Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and
semiconductor "chip" components.
The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on
your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to
prevent electrostatic charge build-up or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges
sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical change sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement
ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material.)
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the
chassis or circuit assembly into which the device will be installed.
CAUTION :
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together
or your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES devices.
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
Each precaution in this manual should be followed during servicing.
Components identified with the IEC symbolin the parts list are special significance to safety. When replacing a component identified with
, use only the replacement parts designated, or parts with the same ratings or resistance, wattage, or voltage that are designated in the
parts list in this manual. Leakage-current or resistance measurements must be made to determine that exposed parts are acceptably
insulated from the supply circuit before retuming the product to the customer.
-4-
Before returning the unit to the user, perform the following safety checks :
1. lnspect all lead dress to make certain that
leads are not pinched or that hardware is not
lodged between the chassis and other metal
parts in the unit.
2. Be sure that any protective devices such as
nonmetallic control knobs, insulating fish-
papers, cabinet backs, adjustment and
500
compartment covers or shields, isolation
resistor-capacity networks, mechanical
insulators, etc. Which were removed for the
servicing are properly re-installed.
3. Be sure that no shock hazard exists ; check for leakage
current using Simpson Model 229 Leakage Tester, standard
equipment item No. 21641, RCA Model WT540A or use
alternate method as follows : Plug the power cord directly
Into a 120 volt AC receptacle (do not use an Isolation
Transformer for this test). Using two clip leads, connect a
1500 ohms, 10watt Resistor paralleled by a 0.15uF capacitor, in series with all exposed metal cabinet parts and a known earth ground, such
as a water pipe or conduit. Use a VTVM or VOM with 1000 ohms per volt, or higher sensitivity to measure the AC voltage drop across the
resistor. (See diagram) Move the resistor connection to each exposed metal part having a return path to the chassis (antenna, metal, be
performed with the 0.35 volt RMS or more is excessive and indicates a potential shock hazard which must be corrected before returning the
unit to the owner.
-5-
LR
IN
TAPE
OUT
VIDEO
2
ANTENNA
IN
VIDEO
AM
1
OUT
GND
DVD
FM
(75½)
CD
SL
SR FRSUB WOOFER
6 CH. DIRECTMULTI OUTPRE OUT
FLCENTER
DIGITAL INPUT
OPTICAL
2
OPTICAL
1
COAXIAL 2 COAXIAL 1
DIGITAL INPUT
DIGITAL OUTPUT
OPTICAL
1
COAXIAL
1
ML
MR
VIDEO
TV
MONITOR
OUT
VIDEO 2
IN
VIDEO 1
VIDEO 1
OUT
DVD
OUTIN
REMOTE
CONTROL
SL
SUB WOOFERFL
MULTI IN
SR CENTERFR
RIGHT
SPEAKERS 8 Ohms SPEAKER 8 Ohm
FRONT
CENTER
LEFTCENTER
AC ~ 120V 60 Hz
SURROUND
RIGHT
SPEAKERS 8 Ohms
LEFT
MODEL NO. AVR 500
HARMAN KARDON
NORTHRIDGE
CALIFORNIA, USA
AC OUTLETS
(120V.60Hz)
TOTAL 150W or 1.5A MAX
UNSWITCHED
TOTAL 100W or 1A MAX.
SWITCHED
TOTAL 150W or 0.5A MAX.
SERIAL NO.
500
SERVICE PROCEDURE
1. All Clear
This service program can clear all memorized operations and functions.
When the POWER ON, press the "AM/FM" button while pressing the "PRO LOGIC"button.
After this, Preset memory will be set to these frequencies.
FM
AM
VERSION
120
230RDS
VERSION
120
230RDS
P1
87.5
87.50
P9
520
522
P2
88.0
88.00
P10
600
594
P3
90.0
90.00
P11
610
999
2. VFD segment illumination & text
This set do not have VFD segment check function because lack of u-com memory size
So For your checking VFD states according to each function
Please refer to owners manual process.
TEST EQUIPMENT REQUIRED
1) AM/FM Signal generator
2) Digital Multimeter
3) Distortion lever meter
P4
95.0
95.00
P12
1000
1395
P5
98.0
98.00
P13
1400
1611
P6
99.0
99.00
P14
1500
P7
106.0
106.00
P15
1710
P8
108.0
108.00
4. FM STEREO Separation Adjustment
Input Signal Source
step
1
2
Connection
Signal generator
output to FM
antenna
terminal.(750hm)
Signal
Frequency
98MHz
4. AM OSC Adujstment
Input Signal Source
step
1
Connection
Signal Generator
output to transmission
loop antenna
(standard required loop)
Signal
Frequency
522kHz
(230,230RDS)
520kHz(120)
Source Signal Output Level and
Modulation
same specification as
distortion adjustment.
Input only L channel
same specification as
distortion adjustment.
Input only R channel
Source Signal Output Level and
Modulation
5mV/m(74dBu)
MOD.30%
FM STEREO
FM STEREO
400Hz
Reception
Frequency
98MHz
(P5)
98MHz
(P5)
Reception
Frequency
522kHz
(230,230RDS)
520kHz
(120)
(P9)
Adjustment
Point
VR803
VR803
Adjustment
Point
T802
Adjustment
Value
Output level
at TAPE-OUT
channel R
Output level
at TAPE-OUT
channel R
Adjustment
Value
1.1V 1.2V
Minimum
Minimum
ALIGNMENT PROCEDURES
1. FM MONO. Distortion adjustment
Input Signal Source
step
1
2
Connection
Signal generator
output to FM
antenna
terminal.(750hm)
Signal
Frequency
98MHz
Source Signal Output Level and
Modulation
1000uV/m (60dBu)
MONO 1kHz/
Dev. 75kHz
2. FM MUTING LEVEL ADJUSTMENT
Turn variable resistor VR801 and stop at position "TUNED" is not shown (not indicated), then again turn the variable resistor VR801 to the
opposite revolution and stop at a position "TUNED" is shown.
Input Signal Source
step
1
2
Connection
Signal generator
output to FM
antenna
terminal.(750hm)
Signal
Frequency
98MHz
Source Signal Output Level and
Modulation
10uV/m (20dBu)
MONO 1kHz/
Dev. 75kHz
Reception
Frequency
98MHz
(P5)
Reception
Frequency
98MHz
(P5)
AUTO
SCAN
Adjustment
Point
T804
T805
Adjustment
Point
VR801
Only confirm
Adjustment
Value
0mV 0.5mV
(R831)
Distortion
level
Minimum
TAPE-OUT
Adjustment
indicate on VFD
indicate on VFD
at
Value
"TUNED"
"TUNED"
5. AM-Tracking Adjustment (MW)
Input Signal Source
step
1
2
Connection
Signal Generator
output to transmission
loop antenna
(standard required loop)
Frequency
(230,230RDS)
600kHz(120)
(230,230RDS)
1400kHz(120)
6. AM IF Adjustment
Input Signal Source
step
1
Connection
Signal Generator
output to transmission
loop antenna
(standard required loop)
Frequency
(230,230RDS)
1000kHz(120)
Signal
594kHz
1395kHz
Signal
999kHz
Source Signal Output Level and
Modulation
5mV/m(74dBu)
400Hz
MOD.30%
Source Signal Output Level and
Modulation
5mV/m(74dBu)
400Hz
MOD.30%
Reception
Frequency
594kHz
(230,230RDS)
600kHz(120)
Reception
Frequency
999kHz
(230,230RDS)
1000kHz
(120)
Adjustment
Point
T801
CT801
Adjustment
Point
T803
Adjustment
Value
Output level(L or R)
Minimum
TAPE-OUT
Output level(L or R)
Minimum
TAPE-OUT
Adjustment
Output level(L or R)
Maximum
TAPE-OUT
Output level(L or R)
Maximum
TAPE-OUT
at
at
Value
at
at
-9-
500
7. AM auto stop Adjustment
9. Main Amp DC OFFSET VOLTAGE Adjustment
Input Signal Source
step
1
2
Connection
Signal Generator
output to transmission
loop antenna
(standard required loop)
Signal
Frequency
999kHz
(230,230RDS)
1000kHz
(120)
8. Main Amp ldling current Adjustment
(1) SET CONDITION
1) SEMI VOLUME POSITION at MAIN/SURROUND AMP Board; CENTER
MAIN: VR401, VR402, VR501
SURROUND : VR601, VR602
2) NO signal / NO LOAD
3) AC LINE VOLTAGE : 120V/60Hz, 230V/50Hz
Source Signal Output Level and
Modulation
1000uV/m(60dBu)
400Hz
MOD.30%
Reception
Frequency
999kHz
(230,230RDS)
1000kHz(120)
AUTO SCAN
Adjustment
Point
VR802
Only
Confirm
Adjustment
Value
"TUNED"
indicate on
VFD
"TUNED"
indicate on
VFD
(1) SET CONDITION
1) SEMI VOLUME POSITION at MAIN/SURROUND AMP Board; CENTER
MAIN: VR403, VR404, VR502
SURROUND : VR603, VR604
2) NO signal / NO LOAD
3) AC LINE VOLTAGE : 120V/60Hz, 230V/50Hz
(2) After turning on the unit, keep it over than 5MIN. (Keep the Power/Drive TR as normal temperature)
(3) Adjust the voltage value of primary & secondary of wafer to be 10mV by rotating the semi-volume
of each channel to the right
CHANNELADJUSTMENTMEASUREMENTOTHERS
FRONT-L ch
FRONT-R ch
CENTER ch
SURROUND-L ch
SURROUND-R ch
VR403
VR404
VR502
VR603
Vr604
JK401
JK402
JK501
JK601
JK601
VOLAGE
0mV
0mV
0mV
0mV
0mV
(2) After turning on the unit, keep it over than 5MIN. (Keep the Power/Drive TR as normal temperature)
(3) Adjust the voltage value of primary & secondary of wafer to be 10mV by rotating the semi-volume
of each channel to the right
CHANNELADJUSTMENTMEASUREMENTOTHERS
FRONT-L ch
FRONT-R ch
CENTER ch
SURROUND-L ch
SURROUND-R ch
(4) CAUTION
1) In case that POWER TR or DREVE TR is needed to be replaced for repairing, the corresponding channel
should be adjusted again
* FRONT AMP: Q433~Q440
* CENTER AMP: Q517~Q520
* SURROUND AMP: Q633~Q640
VR401
VR402
VR501
VR601
VR602
WA401
WA402
WA501
WA601
WA602
VOLAGE
10 3mV
10 3mV
10 3mV
10 3mV
10 3mV
R401:22.7mA
R472:22.7mA
R501:22.7mA
R601:22.7mA
R602:22.7mA
(4) CAUTION
1) In case that POWER TR or DREVE TR is needed to be replaced for repairing, the corresponding channel
should be adjusted again
* FRONT AMP: Q401~Q440, Q411~Q414
* CENTER AMP: Q501, Q502, Q506, Q507
* SURROUND AMP: Q601~Q604, Q611~Q614
10. Cautions for main Amp adjustment
(1) At MAIN/SURROUND BOARD, use the below condensors after discharging for sufficent time
for preventing possible damage from electrical spark.
MAIN BOARDC481, C482 (10000/63V, 8200uF/63V)
SURROUND BOARDC691, C692 (6800/63V, 6800uF/50V)
(2) The checker for MAIN/SURROUND BOARD should have the discharging circuit.
Discharge over 30sec. through (407ohm 10w) resistor after turning off
-10-
DISASSEMBLY PROCEDUREDISASSEMBLY PROCEDURE
1. Removingthe top cover, and
Removescrews
2. Removingthe front panel, and
Removescrews
4. Removingthe main PCBblock, and
Removescrews
5. Removingthe power PCBblock, and
Remove
3. Removingthe rear panel, and
Removescrews
MAIN AMP PCB BLOCKMAIN AMP PCB BLOCK
1. Removeall of the screwson Rearpanel.
2. Removethe Rearpanel.
3. RemovePCBBrk t and Guide
4. Removeall of the screwsthat connect with main Assy.
5. Removethe Main PCBblock.
POWER PCB BLOCKPOWER PCB BLOCK
1. RemovePCBBrk t and Guide
2. Remove4 screwsfor Power PCBmounting
3. Removethe POWERPCBblock.
SUB PCB BLOCKSUB PCB BLOCK
1. Remove4 screwson Rearpanel.
2. Removethe Rearpanel.
3. RemovePCBBrk t and Guide
4. Removethe SUBPCBblock.
Brk t from Main Assy.
Brk t from Main Assy.
Brk t from Main Assy.
6. Removingthe sub PCBblock, and
Removescrews
FRONT PCB BLOCKFRONT PCB BLOCK
1. RemoveMain
2. Removevolume and rotary knob from the front
3. Removeall of the screwson back sideof Front function PCB.