Siemens SAB80C515A-M18-T3, SAB80C515A-N18, SAB80C515A-N18-T3, SAB83C515A-5M18-T3, SAB83C515A-5N18 Datasheet

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Microcomputer Components
8-Bit CMOS Single-Chip Microcontroller
SAB 80C515A/83C515A-5
Data Sheet 08.95
High-Performance SAB 80C515A / 83C515A-5 8-Bit CMOS Single-Chip Microcontroller
Preliminary SAB 83C515A-5 Microcontroller with factory mask-programmable ROM
SAB 80C515A Microcontroller for external ROM
SAB 80C515A / 83C515A-5, up to 18 MHz operation frequency
×
32 K 256 Additional 1 K
8 ROM (SAB 83C515A-5 only, ROM-Protection available)
×
8 on-chip RAM
8 on-chip RAM (XRAM)
×
Superset of SAB 80C51 architecture: 1
µ
s instruction cycle time at 12 MHz 666 ns instruction cycle time at 18 MHz 256 directly addressable bits Boolean processor 64 Kbyte external data and program memory addressing Three 16-bit timer/counters Versatile "fail-safe" provisions Twelve interrupt vectors, four priority levels selectable Genuine 10-bit A/D converter with 8 multiplexed inputs Full duplex serial interface with programmable Baudrate-Generator Functionally compatible with SAB 80C515 Extended power saving mode Fast Power-On Reset Seven ports: 48 I/O lines, 8 input lines Two temperature ranges available: 0 to 70 ° C (T1) – 40 to 85 ° C (T3) Plastic packages: P-LCC-68 and P-MQFP-80
The SAB 80C515A/83C515A-5 is a high-end member of the Siemens SAB 8051 microcontroller family. It is designed in Siemens ACMOS technology and based on the SAB 8051 architecture. ACMOS is a technology which combines high-speed and density characteristics with low-power consumption or dissipation.
While maintaining all the SAB 80C515 features and operating characteristics the SAB 80C515A/83C515A-5 contains more on-chip RAM/ROM. Furthermore a new 10-bit A/D­Converter is implemented as well as extended security mechanisms. The SAB 80C515A is identical with the SAB 83C515A-5 except that it lacks the on-chip program memory. The SAB 80C515A / 83C515A-5 is supplied in a 68-pin plastic leaded chip carrier package (P-LCC- 68) and in a 80-pin plastic metric quad flat package (P-MQFP-80).
Versions for extended temperature range – 40 to + 110
C are available on request.
Semiconductor Group 1 08.95
SAB 80C515A/83C515A-5
Ordering Information Type Ordering
Code
Package Description
8-Bit CMOS microcontroller
SAB 80C515A-N18 Q67120-C0581 P-LCC-68 for external memory, 18 MHz SAB 83C515A-5N18 Q67120-DXXXX P-LCC-68 with mask-programmable ROM,
18 MHz
SAB 80C515A-N18-T3 Q67120-C0784 P-LCC-68 for external memory, 18 MHz
ext. temperature − 40 to + 85 ° C
SAB 83C515A-5N18-T3 Q67120-DXXXX P-LCC-68 with mask-programmable ROM,
18 MHz ext. temperature − 40 to + 85 ° C
SAB 80C515A-M18-T3 Q67120-C0851 P-MQFP-80 for external memory, 18 MHz
ext. temperature − 40 to + 85 ° C
SAB 83C515A-5M18-T3 Q67120-DXXXX P-MQFP-80 with mask-programmable ROM,
18 MHz
40 to + 85 ° C
Notes
ext. temperature
:
Versions for extended temperature range − 40 to + 110 The ordering number of ROM types (DXXXX extension) is defined after program release (verification) of the customer.
C on request.
°
Semiconductor Group 2
SAB 80C515A/83C515A-5
Logic Symbol
Semiconductor Group 3
SAB 80C515A/83C515A-5
The pin functions of the SAB 80C515A are identical with those of the SAB 80C515 with following exception:
Pin SAB 80C515A SAB 80C515
68 1 4
HWPD P0.4/ADST PE/SWD
V
CC
P4.0 PE
Pin Configuration
(P-LCC-68)
Semiconductor Group 4
P4.7
P4.6
P4.5
P4.4
P4.3
/ SWD
P4.2
PE
P4.1
N.C.
P4.0 / ADST
N.C.
HWPD
N.C.
P5.0
SAB 80C515A/83C515A-5
P5.2
P5.1
P5.3
P5.4
P5.5
P5.6
RESET
N.C.
VAREF
VAGND P6.7 / AIN7 P6.6 / AIN6 P6.5 / AIN5 P6.4 / AIN4 P6.3 / AIN3 P6.2 / AIN2 P6.1 / AIN1 P6.0 / AIN0
N.C.
N.C. P3.0 / RXD0 P3.1 / TXD0
P3.2 / INT0 P3.3 / INT1
P3.4 / T0 P3.5 / T1
80
1
5
10
15
20
21 25 30
P3.6 / WR
SAB 80C515A / 80C515A-5
N.C.
P1.7 / T2
P3.7 / RD
P1.4 / INT2
P1.5 / T2EX
P1.6 / CLKOUT
P1.3 / INT6 / CC3
35
VSS
VCC
VCC
/ CC0
P1.2 / INT5 / CC2
P1.1 / INT4 / CC1
P1.0 / INT3
657075
VSS
XTAL2
XTAL1
61
60
55
50
45
41
40
P2.0 / A8
P2.1 / A9
P2.2 / A10
P5.7 P0.7 / AD7 P0.6 / AD6 P0.5 / AD5 P0.4 / AD4 P0.3 / AD3 P0.2 / AD2 P0.1 / AD1 P0.0 / AD0 N.C. N.C. EA ALE PSEN N.C. P2.7 / A15 P2.6 / A14 P2.5 / A13 P2.4 / A12 P2.3 / A11
N.C. pins must not be connected.
Pin Configuration
(P-MQFP-80 )
Semiconductor Group 5
Pin Definitions and Functions
SAB 80C515A/83C515A-5
Symbol Pin
P-LCC-68
Pin P-MQFP-80
P4.0-P4.7 1-3, 5-9 72-74,
76-80
PE
/SWD 4 75 I
Input (I) Output (O)
I/O
Function
Port 4
is an 8-bit bidirectional I/O port with internal pull-up resistors. Port 4 pins that have 1’s writ­ten to them are pulled high by the internal pull­up resistors, and in that state can be used as inputs. As inputs, port 4 pins being externally pulled low will source current ( I
, in the DC
IL
characteristics) because of the internal pull-up resistors. P4 also contains the external A/D converter control pin. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate. The sec­ondary function assigned to port 6: – ADST
(P4.0): external A/D converter start
pin
Power saving mode enable/Start Watch­dog Timer
A low level on this pin allows the software to enter the power down, idle and slow down mode. In case the low level is also seen during reset, the watchdog timer function is off on de­fault. Use of the software controlled power saving modes is blocked, when this pin is held on high level. A high level during reset performs an automatic start of the watchdog timer im­mediately after reset. When left unconnected this pin is pulled high by a weak internal pull-up resistor.
RESET
V
AREF1
V
AGND
10 1 I
11 3 12 4
Semiconductor Group 6
Reset pin
A low level on this pin for the duration of two machine cycles while the oscillator is running resets the SAB 80C515A. A small internal pullup resistor permits power-on reset using only a capacitor connected to
V
SS
Reference voltage for the A/D converter Reference ground for the A/D converter
Pin Definitions and Functions (cont’d)
SAB 80C515A/83C515A-5
Symbol Pin
P-LCC-68
Pin P-MQFP-80
Input (I) Output (O)
P6.7-P6.0 13-20 5-12 I
P3.0-P3.7 21-28 15-22 I/O
Function
Port 6
is an 8-bit unidirectional input port to the A/ D converter. Port pins can be used for digital input, if voltage levels simultaneously meet the specifications high/low input voltages, and for the eight multiplexed analog inputs.
Port 3
is an 8-bit bidirectional I/O port with internal pullup resistors. Port 3 pins that have1's written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 3 pins being externally pulled low will source current (
I
, in
IL
the DC characteristics) because of the internal pullup resistors. Port 3 also contains the interrupt, timer, serial port and external memory strobe pins that are used by various options. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate. The secondary functions are assigned to the pins of port 3, as follows:
–R
×
D (P3.0): serial port’s receiver data
input (asynchronous) or data input/output (synchronous)
–T
×
D (P3.1): serial port’s transmitter data
output (asynchronous) or clock output (synchronous)
– INT0
(P3.2): interrupt 0 input/timer 0 gate
control input
– INT1
(P3.3): interrupt 1 input/timer 1 gate
control input – T0 (P3.4): counter 0 input – T1 (P3.5): counter 1 input –WR
(P3.6): the write control signal
latches the data byte from
port 0 into the external data
memory –RD
(P3.7): the read control signal
enables the external data
memory to port 0
Semiconductor Group 7
Pin Definitions and Functions (cont’d)
SAB 80C515A/83C515A-5
Symbol Pin
P-LCC-68
P1.7 ­P1.0
29-36 24-31 I/O
Pin P-MQFP-80
Input (I) Output (O)
Function
Port 1
is an 8-bit bidirectional I/O port with internal pullup resistors. Port 1 pins that have 1's written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 1 pins being externally pulled low will source current (
the DC characteristics) because of the internal pullup resistors. The port is used for the low­order address byte during program verification. Port 1 also contains the interrupt, timer, clock, capture and compare pins that are used by various options. The output latch corresponding to a secondary function must be programmed to a one (1) for that function to operate (except when used for the compare functions). The secondary functions are assigned to the port 1 pins as follows:
– INT3
/CC0 (P1.0): interrupt 3 input /
compare 0 output / capture 0 input
I
in
IL
XTAL2 39 36
– INT4/CC1 (P1.1): interrupt 4 input /
compare 1 output / capture 1 input
– INT5/CC2 (P1.2): interrupt 5 input /
compare 2 output / capture 2 input
– INT6/CC3 (P1.3): interrupt 6 input /
compare 3 output /
capture 3 input – INT2 – T2EX (P1.5): timer 2 external
– CLKOUT (P1.6): system clock output – T2 (P1.7): counter 2 input
XTAL2
Input to the inverting oscillator amplifier and input to the internal clock generator circuits.
(P1.4): interrupt 2 input
reloadtrigger input
Semiconductor Group 8
Pin Definitions and Functions (cont’d)
SAB 80C515A/83C515A-5
-
Symbol Pin
P-LCC-68
Pin P-MQFP-80
Input (I) Output (O)
XTAL1 40 37
P2.0-P2.7 41-48 38-45 I/O
Function
XTAL1
Output of the inverting oscillator amplifier. To drive the device from an external clock source, XTAL2 should be driven, while XTAL1 is left unconnected. There are no require­ments on the duty cycle of the external clock signal, since the input to the internal clok­king circuitry is divided down by a divide-by­two flip-flop. Minimum and maximum high and low times and rise/fall times specified in the AC characteristics must be taken into account.
Port 2
is an 8-bit bidirectional I/O port with internal pullup resistors. Port 2 pins that have 1's written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 2 pins being externally pulled low will source current (
I
in
IL,
the DC characteristics) because of the internal pullup resistors. Port 2 emits the high-order address byte during fetches from external program memory and during accesses to external data memory that use 16-bit addresses (MOVX@DPTR). In this application it uses strong internal pullup resistors when issuing 1's. During accesses to external data memory that use 8-bit addresses (MOVX@Ri), port 2 issues the contents of the P2 special function register.
PSEN
49 47 O The Program Store Enable
output is a control signal that enables the external program memory to the bus during external fetch operations. It is activated every six oscillator periods, except during external data memory accesses. The signal remains high during internal program execution.
ALE 50 48 O The
output is used for latching the address into external memory during normal operation. It is activated every six oscillator periods, except during an external data memory access.
Semiconductor Group 9
Address Latch enable
Pin Definitions and Functions (cont’d)
SAB 80C515A/83C515A-5
Symbol Pin
P-LCC-68
Pin P-MQFP-80
Input (I) Output (O)
Function
EA 51 49 I External Access Enable
When held high, the SAB 80C515A executes instructions from the internal ROM as long as the PC is less than 32768. When held low, the SAB 80C515A fetches all instructions from external program memory. For the SAB 80C515A this pin must be tied low.
P0.0-P0.7 52-59 52-59 I/O Port 0
is an 8-bit open-drain bidirectional I/O port. Port 0 pins that have 1's written to them float, and in that state can be used as high­impedance inputs. Port 0 is also the multiplexed low-order address and data bus during accesses to external program and data memory. In this application it uses strong internal pullup resistors when issuing 1's. Port 0 also outputs the code bytes during program verification in the SAB 80C515A. External pullup resistors are required during program verification.
P5.7-P5.0 60-67 60-67 I/O Port 5 is an 8-bit bidirectional I/O port with
internal pullup resistors. Port 5 pins that have 1's written to them are pulled high by the internal pullup resistors, and in that state can be used as inputs. As inputs, port 5 pins being externally pulled low will source current (I
in the DC characteristics) because of the
IL
internal pullup resistors.
HWPD
68 69 I Hardware Power Down
A low level on this pin for the duration of one machine cycle while the oscillator is running resets the SAB 80C515A. A low level for a longer period will force the part to Power Down Mode with the pins float­ing. (see table 5)
V
CC
37 32, 33 Supply voltage
during normal, idle, and power-down operation.
V
SS
N.C. 2, 13, 14, 23,
38 34, 35 Ground (0 V)
Not connected 46, 50, 51, 68, 70, 71
These pins of the P-MQFP-80 package must not be connected.
Semiconductor Group 10
SAB 80C515A/83C515A-5
Figure 1 Block Diagram
Semiconductor Group 11
SAB 80C515A/83C515A-5
Functional Description
The SAB 80C515A is based on 8051 architecture. It is a fully compatible member of the Siemens SAB 8051/80C51 microcontroller family being an significantly enhanced SAB 80C515. The SAB 80C515A is therefore code compatible with the SAB 80C515.
Having an 8-bit CPU with extensive facilities for bit-handling and binary BCD arithmetics the SAB 80C515A is optimized for control applications. With a 18 MHz crystal, 58 % of the instructions are executed in 666.67 ns.
While maintaining all architectural and operational characteristics of the SAB 80C515 the SAB 80C515A incorporates more on-chip RAM. A new 10-bit A/D-Converter is implemented as well as an oscillator watchdog unit. Also the maximum operating frequency of 18 MHz is higher than at the SAB 80C515.
With exception of the ROM sizes both parts are identical. Therefore the therm SAB 80C515A refers to both versions within this specification unless otherwise noted.
Memory Organisation
According to the SAB 8051 architecture, the SAB 80C515A has separate address spaces for program and data memory. Figure 2 illustrates the mapping of address spaces.
Figure 2 Memory Map
Semiconductor Group 12
SAB 80C515A/83C515A-5
Program Memory ('Code Space')
The SAB 83C515A-5 has 32 Kbyte of on-chip ROM, while the SAB 80C515A has no internal ROM. The program memory can externally be expanded up to 64 Kbyte. Pin EA whether program fetches below address 8000
are done from internal or external memory.
H
As a new feature the SAB 83C515A-5 offers the possibility of protecting the internal ROM against unauthorized access. This protection is implemented in the ROM-Mask. Therefore, the decision ROM-Protection 'yes' or 'no' has to be made when delivering the ROM-Code. Once enabled, there is no way of disabling the ROM-Protection.
Effect: The access to internal ROM done by an externally fetched MOVC instruction is
disabled. Nevertheless, an access from internal ROM to external ROM is possible.
To verify the read protected ROM-Code a special ROM-Verify-Mode is implemented. This mode also can be used to verify unprotected internal ROM.
determines
ROM -Protection ROM-Verification Mode
Restrictions
(see 'AC Characteristics')
no ROM-Verification Mode 1
(standard 8051 Verification Mode) ROM-Verification Mode 2
yes ROM-Verification Mode 2 – standard 8051
Verification Mode is disabled
– externally applied MOVC
accessing internal ROM is disabled
Semiconductor Group 13
SAB 80C515A/83C515A-5
Data Memory ('Data Space')
The data memory space consists of an internal and an external memory space.The SAB 80C515A contains another 1 Kbyte on On-Chip RAM additional to the 256-bytes internal RAM of the base type SAB 80C515. This RAM is called XRAM ('extended RAM') in this document.
External Data Memory
Up to 64 Kbyte external data memory can be addressed by instructions that use 8-bit or 16-bit indirect addressing. For 8-bit addressing MOVX instructions in combination with registers R0 and R1 can be used. A 16-bit external memory addressing is supported by a 16-bit datapointer. Registers XPAGE and SYSCON are controlling whether data fetches at addresses F800 FBFF
are done from internal XRAM or from external data memory.
H
Internal Data Memory
H
to
The internal data memory is divided into four physically distinct blocks: – the lower 128 bytes of RAM including four register banks containing eight
registers each – the upper 128 byte of RAM – the 128 byte special function register area. – a 1 K
chip at the address range from F800
× 8 area which is accessed like external RAM (MOVX-instructions), implemented on
to FBFFH. Special Function Register SYSCON
H
controls whether data is read from or written to XRAM or external RAM. A map of the internal data memory is shown in figure 2. The overlapping address spaces of the
standard internal data memory (256 byte) are accessed by different addressing modes (see User's Manual SAB 80C515). The stack can be located anywhere in the internal data memory.
Architecture of the XRAM
The contents of the XRAM is not affected by a reset or HW Power Down. After power-up the contents is undefined, while it remains unchanged during and after a reset or HW Power Down if the power supply is not turned off.
The additional On-Chip RAM is logically located in the "external data memory" range at the upper end of the 64 Kbyte address range (F800 enabled the address range F800
to FFFFH is occupied. This is done to assure software
H
-FBFFH). Nevertheless when XRAM is
H
compatibility to SAB 80C517A. It is possible to enable and disable (only by reset) the XRAM. If it is disabled the device shows the same behaviour as the parts without XRAM, i.e. all MOVX accesses use the external bus to physically external data memory.
Semiconductor Group 14
SAB 80C515A/83C515A-5
Accesses to XRAM
Because the XRAM is used in the same way as external data memory the same instruction types must be used for accessing the XRAM.
Note:
If a reset occurs during a write operation to XRAM, the effect on XRAM depends on the cycle which the reset is detected at (MOVX is a 2-cycle instruction):
Reset detection at cycle 1: The new value will not be written to XRAM. The old value
is not affected.
Reset detection at cycle 2: The old value in XRAM is overwritten by the new value.
Accesses to XRAM using the DPTR
There are a Read and a Write instruction from and to XRAM which use one of the 16-bit DPTR for indirect addressing. The instructions are:
MOVX A, @DPTR (Read) MOVX @DPTR, A (Write) Normally the use of these instructions would use a physically external memory. However, in the
SAB 80C515A the XRAM is accessed if it is enabled and if the DPTR points to the XRAM address space (DPTR F800
Accesses to XRAM using the Registers R0/R1
The 8051 architecture provides also instructions for accesses to external data memory range which use only an 8-bit address (indirect addressing with registers R0 or R1). The instructions are:
).
H
MOVX A, @Ri (Read) MOVX @Ri, A (Write) In application systems, either a real 8-bit bus (with 8-bit address) is used or Port 2 serves as
page register which selects pages of 256-byte. However, the distinction, whether Port 2 is used as general purpose I/O or as "page address" is made by the external system design. From the device’s point of view it cannot be decided whether the Port 2 data is used externally as address or as I/O data!
Hence, a special page register is implemented into the SAB 80C515A to provide the possibility of accessing the XRAM also with the MOVX @Ri instructions, i.e. XPAGE serves the same function for the XRAM as Port 2 for external data memory.
Semiconductor Group 15
Special Function Register XPAGE
SAB 80C515A/83C515A-5
Addr. 91
H
XPAGE
The reset value of XPAGE is 00H. XPAGE can be set and read by software.
The register XPAGE provides the upper address byte for accesses to XRAM with MOVX @Ri instructions. If the address formed from XPAGE and Ri is less than the XRAM address range, then an external access is performed. For the SAB 80C515A the contents of XPAGE must be greater or equal than F8
in order to use the XRAM. Of course, the XRAM must be enabled if
H
it shall be used with MOVX @Ri instructions. Thus, the register XPAGE is used for addressing of the XRAM; additionally its contents are
used for generating the internal XRAM select. If the contents of XPAGE is less than the XRAM address range then an external bus access is performed where the upper address byte is provided by P2 and not by XPAGE!
Therefore, the software has to distinguish two cases, if the MOVX @Ri instructions with paging shall be used:
a) Access to XRAM: The upper address byte must be written to XPAGE or P2;
both writes selects the XRAM address range.
b) Access to external memory: The upper address byte must be written to P2; XPAGE will
be loaded with the same address in order to deselect the XRAM.
Semiconductor Group 16
SAB 80C515A/83C515A-5
Control of XRAM in the SAB 80C515A
There are two control bits in register SYSCON which control the use and the bus operation during accesses to the additional On-Chip RAM (XRAM).
Special Function Register SYSCON
Addr. 0B1
H
XMAP1 XMAP0 SYSCON
Bit Function
XMAP0 Global enable/disable bit for XRAM memory.
XMAP0 =0: The access to XRAM (= On-Chip XDATA memory) is en-
abled.
XMAP0 = 1: The access to XRAM is disabled. All MOVX accesses are
performed by the external bus (reset state).
XMAP1 Control bit for / RD/WR
signals during accesses to XRAM; this bit has no effect if XRAM is disabled (XMAP0 = 1) or if addresses exceeding the XRAM address range are used for MOVX accesses. XMAP1 = 0: The signals RD
and WR are not activated during accesses
to XRAM.
XMAP1 = 1: The signals RD
and WR are activated during accesses to
XRAM.
Reset value of SYSCON is XXXX XX01B. The control bit XMAP0 is a global enable/disable bit for the additional On-Chip RAM (XRAM).
If this bit is set, the XRAM is disabled, all MOVX accesses use external memory via the external bus. In this case the SAB 80C515A does not use the additional On-Chip RAM and is compatible with the types without XRAM.
Semiconductor Group 17
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