPI2 bus.

- FPI2 and FPI3 are connected asynchronously to the AHB buses. 1 DMA controller with

8channels offloads the controller from data transfers.

- 2 AHB Lite buses for connecting multi-media and high performance peripherals, called

AHB_PER1 and AHB_PER2 hereafter. These peripheral buses are connected to the multi-layer

AHB ‘backbone’ by asynchronous, burst capable AHB2AHB bridges which are shared between

accessing masters.

- The DMA controller is enabled to access AHB_PER1 by use of its first master interface and

AHB_PER2 by its second master interface.

z TEAKLite® Bus System

- 1 TEAKLite® data bus for connecting the TEAKLite® data memory and the TEAKLite® peripherals.

Also the data bus is connected into the controller system via shared RAMs to the FPI3 bus.

- 1 TEAKLite® program bus for connecting the TEAKLite® program memory to the TEAKLite®.

z Clock system

The clock system allows widely independent selection of frequencies for the essential parts of the S-

GOLD®3H. Thus power consumption and performance can be optimized for each application.

z Functional Hardware block

- CPU and DSP Timers

- MOVE coprocessor performing motion estimation for video encoding algorithms

(H.263, MPEG-4)

- Programmable PLL with four additional phase shifters for system clock generation

- GSM Timer Module that off-loads the CPU from radio channel timing

- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)

· GMSK Modulator: gauss-filter with B*T=0.3

· EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter

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LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

- Hardware accelerators for equalizer and channel decoding.

- Incremental Redundancy memory for EDGE class 12 support

- A5/1, A5/2, A5/3 Cipher unit

- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission

- f8 and f9 Cipher unit

- Advanced static and dynamic power management features including TDMA-Frame

synchronous low-power mode and enhanced CPU modes(idle and sleep modes)

- 2D engine for support of image processing and 2D graphics applications. The 2D engine is tightly

coupled to the display interface. The resulting building block consisting of 2D engine and Display

interface is called Display Content Controller (DCC)

- Security crypto box supporting

· AES, DES, 3 DES

· Hash function

· RSA acceleration

· Secret Root Key (e-fuse) and Key Management

· True Random Number Generator

- Sample Rate Converter (SRC) for audio up-sampling

- Comprehensive static and dynamic Power Management

· Various frequency options during operation mode

· 32 kHz clock in standby mode

· Sleep control in standby mode

· RAMs and ROMs in power save mode during standby mode

· Additional leakage current reduction in standby mode possible by switching off for the

TEAKLitre® subsystem.

- Extensive debug support for the controller and the DSP system

· OCDS level 2+ (run control, non-intrusive program flow trace and limited data flow

trace) for ARM

· OCDS level 1+ (run control, limited program flow trace) for the TEAKLite®

· Multi-core debug support

· 4 Monitor pins for important internal signals and most pad signals

· Cerberus debugging unit

- 2 General Purpose Timers with 3 32-bit timers

- Serial number

- A real time clock with alarm functions

- 2 capture/compare units with 16 channels. One channel active during sleep mode.

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Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

z 3G Coprocessor Subsystem

- ARM7 TRMI-S

· 240 kByte Instruction RAM

· 64 kByte Data RAM

· 8 kByte Boot ROM

- 20kByte Communication RAM

- HW accelerators for

· Transmit Path

· Inner and Outer Receiver for Release5 incl. HSDPA

3.2.3 RF Interface(T_OUT)

S-Gold® 3H uses this interface to control RF IC and Peripherals.

[Table 3.2.3-1] RF Interface Spec.

T_OUT Resource Interconnection Description

T_OUT0 TXON_PA PAM Power on

T_OUT1 -

T_OUT2 ANT_SEL1

T_OUT3

T_OUT4 FEM control

T_OUT5 FEM control

T_OUT6 PA_MODE PAM Mode select

T_OUT7 ANT_SEL2

T_OUT8 ANT_SEL3

T_OUT9

T_OUT10

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LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

3.2.4 ADC channel

ADC block is composed of 11 external ADC channel. This block operates charging process and other

related process by reading battery voltage and other analog values.

[Table 3.2.4-1] S-Gold3 ADC channel usage

ADC channel Resource Interconnection Description

M0 BAT_ID Battery temperature measure

M1 RF_TEMP RF block temperature measure

M2 N.C

M3 N.C

M4 LCD_ID

M5 N.C

M6 N.C

M7 H/W VERSION H/W version detect

M8 VBAT Battery supply voltage measure

M9 N.C

M10 N.C

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Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

3.2.5 GPIO map

Over a hundred allowable resources, GW520 is using as follows except dedicated to SIM and Memory.

GW520 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,

is shown in below table

[Table 3.2.5-1] S-Gold®3H GPIO pin Map

GW520 service manual

Port Function Net Name Description

KEY MATRIX

KP_IN0

NA

KP_IN1

KEY_12C_SCL

KP_IN2

KEY_12C_SDA

KP_IN3

KEY_INT

KP_IN4

TP(NA)

KP_IN5

ACCEL_INT

KP_IN6

NA

KP_OUT0

VGA_PWDN

KP_OUT1

12C3_SCL

KP_OUT2

12C3_SDA

KP_OUT3

LIN_INVERTER

USIF1

USIF1_RXD_MRST

UART_RX UART Data

USIF1_TXD_MTSR

UART_TX UART Data

USIF1_RTS_N

USB_ DAT_VP USB Data

USIF1_CTS_N

USB_SE0_VM USB Data

USIF2

USIF2 _RXD_MRST

TP(NA)

USIF2 _TXD_MTSR

RPWRON_DBB

USIF2_RTS_N

UART_BT_RTS Bluetooth RTS

USIF2_CTS_N

UART_BT_CTS Bluetooth CTS

USIF3

USIF3_RXD_MRST(EINT6)

UART_BT_RX Bluetooth UART Data

USIF3 _TXD_MTSR

UART_BT_TX Bluetooth UART Data

USIF3_SCLK

LIN_MOTOR_EN

CLK

CLK32K

CLK32k For FM Radio, BT CLK32K

CLK26M

TO THE FLIPFLOP(CLK26M)

I2C3_SCL

I2C3_SDA

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LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

CAMERA I/F

CIF_D0

CIF_D0 CAMERA_DATA

CIF_D1

CIF_D1 CAMERA_DATA

CIF_D2

CIF_D2 CAMERA_DATA

CIF_D3

CIF_D3 CAMERA_DATA

CIF_D4

CIF_D4 CAMERA_DATA

CIF_D5

CIF_D5 CAMERA_DATA

CIF_D6

CIF_D6 CAMERA_DATA

CIF_D7

CIF_D7 CAMERA_DATA

CIF_PCLK

CIF_PCLK CAMERA_PCLK

CIF_HSYNC

CIF_HSYNC CAMERA_HSYNC

CIF_VSYNC

CIF_VSYNC CAMERA_VSYNC

CLKOUT2

CIF_MCLK CAMERA_MCLK (26M CLK)

CIF_PD

M_CAM_PD

CIF_RESET

CAM_RESET

LCD I/F

DIF_D0

LCD_DATA(0) LCD_DATA

DIF_D1

LCD_DATA(1) LCD_DATA

DIF_D2

LCD_DATA(2) LCD_DATA

DIF_D3

LCD_DATA(3) LCD_DATA

DIF_D4

LCD_DATA(4) LCD_DATA

DIF_D5

LCD_DATA(5) LCD_DATA

DIF_D6

LCD_DATA(6) LCD_DATA

DIF_D7

LCD_DATA(7) LCD_DATA

DIF_D8

SHIFT_LED

DIF_CS1

LCD_CSn LCD SELECT

DIF_CS2

N.A

DIF_CD

LCD_CD LCD ADDRESS

DIF_WR

LCD_WRn LCD WRITE

DIF_RD

LCD_RDn LCD READ

DIF_HD

CAM_LDO_EN

DIF_VD

LCD_VSYNC

DIF_RESET1

LCD_RESET LCD_RESET

DIF_RESET2

A_RESET 3G reset

I2C

I2C1_SCL

I2C1_SCL For PMIC & AUDIO AMP

I2C1_SDA

I2C1_SDA For PMIC & AUDIO AMP

PM_INT

PM_INT For PMIC

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Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

I2C2_SCL

I2C2_SCL FOR CAMERA,TOUCH, 3-AXIS ACCEL……

I2C2_SDA

I2C2_SDA FOR CAMERA,TOUCH, 3-AXIS ACCEL……

SIM I/F

CC_IO

SIM_IO SIM CARD DATA

CC_CLK

SIM_CLK SIM CARD CLOCK

CC_RST

SIM_RST SIM CARD RESET

I2S2

I2S2_CLK0 (GPIO_31)

BT_RESET_N Bluetooth reset

I2S2_CLK1 (GPIO_102)

DBB_BT_INT DBB_WAKEUP

I2S2_RX (GPIO_32)

LIN_PWM_MAG MOTER OPERATION

I2S2_TX (GPIO_33)

BT_INT BT_WAKEUP

I2S2_WA0 (GPIO_34)

TORCH_INT TOUCH INTERRUPT

I2S2_WA1 (GPIO_103)

QWERTY_KEY_EN QWERTY_KEY_ENABLE

External Memory

MMCI1_CMD

MMC_CMD

MMCI1_DAT[0]

MMC_D0

MMCI1_CLK

MMC_CLK

MMC1_DAT[1]

MMC_D1

MMC1_DAT[2]

MMC_D2

MMC1_DAT[3]

MMC_D3

MMCI2_CMD (GPIO_22)

MUIC_INT

MMCI2_DAT[0] (GPIO_107)

LCD_BL_CTRL

MMCI2_CLK (GPIO_108)

FN_LED

IrDA

IrDA_TX (GPIO_110)

USB_OEn For USB

IrDA_RX (GPIO_111)

SLIDE_DETECT Slide on/off detect

I2S1

I2S1_CLK0

BT_PCM_CLK For Bluetooth

I2S1_CLK1

N.A

I2S1_RX

BT_PCM_RX For Bluetooth

I2S1_TX

BT_PCM_TX For Bluetooth

I2S1_WA0

BT_PCM_SYNC For Bluetooth

Audio I/F

EPN1

REC_N For Receiver

EPP1

REC_P For Receiver

EPPA1

EAR_SPK_P For SPK &Headset

EPREF

N.A Reference

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LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

EPPA2

EAR_SPK_N For SPK & Headset

MICN1

MIC_N For Main Mic

MICP1

MIC_P For Main Mic

MICN2

HS_MIC_N For Headset Mic

MICP2

HS_MIC_P For Headset Mic

VMICP

VMIC_P Power for MIC

VMICN

VMIC_GND Ground for MIC

ADC

M0

BAT_ID Battery temperature measure

M1

RF_TEMP RF block temperature measure

M2

N.A

M3

N.A

M4

LCD ID LCD BANDER DETECT

M5

N.A

M6

N.A

M7

N.A

M8

VBAT

M9

TP(N.A)

M10

N.A

Reference

VREFP

VREFN

IREF

GND

JTAG I/F

JTAG0_TDO

TDO

JTAG0_TDI

TDI

JTAG0_TMS

TMS

JTAG0_TCK

TCK

JTAG0_TRST_n

TRST_n

JTAG0_RTCK

RTCK

JTAG1_TDO

A_TDO

JTAG1_TDI

A_TDI

JTAG1_TMS

A_TMS

JTAG1_RTCK

A_RTCK

JTAG1_TRST_n

A_TRSTn

ETM I/F

TRIG_IN

TRIG_IN , 2V62_VIO

MON1

2V62_VIO ETM

MON2

GND ETM

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Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

TRACESYNC

TRACECLK

PIPESTAT[2]

PIPESTAT2

PIPESTAT[1]

PIPESTAT1

PIPESTAT[0]

PIPESTAT0

TRACEPKT[0]

TRACEPKT0

TRACEPKT[1]

TRACEPKT1

TRACEPKT[2]

TRACEPKT2

TRACEPKT[3]

TRACEPKT3

TRACEPKT[4]

TRACEPKT4

TRACEPKT[5]

TRACEPKT5

TRACEPKT[6]

TRACEPKT6

TRACEPKT[7]

TRACEPKT7

Memory

MEM_AD[0]

NAND_IO(0)

MEM _AD[1]

NAND_IO(1)

MEM _AD[2]

NAND_IO(2)

MEM _AD[3]

NAND_IO(3)

MEM _AD[4]

NAND_IO(4)

MEM _AD[5]

NAND_IO(5)

MEM _AD[6]

NAND_IO(6)

MEM _AD[7]

NAND_IO(7)

MEM _AD[8]

NAND_IO(8)

MEM _AD[9]

NAND_IO(9)

MEM _AD[10]

NAND_IO(10)

MEM _AD[11]

NAND_IO(11)

MEM _AD[12]

NAND_IO(12)

MEM _AD[13]

NAND_IO(13)

MEM _AD[14]

NAND_IO(14)

MEM _AD[15]

NAND_IO(15)

MEM _WR_n

_WR

MEM _RD_n

_RD

MEM _BC0_n

_BC0

MEM _BC1_n

_BC1

MEM _BC2_n

LDQS

MEM _BC3_n

UDQS

MEM _A[0]

SD-DATA(0) SDRAM DATA

MEM _A[1]

SD_DATA(1)

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LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

MEM _A[2]

SD_DATA(2)

MEM _A[3]

SD_DATA(3)

MEM _A[4]

SD_DATA(4)

MEM _A[5]

SD_DATA(5)

MEM _A[6]

SD_DATA(6)

MEM _A[7]

SD_DATA(7)

MEM _A[8]

SD_DATA(8)

MEM _A[9]

SD_DATA(9)

MEM _A[10]

SD_DATA(10)

MEM _A[11]

SD_DATA(11)

MEM _A[12]

SD_DATA(12)

MEM _A[13]

SD_DATA(13)

MEM _A[14]

SD_DATA(14)

MEM _A[15]

SD_DATA(15)

MEM _A[16]

SD_ADD(0) SDRAM ADDRESS

MEM _A[17]

SD_ADD(1)

MEM _A[18]

SD_ADD(2)

MEM _A[19]

SD_ADD(3)

MEM _A[20]

SD_ADD(4)

MEM _A[21]

SD_ADD(5)

MEM _A[22]

SD_ADD(6)

MEM _A[23]

SD_ADD(7)

MEM _A[24]

SD_ADD(8)

MEM _A[25]

SD_ADD(9)

MEM _A[26]

SD_ADD(10)

MEM_CSA0_N

SD_ADD(11)

MEM_CSA1_N

SD_ADD(12)

MEM_CSA2_N

SD_ADD(13)

MEM_CSA3_N

BA0

MEM _CS0_n

_NAND_CS

MEM _CS1_n

_RAM_CS

MEM _CS2_n

TP(N.A)

MEM _CS3_n

_CS3

MEM _ADV_n

BA1

MEM _RAS_n

_RAS

MEM _CAS_n

_CAS

MEM _WAIT_n

_WAIT

MEM _SDCLK0

SDCLKO For Burst mode

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Only for training and service purposes

3. BB Circuit Technical brief

GW520 service manual

MEM _BFCLK01

BFCLKO For Burst mode

MEM _BFCLK02

SDCLKI For Burst mode

MEM _CKE

CKE

Memory

FCDP_RBn

FCDP

FWP (GPIO_60)

_WP

TDMA I/F

T_OUT0

TXON_PA PAM

T_OUT1

N.A

T_OUT2

ANT_SEL1

T_OUT3 (GPIO_46)

SLIDE_KEY_LED

T_OUT4 (GPIO_47)

_CHG_EOC Charging terminate signal

T_OUT5 (GPIO_48)

MMC_DETECT SD card detect

T_OUT6

PA_MODE PAM

T_OUT7

ANT_SEL2

T_OUT8

ANT_SEL3

T_OUT9 (I2C2_SDA)

TOUCH_SDA

T_OUT10

DSR

T_IN0 (I2C2_SCL)

TOUCH_SCL

T_IN1 (GPIO_55)

CHG_EN Charging enable signal

RF I/F

RF_STR0

2G_EN

RF_STR1

_PPR Charger detect

RF_DATA

2G_DATA

RF_CLK

2G_CLK

GPIO[7]

3G_LD

GPIO[10]

3G_MASTER_ON

GPIO[15]

3G_PA_MODE1

GPIO[16]

ANT_SEL4

GPIO[17]

ANT_SEL5

GPIO[18]

ANT_SEL6

System Port

AFC

TO THE FLIPFLOP(AFC)

CLKOUT0

TO THE PLIPFLOP(26Mhz)

F26M

26MHZ 26M Main Clock

F32K

TO THE CRYSTAL(32.768khz)

to 32k crystal

OSC32K

TO THE CRYSTAL(32.768khz)

to 32k crystal

RESET_N

_RESET

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LGE Internal Use Only

3. BB Circuit Technical brief

GW520 service manual

RSTOUT_N

N.A

RTC_OUT

SPCU_RQ_IN1

BT_VCXO_EN

SPCU_RC_OUT0

PM_VCXO_EN

DSP

DSPIN0

CLK32K

DSPOUT1

WDOG

DSPIN1

LIN_PWM_FREQ

GW520 service manual

3.3 Power management IC

3.3.1 General Description

SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has

been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon

SGOLD

baseband device it is suitable for the S-GOLD lite and the E-GOLD+ baseband devices as well.

It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the

Bluemoon Single, Infineon’s single chip solution for Bluetooth. If used with S-GOLD3 it provides all

power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone

minimizing external device count.

Block Description

• Highly efficient step-down converter for main digital baseband supply including Core, DSP and

memory interface (External Bus Unit).

• Support of S-GOLD standby power-down concept

• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices

• Voltage independent switching of two SIM cards

• LDO regulators for baseband I/O supply

• LDO regulator for analog mixed-signal section of S-GOLD

• Low-noise LDO regulators for RF devices

• Supply for Bluemoon Single, Infineon’s single chip solution for Bluetooth

• Audio amplifier 8 Ohms for handsfree operation and ringing