Intel CELERON 200 User Manual

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Intel® Celeron® Processor 200

Sequence

Thermal and Mechanical Design Guidelines

— Supporting the Intel® Celeron® processor 220

October 2007

318548-001

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The Intel Celeron processor 200 sequence may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development.

All products, platforms, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change.

This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.

Shelton Conroe, Woodcrest and other code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user.

Intel, Celeron and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.

Copyright © 2007, Intel Corporation. All rights reserved.

2

Thermal and Mechanical Design Guidelines

Contents

1

Introduction .....................................................................................................

 

7

 

1.1

Document Goals and Scope .....................................................................

7

 

 

1.1.1

Importance of Thermal Management ............................................

7

 

 

1.1.2

Document Goals........................................................................

7

 

 

1.1.3

Document Scope .......................................................................

8

 

1.2

Reference Documents .............................................................................

9

 

1.3

Definition of Terms .................................................................................

9

2

Processor Thermal/Mechanical Information .........................................................

11

 

2.1

Mechanical Requirements ......................................................................

11

 

 

2.1.1

Processor Package...................................................................

11

 

 

2.1.2

Heatsink Attach ......................................................................

16

 

2.2

Thermal Requirements ..........................................................................

18

 

 

2.2.1

Processor Junction Temperature ................................................

19

 

2.3

Heatsink Design Considerations..............................................................

19

 

 

2.3.1

Heatsink Size..........................................................................

20

 

 

2.3.2

Heatsink Mass ........................................................................

21

 

 

2.3.3

Thermal Interface Material........................................................

21

 

2.4

System Thermal Solution Considerations .................................................

22

 

 

2.4.1

Chassis Thermal Design Capabilities...........................................

22

 

 

2.4.2

Improving Chassis Thermal Performance ....................................

22

 

 

2.4.3

Summary...............................................................................

25

3

Thermal Metrology ..........................................................................................

27

 

3.1

Characterizing Cooling Performance Requirements ....................................

27

 

 

3.1.1

Example ................................................................................

29

 

3.2

Local Ambient Temperature Measurement Guidelines.................................

30

 

3.3

Processor Power Measurement Metrology Recommendation ........................

32

 

 

3.3.1

Sample Preparation .................................................................

33

4

System Thermal/Mechanical Design Information..................................................

37

 

4.1

Overview of the Reference Design...........................................................

37

 

 

4.1.1

Altitude..................................................................................

37

 

 

4.1.2

Heatsink Thermal Validation .....................................................

37

 

4.2

Environmental Reliability Testing ............................................................

38

 

 

4.2.1

Structural Reliability Testing .....................................................

38

 

 

4.2.2

Power Cycling .........................................................................

40

 

 

4.2.3

Recommended BIOS/CPU/Memory Test Procedures ......................

40

 

4.3

Material and Recycling Requirements ......................................................

40

 

4.4

Safety Requirements ............................................................................

41

 

4.5

Reference Attach Mechanism..................................................................

41

 

 

4.5.1

Structural Design Strategy .......................................................

41

 

 

4.5.2

Mechanical Interface to the Reference Attach Mechanism ..............

41

Thermal and Mechanical Design Guidelines

3

Appendix A Heatsink Clip Load Metrology............................................................................

43

A.1

Overview

............................................................................................

43

A.2

Test Preparation...................................................................................

43

 

A.2.1

Heatsink Preparation ...............................................................

43

 

A.2.2

Typical Test Equipment ............................................................

43

A.3

Test Procedure Examples.......................................................................

45

Appendix B Intel® Enabled Boxed Processor Thermal Solution Information...............................

47

Appendix C Mechanical Drawings .......................................................................................

49

Figures

Figure 1.

Micro-FCBGA Processor Package Drawing – Isometric View .....................

13

Figure 2.

Micro-FCBGA Processor Package Drawing (Sheet 1 of 2).........................

14

Figure 3.

Micro-FCBGA Processor Package Drawing (Sheet 2 of 2).........................

15

Figure 4.

Vertical Lock-Down Alignment Feature .................................................

18

Figure 5. Various Types of Solder Crack ...........................................................

18

Figure 6. Case Study #1: Top view — Poor μATX Chassis Layout Design for

 

 

Intel® Celeron® Processor 200 Sequence on Intel® Desktop Board

 

 

D201GLY2 (chassis cover removed for illustration)................................

23

Figure 7. Case Study #2: Relocate System Fan to CAG Venting for Airflow

 

 

Improvement ..................................................................................

24

Figure 8.

Case Study#3: An μATX Chassis Equipped with Two Exhaust Fans ...........

24

Figure 9. Case Study #4: A “Top Mount Fan” PSU is located next to Processor

 

 

in μATX Chassis for System Thermal Performance Improvement .............

25

Figure 10.

Processor Thermal Characterization Parameter Relationships.................

29

Figure 11.

Locations for Measuring Local Ambient Temperature, Active Heatsink .....

31

Figure 12.

Locations for Measuring Local Ambient Temperature, Passive Heatsink ...

32

Figure 13. Precision Resistor Connected in-series with Processor Circuitry for

 

 

Power Measurement .........................................................................

34

Figure 14. Installation of Isotek Resistor on Intel® Desktop Board D201GLY2 to

 

 

Setup Connection for Power Measurement ..........................................

34

Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 KΩ)

 

 

on Intel® Desktop Board D201GLY2 to Ensure Proper Attachment ..........

35

Figure 16. Precision Resistor Soldered on on Intel® Desktop Board D201GLY2,

 

 

and Connected to netDAQ for Voltage Measurement.............................

35

Figure 17.

Random Vibration PSD.....................................................................

38

Figure 18.

Shock Acceleration Curve.................................................................

39

Figure 19. Top Plate and Package Simulator Fasten onto Clip Force Measurement

 

 

Machine.........................................................................................

45

Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for reference only46

Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for

 

 

Enabling Components ......................................................................

50

Figure 22.

Reference Clip E21952-001 ..............................................................

51

Figure 23.

Reference Heatsink D96271-001 .......................................................

52

Figure 24.

Intel® Boxed Processor Thermal Solution E21953-001 ..........................

53

4

Thermal and Mechanical Design Guidelines

Tables

Table 1.

Micro-FCBGA Package Mechanical Specifications .....................................

12

Table 2.

Thermal Specifications for Intel® Celeron® Processor 200 Sequence ..........

19

Table 3.

System Thermal Solution Design Requirement .......................................

22

Table 4.

Test Accessories ................................................................................

33

Table 5.

Typical Test Equipment.......................................................................

44

Table 6.

Intel® Boxed Processor Thermal Solution Providers .................................

47

Thermal and Mechanical Design Guidelines

5

Revision History

Revision

Description

Revision Date

Number

 

 

 

 

 

-001

• Initial Release

October 2007

 

 

 

§

6

Thermal and Mechanical Design Guidelines

Introduction

1 Introduction

1.1Document Goals and Scope

1.1.1Importance of Thermal Management

The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within their functional temperature range. Within this temperature range, a component is expected to meet its specified performance. Operation outside the functional temperature range can degrade system performance, cause logic errors or cause component and/or system damage. Temperatures exceeding the maximum operating limit of a component may result in irreversible changes in the operating characteristics of this component.

In a system environment, the processor temperature is a function of both system and component thermal characteristics. The system level thermal constraints consist of the local ambient air temperature and airflow over the processor as well as the physical constraints at and above the processor. The processor temperature depends in particular on the component power dissipation, the processor package thermal characteristics, and the processor thermal solution.

All of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density (more transistors). As operating frequencies increase and packaging size decreases, the power density increases while the thermal solution space and airflow typically become more constrained or remains the same within the system. The result is an increased importance on system design to ensure that thermal design requirements are met for each component, including the processor, in the system.

1.1.2Document Goals

Depending on the type of system and the chassis characteristics, new system and component designs may be required to provide adequate cooling for the processor. The goal of this document is to provide an understanding of these thermal characteristics and discuss guidelines for meeting the thermal requirements imposed on single processor systems using the Intel® Celeron® processor 200 sequence.

The concepts given in this document are applicable to any system form factor. Specific examples used will be the Intel enabled reference solution for a system.

Thermal and Mechanical Design Guidelines

7

Introduction

1.1.3Document Scope

This design guide supports the following processors:

Intel® Celeron® Processor 200 sequence applies to the Intel® Celeron® processor 220.

In this document the Intel Celeron Processor 200 sequence will be referred to as “the processor”.

In this document when a reference is made to “the processor” it is intended that this includes all the processors supported by this document. If needed for clarity, the specific processor will be listed.

In this document, when a reference is made to “datasheet”, the reader should refer to the Intel® Celeron® Processor 200 Sequence Datasheet. If needed for clarity, the specific processor datasheet will be referenced.

In this document, when a reference is made to the “the reference design” it is intended that this includes all reference designs (D16869-001 and D96271-001) supported by this document. If needed for clarify, the specific reference design will be listed.

Chapter 2 of this document discusses package thermal mechanical requirements to design a thermal solution for the Intel Celeron processor 200 sequence in the context of personal computer applications. Chapter 3 discusses the thermal solution considerations and metrology recommendations to validate a processor thermal solution. Chapter 4 gives information on the Intel reference thermal solution for the processor in a system application.

The physical dimensions and thermal specifications of the processor that are used in this document are for illustration only. Refer to the Datasheet for the product dimensions, thermal power dissipation, and maximum junction temperature. In case of conflict, the data in the datasheet supersedes any data in this document.

8

Thermal and Mechanical Design Guidelines

Introduction

1.2Reference Documents

Material and concepts available in the following documents may be beneficial when reading this document.

Document

Document

 

No./Location

 

 

Intel® Celeron® Processor 200 Sequence Datasheet

http://developer.intel

 

.com/design/processo

 

r/datashts/318546.ht

 

m

 

 

Power Supply Design Guide for Desktop Platform Form Factors (Rev

http://www.formfacto

1.1)

rs.org/

 

 

ATX Thermal Design Suggestions

http://www.formfactors.

 

org/

 

 

microATX Thermal Design Suggestions

http://www.formfactors.

 

org/

 

 

Balanced Technology Extended (BTX) System Design Guide

http://www.formfactors.

 

org/

 

 

Thermally Advantaged Chassis version 1.1

http://www.intel.com/g

 

o/chassis/

 

 

1.3Definition of Terms

 

Term

Description

 

 

 

 

 

 

 

The measured ambient temperature locally surrounding the processor. The

 

 

TA

ambient temperature should be measured just upstream of a passive heatsink or

 

 

 

at the fan inlet for an active heatsink.

 

 

 

 

 

 

TJ

Processor junction temperature.

 

 

 

 

 

 

TS-TOP

Heatsink temperature measured at vicinity to center on the top surface of

 

 

heatsink base.

 

 

 

 

 

 

 

 

 

 

Junction-to-ambient thermal characterization parameter (psi). A measure of

 

 

ΨJA

thermal solution performance using total package power. Defined as

 

 

(TJ – TA) / Total Package Power.

 

 

 

Note: Heat source must be specified for Ψ measurements.

 

 

 

 

 

 

 

Junction-to-sink thermal characterization parameter. A measure of thermal

 

 

ΨJS

interface material performance using total package power. Defined as

 

 

(TJ – TS) / Total Package Power.

 

 

 

Note: Heat source must be specified for Ψ measurements.

 

 

 

 

 

 

ΨSA

Sink-to-ambient thermal characterization parameter. A measure of heatsink

 

 

thermal performance using total package power. Defined as

 

 

 

 

Thermal and Mechanical Design Guidelines

9

Introduction

Term

Description

 

 

 

(TS – TA) / Total Package Power.

 

Note: Heat source must be specified for Ψ measurements.

 

 

 

Thermal Interface Material: The thermally conductive compound between the

TIM

heatsink and the processor die surface. This material fills the air gaps and voids,

and enhances the transfer of the heat from the processor die surface to the

 

 

heatsink.

 

 

PD

Processor total power dissipation (assuming all power dissipates through the

processor die).

 

 

 

 

Thermal Design Power: a power dissipation target based on worst-case

TDP

applications. Thermal solutions should be designed to dissipate the thermal

 

design power.

 

 

PUSAGE

Maximum usage power of processor when running SysMark utility.

 

 

§

10

Thermal and Mechanical Design Guidelines

Processor Thermal/Mechanical Information

2Processor Thermal/Mechanical Information

2.1Mechanical Requirements

2.1.1Processor Package

The Intel Celeron processor 200 sequence is available in a 479-pin Micro-FCBGA package, as shown in Figure 1 to Figure 3. The processor uses a Flip-Chip Ball Grid Array (FC-BGA6) package technology that directly solder down to a 479-pin footprint on PCB surface.

Mechanical specifications of the package are listed in Table 1. Refer to the datasheet for detailed mechanical specifications. In case of conflict, the package dimensions in the datasheet supersedes dimensions provided in this document.

The processor package has mechanical load limits that are specified in the processor datasheet. The specified maximum static and dynamic load limits should not be exceeded during their respective stress conditions. These include heatsink installation, removal, mechanical stress testing, and standard shipping conditions.

When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink base and the processor die, it should not exceed the corresponding specification given in the processor datasheet.

When a compressive static load is necessary to ensure mechanical performance, it should remain in the minimum/maximum range specified in the processor datasheet.

No portion of the substrate should be used as a mechanical reference or load-bearing surface for the thermal or mechanical solution.

The processor datasheet provides package handling guidelines in terms of maximum recommended shear, tensile and torque loads for the processor substrate. These recommendations should be followed in particular for heatsink removal operations.

Thermal and Mechanical Design Guidelines

11

Processor Thermal/Mechanical Information

Table 1. Micro-FCBGA Package Mechanical Specifications

Symbol

Parameter

Min

 

Max

Unit

Figure

 

 

 

 

 

 

 

B1

Package substrate width

34.95

 

35.05

mm

Figure 2

 

 

 

 

 

 

 

B2

Package substrate length

34.95

 

35.05

mm

Figure 2

 

 

 

 

 

 

 

C1

Die width

11.1

 

 

mm

Figure 2

 

 

 

 

 

 

 

C2

Die length

8.2

 

 

mm

Figure 2

 

 

 

 

 

 

 

F2

Die height (with underfill)

0.89

 

 

mm

Figure 2

 

 

 

 

 

 

F3

Package overall height

2.022 Max

 

mm

Figure 2

 

(package substrate to

 

 

 

 

 

 

die)

 

 

 

 

 

 

 

 

 

 

 

G1

Width (first ball center to

31.75 Basic

 

mm

Figure 2

 

last ball center)

 

 

 

 

 

 

 

 

 

 

 

G2

Length (first ball center

31.75 Basic

 

mm

Figure 2

 

to last ball center)

 

 

 

 

 

 

 

 

 

 

 

J1

Ball pitch (horizontal)

1.27 Basic

 

mm

Figure 2

 

 

 

 

 

 

J2

Ball pitch (vertical)

1.27 Basic

 

mm

Figure 2

 

 

 

 

 

 

 

M

Solder Resist Opening

0.61

 

0.69

mm

Figure 2

 

 

 

 

 

 

 

N

Ball height

0.6

 

0.8

mm

Figure 2

 

 

 

 

 

 

 

--

Corner Keep-out zone at

7 × 7

 

 

mm

Figure 3

 

corner (4X)

 

 

 

 

 

 

 

 

 

 

 

 

--

Keep-out from edge of

5

 

 

mm

Figure 3

 

package (4X)

 

 

 

 

 

 

 

 

 

 

 

 

--

Package edge to first ball

1.625

 

 

mm

Figure 3

 

center

 

 

 

 

 

 

 

 

 

 

 

 

Pdie

Allowable pressure on

689

 

 

kPa

 

 

the die for thermal

 

 

 

 

 

 

solution

 

 

 

 

 

 

 

 

 

 

 

 

W

Package weight

6

 

 

g

 

 

 

 

 

 

 

 

NOTE:

1.All dimensions are subject to change.

2.Overall height as delivered. Values were based on design specifications and tolerances. Final height after surface mount depends on OEM motherboard design and SMT process.

12

Thermal and Mechanical Design Guidelines

Processor Thermal/Mechanical Information

Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View

Thermal and Mechanical Design Guidelines

13

Processor Thermal/Mechanical Information

Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2)

NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details.

14

Thermal and Mechanical Design Guidelines

Processor Thermal/Mechanical Information

Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2)

NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details.

Thermal and Mechanical Design Guidelines

15

Processor Thermal/Mechanical Information

2.1.2Heatsink Attach

2.1.2.1General Guidelines

The micro-FCBGA package may have capacitors placed in the area surrounding the processor die. The die-side capacitors, which are only slightly shorter than the die height, are electrically conductive and contact with electrically conductive materials should be avoided. The use of an insulating material between the capacitors and any thermal and mechanical solution should be considered to prevent capacitors shorting. A thermal and mechanical solution design must not intrude into the required keep-out zones as specified in the datasheet.

There are no features on the 479-pins micro-FCBGA package for direct heatsink attachment: a mechanism must be designed to attach the heatsink directly to the motherboard. In addition to holding the heatsink in place on top of the processor die, this mechanism plays a significant role in the robustness of the system in which it is implemented, in particular:

Ensuring thermal performance of the thermal interface material (TIM) applied between the processor die and the heatsink. TIMs based on phase change materials are very sensitive to applied pressure: the higher the pressure, the better the initial performance. Designs should incorporate a possible decrease in applied pressure over time due to potential structural relaxation in retention components (creep effect causing clip to lose its preload and causing anchor pullout). It is not recommended to use TIMs such as thermal greases onto small bare die package, due to the TIM “pump-out” concern after heatsink is assembled.

Ensuring system electrical, thermal, and structural integrity under shock and vibration events. The mechanical requirements of the heatsink attach mechanism depend on the mass of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the motherboard and the system should be considered in designing the heatsink attach mechanism. The design should provide a means for protecting the solder joints.

2.1.2.2Heatsink Clip Load Requirement

The attach mechanism for the heatsink developed to support the processor creates a nominal static compressive preload on the package of 9.9 lbf ± 1.2 lbf throughout the life of the product for designs compliant with the Intel reference design assumptions:

Using TIM Honeywell PCM45F (pad version).

55.88 mm (2.2”) x 54.88 mm (2.16”) attach pattern. Refer to Figure 21 for heatsink keep-out zone.

And no board stiffening device (backing plate, chassis attach, etc.).

The minimum load is required to thermal performance while protecting solder joint against fatigue failure in temperature cycling.

Notes the load range above is required to ensure a minimum load of 8.7lbf at end-of- life. The tolerance and nominal load is based on reference design and will slightly differ on alternate thermal solution provided by third party.

It is important to take into account potential load degradation from creep over time when designing the clip or fastener to the required minimum load. This means that,

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Thermal and Mechanical Design Guidelines

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