Intel BXNUC8I5INHJA Manual

4 (1)

Intel® NUC Products

NUC8i5INH / NUC8i7INH

Technical Product Specification

Regulatory Models: NUC8IN

The Intel NUC Products NUC8i5INH/NUC8i7INH may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel NUC Products NUC8i5INH/NUC8i7INH Specification Update.

Revision History

Revision

Revision History

Date

 

 

 

001

First release of Intel NUC Products NUC8i5INH/NUC8i7INH Technical Product

March 2019

 

Specification

 

 

 

 

002

First production release of the Intel NUC Products NUC8i5INH/NUC8i7INH

May 2019

 

Technical Product Specification

 

 

 

 

Disclaimer

This product specification applies to only the standard Intel® NUC Boards, Kits and Mini PCs with BIOS identifier INWHL357.0028.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

All Intel® NUC Boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

Intel NUC Boards and kits may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.

Intel, Pentium and Celeron are trademarks of Intel Corporation in the U.S. and/or other countries.

* Other names and brands may be claimed as the property of others.

Copyright 2019 Intel Corporation. All rights reserved.

iii

Intel NUC Products NUC8i5INH/NUC8i7INH

Technical Product Specification

Note: For this Technical Products Specification, the use of Intel NUC Products NUC8i5INH/NUC8i7INH

Board Identification Information

Basic Intel® NUC Board Identification Information

Intel NUC Board

AA Revision

BIOS Revision

Notes

 

 

 

 

NUC8i5INB

K29935-300

INWHL357.0028 or newer

1, 2

 

 

 

 

NUC8i7iNB

K29936-402

INWHL357.0028 or newer

1, 2

 

 

 

 

Notes:

1The AA number is found on a small label on the Front USB connectors.

2Intel® Core™ i5-8265U/ i7-8565U processor are used on this AA revision consists of the following component:

 

Device

 

Stepping

 

S-Spec Number(s)

 

 

 

 

 

 

 

 

 

W0

 

SREJR

 

 

 

 

 

 

 

Intel Core i5-8265U

 

W0

 

SREJQ

 

 

 

 

 

 

 

 

 

V0

 

SRFFX

 

 

 

 

 

 

 

Intel Core i7-8565U

 

W0

 

SREJP

 

 

 

 

 

 

 

V0

 

SRFFW

 

 

 

 

 

 

 

 

 

 

Product Identification Information

Intel® NUC Products NUC8i5INH/NUC8i7INH {x} Identification Information

Product Name

Intel® NUC Board

Differentiating Features

 

 

 

NUC8i5INHX

NUC8i5INB

8GB LPDDR3-2133 solder-down Memory with power

 

 

adapter

 

 

 

NUC8i5INHJA

 

HDD kit with power adapter, 16GB Intel® Optane™ Module,

 

 

1TB HDD, 8GB LPDDR3-2133 solder-down Memory,

 

 

Microsoft Windows 10 Home, “Intel® NUC 8 Home, a Mini

 

 

PC with Windows 10”

 

 

 

NUC8i5INHPA

 

SSD kit with power adapter, 256 M.2 SSD, 8GB LPDDR3-

 

 

2133 solder-down Memory, Microsoft Windows 10 Home,

 

 

“Intel® NUC 8 Home, a Mini PC with Windows 10”

 

 

 

NUC8i5INHP

NUC8i5INB

SSD kit with power adapter, 256GB M.2 SSD, 8GB LPDDR3-

 

 

2133 solder-down Memory

 

 

 

NUC8i7INHX

NUC8i7INB

8GB LPDDR3-2133 solder-down Memory with power

 

 

adapter

 

 

 

NUC8i7INHJA

 

HDD kit with power adapter, 16GB Intel® Optane™ Module,

 

 

1TB HDD, 8GB LPDDR3-2133 solder-down Memory,

 

 

Microsoft Windows 10 Home, “Intel® NUC 8 Home, a Mini

 

 

PC with Windows 10”

 

 

 

NUC8i7INHZ

 

HDD and SSD kit with power adapter, 1TB HDD and 256GB

 

 

M.2 SSD, 8GB LPDDR3-2133 solder-down Memory

 

 

 

iv

NUC8i7INHPA

 

SSD kit with power adapter, 256GB M.2 SSD, 8GB LPDDR3-

 

 

2133 solder-down Memory, Microsoft Windows 10 Home,

 

 

“Intel® NUC 8 Home, a Mini PC with Windows 10”

 

 

 

NUC8i7INHP

 

SSD kit with power adapter, 256GB M.2 SSD, 8GB LPDDR3-

 

 

2133 solder-down Memory

 

 

 

Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel NUC Products NUC8i5INH / NUC8i7INH.

Specification Changes or Clarifications

Date

Type of Change

Description of Changes or Clarifications

 

 

 

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://www.intel.com/content/www/us/en/nuc/overview.html for the latest documentation.

v

Intel NUC Products NUC8i5INH/NUC8i7INH

Technical Product Specification

Preface

This Technical Product Specification (TPS) specifies the layout, components, connectors, power and environmental requirements, and the BIOS for Intel® NUC Products NUC8i5INH/NUC8i7INH are with pre-installed Hard Drive Disk(HDD), Solid-state disk(SSD), Optane Memory, Soldereddown memory, and operating system.

Intended Audience

The TPS is intended to provide detailed technical information about Intel NUC Products NUC8i5INH/NUC8i7INH and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.

What This Document Contains

Chapter

Description

 

 

1

A description of the hardware used in Intel NUC Product NUC8i5INH/NUC8i7INH

 

 

2

A map of the resources of the Intel NUC Board

 

 

3

The features supported by the BIOS Setup program

 

 

4

A description of the front panel blink codes and BIOS error messages

 

 

5

The features of the Intel NUC Kits and Mini PCs

 

 

Typographical Conventions

This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attention to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

vi

Other Common Notation

#

Used after a signal name to identify an active-low signal (such as USBP0#)

 

 

bpp

Bits per pixel

 

 

GB

Gigabyte (1,073,741,824 bytes)

 

 

GBps

Gigabytes per second

 

 

Gbps

Gigabits per second

 

 

KB

Kilobyte (1024 bytes)

 

 

Kb

Kilobit (1024 bits)

 

 

kbps

1000 bits per second

 

 

MB

Megabyte (1,048,576 bytes)

 

 

MBps

Megabytes per second

 

 

Mb

Megabit (1,048,576 bits)

 

 

Mbps

Megabits per second

 

 

TDP

Thermal Design Power

 

 

xxh

An address or data value ending with a lowercase h indicates a hexadecimal value.

 

 

x.x V

Volts. Voltages are DC unless otherwise specified.

*This symbol is used to indicate third-party brands and names that are the property of their respective owners.

vii

Contents

Revision History..............................................................................................................

iii

Note: For this Technical Products Specification, the use of Intel NUC Products

 

NUC8i5INH/NUC8i7INH...........................................................................................................................

iv

Board Identification Information.....................................................................................................................

iv

Product Identification Information.................................................................................................................

iv

Errata............................................................................................................................................................................

v

Preface ..............................................................................................................................

 

vi

Intended Audience................................................................................................................................................

vi

What This Document Contains........................................................................................................................

vi

Typographical Conventions ..............................................................................................................................

vi

Contents ...........................................................................................................................

 

ix

1 Product Description ...............................................................................................

13

1.1

Overview ......................................................................................................................................................

13

 

1.1.1

Feature Summary ..................................................................................................................

13

 

1.1.2

Board Layout (Top) ...............................................................................................................

15

 

1.1.3

Board Layout (Bottom) ........................................................................................................

17

 

1.1.4

Block Diagram.........................................................................................................................

19

1.2

Online Support..........................................................................................................................................

20

1.3

Processor.....................................................................................................................................................

20

1.4

Graphics Capabilities ..............................................................................................................................

21

 

1.4.1

AMD Radeon™ 540X Graphics..........................................................................................

21

 

1.4.2

High Definition Multimedia Interface* (HDMI*) .........................................................

21

 

1.4.3

Mini DisplayPort* (mDP*)....................................................................................................

21

1.5

USB.................................................................................................................................................................

 

22

1.6

SATA Interface...........................................................................................................................................

22

 

1.6.1

AHCI Mode................................................................................................................................

22

1.7

Real-Time Clock Subsystem................................................................................................................

23

1.8

Audio Subsystem .....................................................................................................................................

24

1.9

LAN Subsystem.........................................................................................................................................

25

 

1.9.1

Intel® WGI219V Gigabit Ethernet Controller..............................................................

25

 

1.9.2

LAN Subsystem Software...................................................................................................

25

 

1.9.3

RJ-45 LAN Connector with Integrated LEDs..............................................................

26

 

1.9.4

Wireless Network Module..................................................................................................

26

1.10 Hardware Management Subsystem .................................................................................................

27

 

1.10.1

Hardware Monitoring ...........................................................................................................

27

 

1.10.2

Fan Monitoring........................................................................................................................

27

 

1.10.3

Thermal Solution...................................................................................................................

28

ix

1.11

Power Management ................................................................................................................................

29

 

1.11.1

ACPI.............................................................................................................................................

29

 

1.11.2

Hardware Support.................................................................................................................

31

 

1.11.3 HDMI Consumer Electronics Control (CEC) ................................................................

33

1.12

Intel Platform Security Technologies ..............................................................................................

35

 

1.12.1

Intel® Virtualization Technology......................................................................................

35

 

1.12.2 Intel® Platform Trust Technology ...................................................................................

35

2 Technical Reference...............................................................................................

37

2.1

Memory Resources..................................................................................................................................

37

 

2.1.1

Addressable Memory...........................................................................................................

37

2.2

Connectors and Headers.......................................................................................................................

37

 

2.2.1

Front Panel Connectors......................................................................................................

38

 

2.2.2

Back Panel Connectors .......................................................................................................

38

 

2.2.3

Headers and Connectors (Top)........................................................................................

39

 

2.2.4

Connectors and Headers (Bottom).................................................................................

40

2.3

BIOS Security Jumper ............................................................................................................................

48

2.4

Mechanical Considerations..................................................................................................................

50

 

2.4.1

Form Factor..............................................................................................................................

50

2.5

Electrical Considerations ......................................................................................................................

51

 

2.5.1

Power Supply Considerations..........................................................................................

51

 

2.5.2

Fan Header Current Capability.........................................................................................

51

2.6

Thermal Considerations........................................................................................................................

51

2.7

Reliability .....................................................................................................................................................

54

2.8

Environmental ...........................................................................................................................................

54

3 Overview of BIOS Features...................................................................................

55

3.1

Introduction................................................................................................................................................

55

3.2

BIOS Flash Memory Organization .....................................................................................................

55

3.3

System Management BIOS (SMBIOS)..............................................................................................

55

3.4

Legacy USB Support ...............................................................................................................................

56

3.5

BIOS Updates.............................................................................................................................................

56

 

3.5.1

Language Support.................................................................................................................

57

3.6

BIOS Recovery ...........................................................................................................................................

57

3.7

Boot Options..............................................................................................................................................

57

 

3.7.1

Network Boot...........................................................................................................................

58

 

3.7.2

Booting Without Attached Devices................................................................................

58

 

3.7.3

Changing the Default Boot Device During POST......................................................

58

 

3.7.4

Power Button Menu..............................................................................................................

59

3.8

Hard Disk Drive Password Security Feature..................................................................................

60

3.9

BIOS Security Features ..........................................................................................................................

60

4 Error Messages and Blink Codes.........................................................................

62

4.1 Front-panel Power LED Blink Codes................................................................................................

62

x

 

Contents

5 Intel NUC Kit Features ...........................................................................................

63

5.1 Chassis Front Panel Features..............................................................................................................

63

5.2 Chassis Rear Panel Features................................................................................................................

64

Figures

 

Figure 1. Major Board Components (Top) .......................................................................................................

15

Figure 2. Major Board Components (Bottom) ................................................................................................

17

Figure 3. Block Diagram...........................................................................................................................................

19

Figure 4. Back Panel Connectors.........................................................................................................................

38

Figure 5. Headers and Connectors (Top) .........................................................................................................

39

Figure 6. Connectors and Headers (Bottom) ..................................................................................................

40

Figure 7. Connection Diagram for Front Panel Header (2.0 mm Pitch)...............................................

45

Figure 8. Location of the CIR Sensor..................................................................................................................

47

Figure 9. Location of the BIOS Security Jumper...........................................................................................

48

Figure 10. Board Dimensions................................................................................................................................

50

Figure 11. Board Height Dimensions .................................................................................................................

51

Figure 12. Intel® NUC Products NUC8i5INH/NUC8i7INH Features – Rear ..........................................

64

Tables

 

Table 1. Feature Summary.....................................................................................................................................

13

Table 2. Components Shown in Figure 1.........................................................................................................

15

Table 3. Components Shown in Figure 2.........................................................................................................

18

Table 4. Tcontrol Values for Components ......................................................................................................

53

Table 5. Environmental Specifications .............................................................................................................

54

Table 6. Acceptable Drives/Media Types for BIOS Recovery..................................................................

57

Table 7. Boot Device Menu Options...................................................................................................................

58

Table 8. Components Shown in Figure 19......................................................................................................

63

xi

1 Product Description

1.1Overview

1.1.1Feature Summary

Table 1 summarizes the major features of the product.

Table 1. Feature Summary

Board Form Factor

4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters)

 

 

Processor

Soldered-down 8th Generation Intel® Core™ i5 Quad-core Processors with 15W

 

TDP, 1.60 GHz

 

― TDP-up 25W

 

― 6 MB SmartCache, 3.60 GHz Max Turbo Frequency

 

― Integrated memory controller

 

― Integrated PCH

 

Soldered-down 8th Generation Intel® Core™ i7 Quad-core Processors with 15W

 

TDP, 1.80 GHz

 

― TDP-up 25W

 

― 8 MB SmartCache, 4.60 GHz Max Turbo Frequency

 

― Integrated memory controller

 

― Integrated PCH

Memory

Soldered-down LPDDR3 1866 MHz(4GB), LPDDR3 2133 MHz(8GB), Dual channel

 

Soldered-down 4 GB or 8 GB memory technology

 

Support for non-ECC memory

 

Support for 1.2 V low voltage JEDEC memory

 

 

Graphics

Discrete graphic support with AMD Radeon™ 540X:

 

― One full-sized High Definition Multimedia Interface (HDMI) and one Mini

 

DisplayPort (mDP) interface of rear panel.

 

― HDMI™ 4K Support, DisplayPort 1.4 HDR

Audio

ADM Integrated HD-Audio Controller (Azalia) and Codec via the HDMI and mDP

 

interfaces supporting compressed 7.1digital audio

 

Realtek ALC256 HD Audio via a stereo microphone/headphone 3.5 mm jack on the

 

front panel and 3.5mm combination speaker

 

 

Expansion Capabilities

One M.2 connector supporting M.2 2280 (key type M) modules

 

 

Storage

One SATA 6.0 Gbps port (black)

 

― Supports one 2.5“ SSD or HDD up to 9.5mm

 

1TB Hard Drive Disk included.

 

One full-sized SDXC slot

 

 

BIOS

Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device

 

Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and

 

System Management BIOS (SMBIOS)

 

 

 

Continued

13

Table 1. Feature Summary (continued)

Peripheral Interfaces

 

USB 3.1 gen2 ports:

 

 

― One USB TypeA and USB TypeC ports are implemented with external front

 

 

panel connectors.

 

 

― Two USB TypeA ports are implemented with external back panel connectors

 

 

(blue)

 

 

Consumer Infrared (CIR)

 

Consumer Electronics Control (CEC) header

 

 

Front panel header

 

 

USB 2.0 ports:

 

 

― Two ports via an internal common IO header (black)

LAN Support

Gigabit (10/100/1000 Mbps) LAN subsystem using the Intel WGI219V Gigabit Ethernet

 

Controller

 

 

Hardware Monitor

Hardware monitoring subsystem, based on an ITE8991VG embedded controller,

Subsystem

including:

 

Voltage sense to detect out of range power supply voltages

 

Thermal sense to detect out of range thermal values

 

One processor fan header

 

Fan sense input used to monitor fan activity

 

 

Fan speed control

 

 

Wireless

Soldered down Intel® Wireless-AC 9560D2WG module

 

Intel wireless802.11ac R2, 2x2, Dual Band, Wi-Fi

 

 

Bluetooth® 5

 

Maximum Transfer speed up to 1.73Gbps

 

 

• Next Generation Form Factor (NGFF) 12x16 soldered-down package

 

 

 

14

Product Description

1.1.2Board Layout (Top)

Figure 1 shows the location of the major components on the top-side of Intel NUC Boards NUC8INB

Figure 1. Major Board Components (Top)

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

Item from Figure 1

Description

 

 

A

Thermal solution

 

 

B

Processor fan header

 

 

C

Consumer Infrared (CIR) sensor

 

 

15

D

Wireless LAN module

 

 

16

Product Description

1.1.3Board Layout (Bottom)

Figure 2 shows the location of the major components on the bottom-side of Intel NUC Mini PC NUC8i5INH/NUC8i7INH.

Figure 2. Major Board Components (Bottom)

17

Table 3. Components Shown in Figure 2

Item from

 

Figure 2

Description

 

 

A

19V DC input jack

 

 

B

Back panel USB 3.1 gen2 connectors

 

 

C

Mini Display Port

 

 

D

HDMI 1 connector

 

 

E

LAN jack

 

 

F

SDXC card reader slot

 

 

G

Front panel single-port USB 2.0 connector (1.25 mm pitch)

 

 

H

Front panel single-port USB 2.0 connector (1.25 mm pitch)

 

 

I

M.2 connector

 

 

J

Front panel USB 3.1 gen2 connector

 

 

K

Front panel USB 3.1 gen2 connector

 

 

L

Front panel stereo speaker/headphone/microphone jack

 

 

M

Power button / power LED

 

 

N

+5 V Standby Power Indicator LED

 

 

O

SATA 6.0 Gb/s connector

 

 

P

BIOS security jumper

 

 

Q

Battery (lithium coin cell, CR2032, 3.0V)

 

 

R

Consumer Electronic Control (CEC) connector

 

 

18

Intel BXNUC8I5INHJA Manual

Product Description

1.1.4Block Diagram

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

19

1.2Online Support

To find information about…

Visit this World Wide Web site:

Intel NUC Products NUC8i5INH/NUC8i7INH

http://www.intel.com/NUC

NUC Board Support

http://www.intel.com/NUCSupport

Available configurations for Intel NUC Products

http://ark.intel.com

NUC8i5INH/NUC8i7INH

 

BIOS and driver updates

http://downloadcenter.intel.com

Integration information

http://www.intel.com/NUCSupport

1.3Processor

Intel NUC Mini PC NUC8i5INH/NUC8i7INH has a soldered-down System-on-a-Chip (SoC), which consists of one of following:

Soldered-down 8th Generation Intel® Core™ i5 Quad-core Processors with 15W TDP, 1.60 GHz

TDP-up 25W

6 MB SmartCache, 3.60 GHz Max Turbo Frequency

Integrated memory controller

Integrated PCH

Soldered-down 8th Generation Intel® Core™ i7 Quad-core Processors with 15W TDP, 1.80 GHz

TDP-up 25W

8 MB SmartCache, 4.60 GHz Max Turbo Frequency

Integrated memory controller

Integrated memory

NOTE

The board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 51 for information on power supply requirements for the board.

20

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