Sony MHC-V50, MHC-V50D Schematic

MHC-V50/V50D

SERVICE MANUAL

Ver. 1.0 2017.03

Note:

Be sure to keep your PC used for service and checking of this unit always updated with the latest version of your anti-virus software. In case a virus affected unit was found during service, contact your Service Headquarters.

CD/DVD Section

Photo: MHC-V50D

Model Name Using Similar Mechanism MHC-V44D

CD Mechanism Type CDM90-DVBU204//C

Optical Pick-up Name CMS-S76RFS7G1 or CMS-S76RFS7GP

US Model

Canadian Model

MHC-V50

AEP Model

UK Model

E Model

Australian Model

MHC-V50D

AUDIO POWER SPECIFICATIONS POWER OUTPUT AND TOTAL

HARMONIC DISTORTION: (US models only)

With 5 ohm loads, both channels driven, from 280 Hz – 20,000 Hz; rated 70 watts per channel minimum RMS power, with no more than 0.7% total harmonic distortion from 250 milliwatts to rated output.

Speaker section

Speaker system: 3-way, Sound Pressure Horn Speaker unit: Tweeter L/R: 40 mm (1 5/8 in), cone type Midrange L/R: 80 mm (3 1/4 in), cone type Woofer: 200 mm (7 7/8 in), cone type Rated impedance: Tweeter L/R: 5 ohms Midrange L/R: 5 ohms Woofer: 2 ohms

Inputs

AUDIO/PARTY CHAIN IN L/R (V50): Voltage 2 V, impedance 47 kilohms AUDIO/PARTY CHAIN IN (TV) L/R (V50D): Voltage 2 V, impedance 47 kilohms TV (ARC) (V50D): Supported audio signal: 2-channel Linear PCM MIC1: Sensitivity 1 mV, impedance 10 kilohms MIC2/GUITAR: Sensitivity 1 mV, impedance 10 kilohms (When guitar mode is turned off.) Sensitivity 200 mV, impedance 1 Megaohm (When guitar mode is turned on.)

Outputs

AUDIO/PARTY CHAIN OUT L/R: Voltage 2 V, impedance 1 kilohm VIDEO OUT (V50D): Max. output level 1 Vp-p, unbalanced, Sync. negative load impedance 75 ohms HDMI OUT (TV) (V50D): Supported audio signal: 2-channel Linear PCM (up to 48 kHz), Dolby Digital

9-890-684-01

2017C81-1

2017.03

Sony Corporation

Published by Sony EMCS (Malaysia) PG Tec

SPECIFICATIONS

HDMI section (V50D)

Connector: Type A (19 pin)

Disc player section

System: Compact disc and digital audio system (V50) Compact disc and digital audio and video system (V50D) Laser Diode Properties Emission Duration: Continuous Laser Output*: Less than 44.6 μW * This output is the value measure-

ment at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with

7 mm aperture. Frequency response: 20 Hz – 20 kHz Video color system format Latin American model: NTSC Other models: NTSC and PAL

USB section

Supported USB device: Mass Storage Class Maximum current: 1 A

(USB) port:

Type A

FM Tuner section

FM stereo, FM superheterodyne tuner Antenna: FM lead antenna Tuning range:

87.5 MHz – 108.0 MHz (50 kHz step)

BLUETOOTH section

Communication system: BLUETOOTH Standard version 3.0 Output: BLUETOOTH Standard Power Class 2 Maximum communication range: Line of sight approx. 10 m (33 ft)* Frequency band:

2.4 GHz band (2.4000 GHz –

2.4835 GHz) Modulation method: FHSS (Freq Hopping Spread Spectrum)

Compatible BLUETOOTH profiles* A2DP (Advanced Audio Distribu-

tion Profile) AVRCP (Audio Video Remote Control Profile) SPP (Serial Port Profile) Supported codecs: SBC (Subband Codec) AAC (Advanced Audio Coding) LDAC

The actual range will vary depending on factors such as obstacles between devices, magnetic fields around a microwave oven, static electricity, reception sensitivity, antenna’s performance, operating system, software application, etc.

BLUETOOTH standard profiles indicate the purpose of BLUETOOTH communication between devices.

Supported audio formats

Supported bit rate and sampling frequencies: MP3: 32/44.1/48 kHz, 32 kbps – 320 kbps (VBR) AAC:

44.1 kHz, 48 kbps – 320 kbps (CBR/VBR) WMA:

44.1 kHz, 48 kbps – 192 kbps (CBR/VBR) WAV:

44.1/48 kHz (16 bit)

Supported video formats (V50D)

Xvid: Video codec: Xvid video Bit rate: 4.854 Mbps (MAX) Resolution/Frame rate: 720 × 480, 30 fps 720 × 576, 25 fps (except for Latin American model) Audio codec: MP3 MPEG4 File format: MP4 File Format Video codec: MPEG4 Simple Proﬁ le (AVC is not compatible.)

Bit rate: 4 Mbps Resolution/Frame rate: 720 × 480, 30 fps

720 × 576, 25 fps (except for Latin American model) Audio codec: AAC-LC (HE-AAC is not compatible.) DRM: Not compatible

General

Power requirements: US, CND models: AC 120 V, 60 Hz Except US, CND models: AC 120 V – 240 V, 50/60 Hz Power consumption: 120 W Power consumption (at the Power Saving mode) (V50D):

0.5 W (When “BT STBY” is set to “OFF” and [CONTROL FOR HDMI]

is set to [OFF].) 3 W* (When “BT STBY” is set to “ON” and [CONTROL FOR HDMI] is set to [ON].) Dimensions (W/H/D) (Approx.): 293 mm × 798 mm × 300 mm (11 Mass (Approx.): 14 kg (30 lb 14 oz) * The power consumption of the system will

Unpacking

• This unit (MHC-V50/V50D) (1)

• Remote control (1)

• R03 (size AAA) batteries (2)

• FM lead antenna (1)

• AC power cord (mains lead) (1)

• AC plug adaptor* (1) (supplied only for

Design and specifications are subject to change without notice.

/8 in x 31 1/2 in x 11 7/8 in)

be less than 0.5 W when there is no HDMI connection and “BT STBY” is set to “OFF”.

certain areas) (V50D) * This plug adaptor is not for the use

in Chile, Paraguay and Uruguay. Use this plug adaptor in the countries where it is necessary.

– Continued on next page –

HOME AUDIO SYSTEM

MHC-V50/V50D

License and Trademark Notice

•

is a trademark of DVD Format/Logo Licensing Corporation.

• “DVD+RW”, “DVD-RW”, “DVD+R”, “DVD-R”, “DVD VIDEO”, and the “CD” logos are trademarks.

• WALKMAN of Sony Corporation.

• MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and Thomson.

• Windows Media is either a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries.

• This product is protected by certain intellectual property rights of Microsoft Corporation. Use or distribution of such technology outside of this product is prohibited without a license from Microsoft or an authorized Microsoft subsidiary.

• This system incorporates Dolby* Digital.

* Manufactured under license from Dolby Laboratories. Dolby,

• This system incorporates High-Definition Multimedia Interface (HDMI™) technology. The terms HDMI and HDMI HighDefinition Multimedia Interface, and the HDMI Logo are trademarks or registered trademarks of HDMI Licensing, LLC in the United States and other countries.

• “BRAVIA” is a trademark of Sony Corporation.

• LDAC™ and LDAC logo are trademarks of Sony Corporation.

• The BLUETOOTH marks owned by Bluetooth SIG, Inc. and any use of such marks by Sony Corporation is under license. Other trademarks and trade names are those of their respective owners.

• The N-Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and in other countries.

• Android™ is a trademark of Google Inc.

• Google Play is a trademark of Google Inc.

• Apple, the Apple logo, iPhone, and iPod touch are trademarks of Apple Inc., registered in the U.S. and other countries. App Store is a service mark of Apple Inc., registered in the U.S. and other countries.

• “Made for iPod” and “Made for iPhone” mean that an electronic

accessory has been designed to connect specifically to iPod or iPhone, respectively, and has been certified by the developer to meet Apple performance standards. Apple is not responsible for the operation of this device or its compliance with safety and regulatory standards. Please note that the use of this accessory with iPod or iPhone may affect wireless performance.

• THIS PRODUCT IS LICENSED UNDER THE MPEG-4 VISUAL PATENT PORTFOLIO LICENSE FOR THE PERSONAL AND NON-COMMERCIAL USE OF A CONSUMER FOR

(i) ENCODING VIDEO IN COMPLIANCE WITH THE MPEG-4

AND/OR

(ii) DECODING MPEG-4 VIDEO THAT WAS ENCODED BY

NO LICENSE IS GRANTED OR SHALL BE IMPLIED FOR ANY

OTHER USE. ADDITIONAL INFORMATION INCLUDING THAT RELATING TO PROMOTIONAL, INTERNAL AND COMMERCIAL USES AND LICENSING MAY BE OBTAINED FROM MPEG LA, L.L.C.

HTTP://WWW.MPEGLA.COM

• All other trademarks are trademarks of their respective owners.

• In this manual, ™ and

• Abbreviation

and WALKMAN® logo are registered trademarks

Dolby Audio, and the double-D symbol are trademarks of Dolby Laboratories.

word mark and logos are registered trade-

VISUAL STANDARD (“MPEG-4 VIDEO”)

A CONSUMER ENGAGED IN A PERSONAL AND NONCOMMERCIAL ACTIVITY AND/OR WAS OBTAINED FROM A VIDEO PROVIDER LICENSED TO PROVIDE MPEG-4 VIDEO.

marks are not specified.

AUS : Australian model CND : Canadian model LA9 : Latin-American model

NOTES ON CHIP COMPONENT REPLACEMENT

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

FLEXIBLE CIRCUIT BOARD REPAIRING

• Keep the temperature of the soldering iron around 270 °C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

SAFETY CHECK-OUT

After correcting the original service problem, perform the following safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal parts for AC leakage. Check leakage as described below.

LEAKAGE TEST

The AC leakage from any exposed metal part to earth ground and from all exposed metal parts to any exposed metal part having a return to chassis, must not exceed 0.5 mA (500 microamperes). Leakage current can be measured by any one of three methods.

1. A commercial leakage tester, such as the Simpson 229 or RCA WT-540A. Follow the manufacturers’ instructions to use these instruments.

2. A battery-operated AC milliammeter. The Data Precision 245 digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM or battery-operated AC voltmeter. The “limit” indication is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operated digital multimeters that have a 2V AC range are suitable. (See Fig. A)

To Exposed Metal Parts on Set

1.5 kΩ0.15 μF

voltmeter (0.75 V)

Earth Ground

Fig. A. Using an AC voltmeter to check AC leakage.

SAFETY-RELATED COMPONENT WARNING!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

À LA SÉCURITÉ!

MHC-V50/V50D

1. SERVICING NOTES ............................................. 4

2. DISASSEMBLY

2-1. Disassembly Flow ........................................................... 10

2-2. Side (L) Panel, Side (R) Panel ........................................ 11

2-3. Top Panel Section ........................................................... 12

2-4. Loading Panel Assy ........................................................ 13

2-5. CDM Section .................................................................. 14

2-6. Back Panel Section, Module Cover ................................ 15

2-7. DAMP Board .................................................................. 16

2-8. Bracket Chassis ............................................................... 17

2-9. MOTHERBOARD Board ............................................... 18

2-10. SMPS Board ................................................................... 19

2-11. Chassis ............................................................................ 19

2-12. Front Panel Section ......................................................... 20

2-13. Loudspeaker (20CM) ...................................................... 21

2-14. Loudspeaker (8CM) ........................................................ 22

2-15. Service Optical Device (7G), Flexible Flat Cable .......... 23

3. TEST MODE ............................................................ 24

4. ELECTRICAL CHECK ......................................... 25

5. TROUBLESHOOTING .......................................... 26

6. DIAGRAMS ............................................................... 32

6-1. Block Diagram - CD/USB/HDMI Section - ................... 33

6-2. Block Diagram - MAIN Section - ................................... 34

6-3. Block Diagram - DAMP Section - .................................. 35

6-4. Block Diagram - TOUCH/LED DRIVER Section - ....... 36

6-5. Block Diagram

- PANEL/POWER SUPPLY Section - ............................ 37

6-6. Printed Wiring Board - MOTHERBOARD Board - ....... 39

6-7. Printed Wiring Board - DAMP Board - .......................... 40

6-8. Printed Wiring Board - VOLUME Board - ..................... 41

6-9. Schematic Diagram - VOLUME Board (1/2) - ............... 42

6-10. Schematic Diagram - VOLUME Board (2/2) - ............... 43

6-11. Printed Wiring Board - SMPS Board - ........................... 44

6-12. Printed Wiring Board - MIC Board - .............................. 45

6-13. Schematic Diagram - MIC Board - ................................. 45

6-14. Printed Wiring Board - LCD Board - .............................. 46

6-15. Printed Wiring Board

- SENSOR Board (Component Side) - ........................... 47

6-16. Printed Wiring Board

- SENSOR Board (Conductor Side) - ............................. 48

6-17. Printed Wiring Board - IR Board - .................................. 49

6-18. Schematic Diagram - IR Board - .................................... 49

6-19. Printed Wiring Board

- TOP PARTY LIGHT Board - ....................................... 49

6-20. Schematic Diagram

- TOP PARTY LIGHT Board - ....................................... 49

6-21. Printed Wiring Board

- PARTY LIGHT DRIVER Board - ................................ 50

6-22. Schematic Diagram

- PARTY LIGHT DRIVER Board - ................................ 51

6-23. Printed Wiring Board

- BACK PARTY LIGHT L Board - ................................ 52

6-24. Schematic Diagram

- BACK PARTY LIGHT L Board - ................................ 52

6-25. Printed Wiring Board

- BACK PARTY LIGHT R Board - ................................ 52

6-26. Schematic Diagram

- BACK PARTY LIGHT R Board - ................................ 52

6-27. Printed Wiring Board - SPK RGB L Board - .................. 53

6-28. Schematic Diagram - SPK RGB L Board -..................... 53

6-29. Printed Wiring Board - SPK RGB R Board - ................. 53

6-30. Schematic Diagram - SPK RGB R Board - .................... 53

6-31. Printed Wiring Board - USB Board - .............................. 54

6-32. Schematic Diagram - USB Board - ................................. 54

7. EXPLODED VIEWS

7-1. Side Panel Section .......................................................... 56

7-2. Loading Panel Section .................................................... 57

7-3. Back Panel Section ......................................................... 58

7-4. Top Panel, PARTY LIGHT Board Section-1 .................. 59

7-4. Top Panel, PARTY LIGHT Board Section-2 .................. 60

7-5. MOTHERBOARD Board Section .................................. 61

7-6. Chassis Section ............................................................... 62

7-7. Front Panel Section ......................................................... 63

7-8. Speaker Cabinet Section ................................................. 64

7-9. CDM Section .................................................................. 65

7-10. CD/DVD Mechanism Section

(CDM90-DVBU204//C) ................................................. 66

8. ELECTRICAL PARTS LIST .............................. 67

Accessories are listed in the last part of the electrical parts list.

MHC-V50/V50D

SECTION 1

SERVICING NOTES

UNLEADED SOLDER

Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size)

: LEAD FREE MARK

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 °C.

Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to ﬂ ow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

CAUTION

Use of controls or adjustments or performance of procedures other than those speciﬁ ed herein may result in hazardous radiation exposure.

MODEL IDENTIFICATION

– Rear View –

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US, CND

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MODEL NUMBER LABEL

HOME AUDIO SYSTEM

MADE IN CHINA

Model Part No.

Destination Code

Part No.

4-689-434-0[]

4-689-434-4[]

4-689-434-7[]

4-689-435-0[]

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT

The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The ﬂ exible board is easily damaged and should be handled with care.

NOTES ON LASER DIODE EMISSION CHECK

The laser beam on this model is concentrated so as to be focused on the disc reﬂ ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens.

This appliance is classiﬁ ed as a CLASS 1 LASER product under IEC 60825-1:2007. This marking is located on the rear exterior.

• Abbreviation AUS : Australian model CND : Canadian model LA9 : Latin-American model

PLAYABLE DISCS

• DVD VIDEO (V50D)

• DVD-R/DVD-RW in DVD VIDEO format or video mode (V50D)

• DVD+R/DVD+RW in DVD VIDEO format (V50D)

• VIDEO CD (Ver. 1.0, 1.1, and 2.0 discs) (V50D)

• Super VCD (V50D)

• CD-R/CD-RW/CD-ROM in VIDEO CD format or super VCD format

• AUDIO CD

• CD-R/CD-RW in AUDIO CD format

PLAYABLE FILES ON DISCS/USB DEVICE

• Music: MP3 ﬁ les

1)2)

(.mp3), WMA ﬁ les

2)3)

(.wma), AAC ﬁ les

2)3)

(.m4a/.mp4/.3gp), WAV ﬁ les3) (.wav)

• Video (V50D): MPEG4 ﬁ les4) (.mp4/.m4v), Xvid ﬁ les (.avi)

MP3 (MPEG 1 Audio Layer 3) is a standard format deﬁ ned by ISO/MPEG for compressed audio data. MP3 ﬁ les must be in MPEG 1 Audio Layer 3 format.

Files with copyright protection (Digital Rights Management) cannot be played back by the system.

USB device only.

MPEG4 ﬁ les must be recorded in MP4 ﬁ le format. Supported

video codec and audio codec are as follows: – Video codec: MPEG4 Simple Proﬁ le (AVC is not supported.) – Audio codec: AAC-LC (HE-AAC is not supported.)

MHC-V50/V50D

Note

• JIG When disassembling the set, use the following jig (for front

panel removal).

Part No.: J-2501-238-A JIG FOR SPEAKER REMOVAL

NOTE OF REPLACEMENT OF THE MS-476 BOARD

When the MS-476 board is defective, exchange the entire CDM90 ASSY.

NOTE OF REPLACEMENT OF THE SENSOR BOARD

When the SENSOR board is defective, exchange the SERVICE, TOP PANEL ASSY.

TEST DISCS

Use following TEST DISC when this unit conﬁ rms the operation and checks it.

• For CD Part No. Description

3-702-101-01 DISC (YEDS-18), TEST 4-225-203-01 DISC (PATD-012), TEST J-2501-307-A DISC (HLX-A1), TEST

• For DVD SL (Single Layer) Part No. Description

J-6090-069-A DISC (HLX-503), TEST (NTSC) J-6090-088-A DISC (HLX-504), TEST (NTSC) J-2501-305-A DISC (HLX-513), TEST (NTSC) J-6090-077-A DISC (HLX-506), TEST (PAL)

• For DVD DL (Double Layer) Part No. Description

J-6090-071-A DISC (HLX-501), TEST (NTSC) J-6090-089-A DISC (HLX-505), TEST (NTSC) J-2501-306-A DISC (HLX-514), TEST (NTSC) J-6090-078-A DISC (HLX-507), TEST (PAL)

If “PROTECTX” (X is a number) appears on the display

Immediately unplug the AC power cord (mains lead), and check if anything is blocking the ventilation openings of the unit.

After you have checked and found no problems, reconnect the AC power cord (mains lead), and turn on the system. If the issue persists, contact your nearest Sony dealer.

Protect Type Description:

X (Error Code) Description

2 Defect of thermistor IC or charging circuit

used by SPM (Sound Pressure Management) system.

There is possibility of over current happen at speaker output. or Unusual heat up of AMP IC by improper assembly of heat sink.

DC appears in SP terminal by defect of AMP IC.

6 Defect of DC FAN and DC FAN driver circuit.

RELEASING THE DISC TRAY LOCK

The disc tray lock function for the antitheft of an demonstration disc in the store is equipped. It can release the lock function in the following procedure.

Releasing Procedure:

1. Press [

1] button to turn the power on.

2. Touch the [FUNCTION] touch key until the message “DVD/ CD” is displayed.

3. Touch the [ENTER] and [VOCAL FADER] touch keys simultaneously and hold down for around 3 seconds.

4. The message “UNLOCKED” is displayed and the disc tray is unlocked.

Note: When “LOCKED” is displayed, the disc tray lock is not released by

turning power on/off with the

[1] button.

NOTE OF REPLACING THE IC2002 AND IC2003 ON THE DAMP BOARD AND THE COMPLETE DAMP BOARD

When IC2002 and IC2003 on the DAMP board and the complete DAMP board are replaced, it is necessary to spread the compound between parts and heat sink.

Part No. Description 7-300-009-67 THERMAL COMPOUND (TIG2000)

Spread the compound referring to the ﬁ gure below.

– DAMP Board (Component Side) –

thermal compound (TIG2000)

IC2003

thermal compound (TIG2000)

IC2002

MHC-V50/V50D

NOTE OF REPLACING MOTHERBOARD BOARD OR BLUETOOTH MODULE OR RC-S730 (WW) BOARD

When the MOTHERBOARD board or BLUETOOTH module or RC-S730 (WW) board are replaced, please execute the below service mode.

Pairing this system with a

1. Press the [1] button to turn the power on.

2. Place the Bluetooth device within 1 meter (3 feet) from the

system.

3. Touch BLUETOOTH on the unit to select Bluetooth function.

“BT AUDIO” appears on the display.

Hint

• When there is no pairing information on the system, “PAIRashes on the display and the system enters the pairing

ING” ﬂ mode. Proceed to step 5.

• If the system is connected to a BLUETOOTH device, touch

BLUETOOTH on the unit to disconnect the BLUETOOTH device.

4. Touch and hold PAIRING on the unit for 2 seconds or more. “PAIRING” ﬂ ashes in the display panel.

5. Perform the pairing procedure on the Bluetooth device.

6. Select model’s name on the display of the Bluetooth device. For example, select “MHC-V50 or MHC-V50D”. If passkey

is required on the Bluetooth device, enter “0000”.

7. Perform the Bluetooth connection on the Bluetooth device.

8. When pairing is completed and the Bluetooth connection is established, the Bluetooth device name appears on the display.

9. To cancel pairing operation, touch and hold PAIRING on the unit for 2 seconds or more until “BT AUDIO” appears on the display.

Bluetooth

device

Connecting with a smartphone by one touch (NFC)

Playing music from a

For a Bluetooth device

1. Press the [

2. Touch BLUETOOTH on the unit to select Bluetooth function. “BT AUDIO” appears on the display.

3. Establish connection with the Bluetooth device. Touch BLUETOOTH on the unit to connect to the last

connected Bluetooth device.

Perform the Bluetooth connection from the Bluetooth device if

the device is not connected.

Once the connection is established, the Bluetooth device name

appears on the display.

4. Touch N. Depending on the Bluetooth device, – you may have to touch N twice. – you may need to start playback of an audio source on the

Bluetooth device.

For an NFC-compatible smartphone

1. Press the [1] button to turn the power on. Touch the smartphone to the N-Mark on the system to establish

the Bluetooth connection.

Start playback of an audio source on the smartphone. For

details on playback, refer to the operating instructions of your smartphone.

To disconnect the Bluetooth device For a Bluetooth device

Touch BLUETOOTH on the unit. “BT AUDIO” appears on the display.

For an NFC-compatible smartphone

Touch the smartphone to the N-Mark on the system again.

1] button to turn the power on.

Bluetooth

device

Note: The operation in this mode must use a NFC-compatible smartphone

(Smartphones with a built-in NFC function [OS: Android 2.3.3 or later, excluding Android 3.x])

1. Press the [1] button to turn the power on.

2. Download and install the app “NFC Easy Connect”.

Download the free Android app from Google Play by searching

for “NFC Easy Connect”.

3. Start the app “NFC Easy Connect” on the smartphone.

Make sure that the application screen is displayed.

4. Touch the smartphone to the N-Mark on the system until the smartphone vibrates.

Complete the connection by following the instructions

displayed on the smartphone.

5. When pairing is completed and the Bluetooth connection is established, the Bluetooth device name appears on the display.

To erase all the pairing registration information perform BLUETOOTH PAIRING HISTORY CLEAR test mode (Refer page 24).

HOW TO OPEN THE TRAY WHEN POWER SWITCH TURN OFF

Note 1: After the side panel and top panel are removed, this work is done. Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).

1 Remove the side L, R panel, top panel section. (Illustration of disassembly is omitted.)

hole

MHC-V50/V50D

Insert the clip etc. processed to the length of 8 cm or more in the hole on the side of the CDM and push.

CD/DVD mechanism deck

8 cm or more

Note: Push after it inserts it

in this hole well.

– Left view –

2 Insert the clip etc.

tray

– Top view –

MHC-V50/V50D

CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION

SMPS Board (Conductor side view)

In checking the SMPS board, make 3 capacitors discharge of C914, C1003 and C1006 for eletrical shock prevention.

C1003

800 :/5 W

C1006

800 :/5 W

C914

DAMP Board (Conductor side view)

In checking the DAMP board, make 1 capacitor discharge of C2076 for electrical shock prevention.

800 :/5 W

C2076

800 :/5 W

SERVICE POSITION

MHC-V50/V50D

top panel section

stand

SMPS board

CDM section

VOLUME board

IR board

MIC board

LCD board

USB board

stand

DAMP board

insulating sheet

MOTHERBOARD board

MHC-V50/V50D

Note: Disassemble the unit in the order as shown below.

2-1. DISASSEMBLY FLOW

SET

2-2. SIDE (L) PANEL, SIDE (R) PANEL (Page 11)

2-3. TOP PANEL SECTION (Page 12)

2-4. LOADING PANEL ASSY (Page 13)

2-5. CDM SECTION (Page 14)

SECTION 2

DISASSEMBLY

2-6. BACK PANEL SECTION, MODULE COVER (Page 15)

2-7. DAMP BOARD (Page 16)

2-8. BRACKET CHASSIS (Page 17)

2-9. MOTHERBOARD BOARD (Page 18)

2-10. SMPS BOARD (Page 19)

2-11. CHASSIS (Page 19)

2-15. SERVICE OPTICAL DEVICE (7G), FLEXIBLE FLAT CABLE (Page 23)

2-12. FRONT PANEL SECTION (Page 20)

2-13. LOUDSPEAKER (20CM) (Page 21)

2-14. LOUDSPEAKER (8CM) (Page 22)

Note: Follow the disassembly procedure in the numerical order given.

2-2. SIDE (L) PANEL, SIDE (R) PANEL

MHC-V50/V50D

1 one screw (SCREW, TAPPING)

4 three claws

2 three screws

(SCREW, TAPPING)

6 panel, side (L)

5 Remove the panel, side (L)

in the direction of the arrow.

3 two screws (+BVTP 3 x 8)

6 panel, side (R)

3 two screws

(+BVTP 3 x 8)

4 three claws

1 one screw

(SCREW, TAPPING)

2 three screws (SCREW, TAPPING)

5 Remove the panel, side (R) in the direction of the arrow.

– Front view –

MHC-V50/V50D

2-3. TOP PANEL SECTION

q; flexible flat cable (6 core) (CN105)

qg panel, top section

7 flexible flat cable

(9 core) (CN1400)

5 Remove the panel, top section in the direction of the arrow.

4 three claws

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panel, top section

qf CN1255 (3P)

top

1 one screw (+BVTP 3 x 8)

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MIC board

clip, coating

2 hemilon, 10XLX0.4

3 one screw

(+BV3 (3-CR))

8 CN451 (5P)

9 CN2100 (8P)

rear side

TOP PARTY LED board

LCD board

6 flexible flat cable (29 core) (CN126)

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MOTHERBOARD board

hemilon, 10XLX0.4

USB board

top

panel, back section

qd CN1003 (8P)

– Front view –

Note 1: When installing the

colored line is not slanted after insertion.

Insert is straight to the interior. Insert is incline

flexible flat cable

colored line

flexible flat cable

flexible flat

cable colored line connectorconnector

, ensure that the

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qa hemilon,

10XLX0.4

qs hemilon, 10XLX0.4

Note 2: When you install the connector, please install them correctly.

There is a possibility that this machine damages when not correctly installing it.

OK NG NG

Insert is straight to the interior.

connector

Insert is shallow

connector

MOTHERBOARD board

hemilon, 10XLX0.4

Insert is incline

connector

connector connector

top

2-4. LOADING PANEL ASSY

MHC-V50/V50D

3 three claws

4 panel, loading

assy

hole

Insert the clip etc. processed to the length of 8 cm or more in the hole on the side of the CDM and push.

CD/DVD mechanism deck

8 cm or more

Note: Push after it inserts it

in this hole well.

– Left view –

tray

– Top view –

1 Insert the clip etc.

2 Draw out the tray.

– Front view –

MHC-V50/V50D

2-5. CDM SECTION

Note 1: When installing the flexible flat cable, ensure that the colored line is not slanted after insertion.

Insert is straight to the interior.

flexible flat cable

colored line

connector

Insert is incline

flexible flat cable

colored line

connector

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Draw out the wire from bracket, CDM.

CDM90-DVBU204//C

Note 2: When you install the connector, please install them correctly.

There is a possibility that this machine damages when not correctly installing it.

bracket, CDM

rear side

qs CDM90-DVBU204//C

q; four screws (+BVTP 3 x 8)

1 two screws

(+BVTP 3 x 8)

7 CN401 (6P)

8 flexible flat cable

(5 core) (CN303)

9 flexible flat

cable (24 core) (CN302)

qd bracket, CDM

4 Remove the

CDM section in the direction of the arrow.

3 two claws

OK NG NG

Insert is straight to the interior.

connector

Insert is shallow

connector

connector connector

Insert is incline

connector

–5HDUYLHZ–

6 CN2100 (8P)

2 two screws

(+BVTP 3 x 8)

2-6. BACK PANEL SECTION, MODULE COVER

Note: When you install the connector, please install them correctly.

There is a possibility that this machine damages when not correctly installing it.

OK NG NG

Insert is straight to the interior.

connector

Insert is shallow

connector

connector connector

connector

4 Remove the wire from clip, coating.

Insert is incline

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MHC-V50/V50D

hemilon, 10XLX0.4

clip, coating

fan, DC

rear side

(V50D)

6 CN2001 (2P)

5 hemilon, 10XLX0.4

7 four screws (+BVTP 3 x 8)

MOTHERBOARD board

qd panel, back section

8 three screws (+BVTP 3 x 8)

Remove the module, cover

in the direction of the arrow.

(V50D)

qa one screw (+B 3 x 6)

9 two screws (+BVTP 3 x 8)

qs sheet, service cover

q; one screw (+BVTP 3 x 8)

module, cover

1 one screw

(+BVTP 3 x 8)

–5HDUYLHZ–

MHC-V50/V50D

2-7. DAMP BOARD

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1 Remove the wire from clip, coating.

DAMP board

clip, coating

5 flexible flat cable (25 core) (CN2004)

front side

6 four screws (+BVTP 3 x 8)

7 clip, coating

qa heatsink (AMP)

Note: When you install the heatsink (AMP),

spread the compound referring to “NOTE OF REPLACING THE IC2002 AND IC2003 ON THE DAMP BOARD AND THE COMPLETE DAMP BOARD”

9 DAMP board

q; three screws

(+BVTP 3 x 10)

2 CN2003 (7P)

on servicing notes (page 5).

8 clip, coating

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front side

4 Remove the wire from clip, coating.

Note 1: When installing the

colored line is not slanted after insertion.

Insert is straight to the interior. Insert is incline

flexible flat cable

colored line

flexible flat cable

flexible flat

cable colored line connectorconnector

, ensure that the

DAMP board

3 CN2002 (11P)

– Rear view –

Note 2: When you install the connector, please install them correctly.

There is a possibility that this machine damages when not correctly installing it.

OK NG NG

Insert is straight to the interior.

connector

Insert is shallow

connector

connector connector

clip, coating

Insert is incline

connector

2-8. BRACKET CHASSIS

MHC-V50/V50D

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3 Remove the wires from clip, coating.

MOTHERBOARD board

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MOTHERBOARD board

hemilon, 10XLX0.4

front side

clip, coating

front side

1 hemilon, 10XLX0.4

5 five screws (+BV3 (3-CR))

6 Remove

bracket, chassis in the direction of arrow.

8 CN2002 (11P)

9 bracket,

chassis

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front side

7 Draw out the wire from bracket, chassis.

bracket, chassis

4 CN001 (9P)

Note 1: When installing the

colored line is not slanted after insertion.

Insert is straight to the interior. Insert is incline

flexible flat cable

colored line

flexible flat cable

colored line

connectorconnector

, ensure that the

2 flexible flat cable (10 core) (CN102)

Note 2: When you install the connector, please install them correctly.

There is a possibility that this machine damages when not correctly installing it.

OK NG NG

Insert is straight to the interior.

connector

Insert is shallow

connector

connector connector

– Rear view –

Insert is incline

connector

MHC-V50/V50D

2-9. MOTHERBOARD BOARD

Note: When the MOTHERBOARD BOARD is replaced, refer to

“NOTE OF REPLACING MOTHERBOARD BOARD OR BLUETOOTH MODULE OR RC-S730 (WW) BOARD” on page 6.

1 five screws (+BVTP 3 x 8)

2 clip, coating

3 MOTHERBOARD board

(V50D)

– Rear view –

2-10. SMPS BOARD

1 six screws (+PWH 3 x 8 (SUMITITE))

MHC-V50/V50D

2 three screws (+PWH 3 x 8 (SUMITITE))

3 SMPS board

2-11. CHASSIS

– Rear view –

1 six screws (STEP SCREW M4)

2 one claw

3 chassis

– Rear view –

MHC-V50/V50D

2-12. FRONT PANEL SECTION

total sixteen bosses

3 Insert the jig into a space and slowly remove the front panel section.

Note 1: When using a jig, please work so as not to injure front panel section and speaker cabinet.

4 All bosses are removed while moving jig in the direction of the arrow, and front panel section is removed.

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5 Push the protrusion, and remove the terminal (wide side).

loudspeaker (4cm)

5 Push the protrusion, and remove the terminal (narrow side).

7 front panel section

Note 2: When installing the front panel section, remove the used glue and use a new glue to fix the front panel.

top side

protrusion

2 two screws ((3.5 x 16), TAPPING)

1 one screw ((3.5 x 16), TAPPING)

3 Insert the jig into a space and slowly

remove the front panel section.

Note 1: When using a jig, please work so as not to injure front panel section and speaker cabinet.

4 All bosses are removed while moving jig in the direction of the arrow, and front panel section is removed.

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5 Push the protrusion, and remove the terminal (narrow side).

top side

loudspeaker (4cm)

protrusion

6 Remove the front panel section in the direction of an arrow.

5 Push the protrusion, and remove the terminal (wide side).

2-13. LOUDSPEAKER (20CM)

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3 Push the protrusion, and remove the terminal (wide side).

MHC-V50/V50D

top side

protrusion

3 Push the protrusion, and remove the terminal (narrow side).

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loudspeaker (20CM)

terminal position

loudspeaker (20CM)

terminal (narrow side)

terminal (wide side)

2 Remove the loudspeaker (20CM) in the direction of the arrow.

4 loudspeaker (20CM)

1 four screws ((4 x 20), +BV TAPPING)

–)URQWYLHZ–

+ 49 hidden pages

Sony MHC-V50, MHC-V50D Schematic

TABLE OF CONTENTS

SERVICING NOTES

2-1. DISASSEMBLY FLOW

DISASSEMBLY

2-2. SIDE (L) PANEL, SIDE (R) PANEL

2-3. TOP PANEL SECTION

2-4. LOADING PANEL ASSY

2-5. CDM SECTION

2-6. BACK PANEL SECTION, MODULE COVER

2-7. DAMP BOARD

2-8. BRACKET CHASSIS

2-9. MOTHERBOARD BOARD

2-10. SMPS BOARD

2-11. CHASSIS

2-12. FRONT PANEL SECTION

2-13. LOUDSPEAKER (20CM)