Nokia 2190 Service Manual UIF DU8
Programmes After Market Services (PAMS)
Technical Documentation
NHB–3 Series Transceiver
NHB–3 Series Transceiver
Chapter 5
UIF MODULE GU8
PAMS
Technical Documentation
CHAPTER 5 – UIF MODULE DU8
CONTENTS
Page No
Introduction 5–3
Technical Outline 5–3
Mechanics 5–3
Electronics 5–4
List of Submodules and Mechanical Parts 5–5
Technical Specifications 5–5
Maximum Ratings 5–5
DC Characteristics 5–5
Control Signals 5–6
AC Characteristics 5–6
External Signals and Connections 5–7
Mechanical Characteristics 5–9
Functional Description 5–9
Circuit Description 5–9
DU8C Circuit Description 5–9
Keyboard scanning and display driver control 5–9
Keyboard and display illumination 5–9
Audio Circuitry 5–10
LCD Module Interface 5–10
SIM interface 5–11
Power Distribution Diagram 5–11
Assembly 5–12
Construction 5–12
Assembly Description 5–12
Flexi Diagram 5–14
Assembly Parts of UIF Module DU8 5–14
Testing 5–14
Recommended Test Equipment 5–14
Test Procedure 5–14
Circuit Diagram of DU8 5–15
Layout and Foil Diagram 5–16
NHB–3
UIF Module DU8
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Technical Documentation
Introduction
NOTE! UIM (User Identity Module) = SIM (Subscriber Identity Module)
DU8C UI–module ismade for HD851 project. It is used also in HD851EFR product. UI–module is based on GSM/PCN UI–module DU8. Two capacitors pads
added for 18pF capacitors (2320041) from microphone pins to ground. Reason
why capacitors are added is noise to microphone audio in certain situations.
Also some changes are done for reability and productivity reasons. DU8C UI–
module is for NOKIA1 design. Final product use only one 18pF capacitor between microphone pins.
Technical Outline
Mechanics
The module is made from a single flexible printed circuit board – loaded with all
the parts for the User Interface Module. A flexible circuit was used for a number of reasons:
NHB–3
UIF Module DU8
– The material is only 0.3 mm thick – so the phone’s height buildup can be
kept to a minimum.
– The Volume keys, SIM interface and microphone wiring can be folded to fit
in the phone during assembly – since the circuit is flexible.
– Connection from the UIF to the main circuit board can be made with a fold-
ing termination.
The major mechanical parts on the UIF assembly include the following:
– Display Module:– LCD, Heat seal, LCD driver TAB circuit and Light guide.
– Main Keydome assembly: Adhesive film holding 20 metal dome clickers
– Volume & Power Keydome assemblies: Adhesive film (2 films for Style 1)
holding 3 (2 + 1 for Style 1) domes for Vol Up, Vol Down & Power Key.
– Acoustic Components: microphone, speaker, buzzer.
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Technical Documentation
NHB–3
UIF Module DU8
Electronics
1
30
DU8C Style Flexi
Figure 1. Flexi Outline
The following sections of circuitry are on the flexi:
– Microphone Circuit
– Speaker Circuit
– LCD Display Module
– LCD voltage divider & temperature compensation circuit
– Keyboard & Display lighting circuits
– Keyboard switch matrix
– SIM Card Reader
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Technical Documentation
UIF Module DU8
NHB–3
List of Submodules and Mechanical Parts
Module Submodule / Part Material code Notes
DU8C Euro/USA Display Module 4850038 Common part
DU8C Earphone Gasket 9450133 Common part
DU8C Lightguide Assembly 9460074 Common part
DU8C Mic Rubber 9460075 Common part
DU8C Reflector 9480061 Common part
DU8C Speaker Pad 9480062 Common part
DU8C Buzzer Gasket 9480078 Common part
DU8C Keydome Film Assembly 9795002 Main keyboard
DU8C Keydome Film Assembly 9795004 Power key (up right corner)
DU8C Keydome Film Assembly 9795006 Volume keys (side)
NOTE! All parts are common with DU8.
Technical Specifications
Maximum Ratings
DC Characteristics
Table 1. Supply Voltages and Power Consumption
Pin / Conn. Line Symbol Minimum Typical /
Nominal
1 / X4 VL1
24 / X4 VA1
3, 30 / X4 VBATT
4.5 4.65 4.8 V
1.5 mA LCD material B
0.8 mA LCD material D
4.5 4.65 4.8 V
250 uA mic enabled
25 mA max volume level to
5.3 6.0 9.0 V
85 mA 115 mA Buzzer with max vol-
40 mA Display illumination
Maximum Unit / Notes
(without temperature
compensation)
earphone
ume
Original 26/97
40 mA Keyboard illumina-
tion
Page 5–5
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