Nokia 2110i, 2110 UIF MODULES DU9

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

06/97JR Technical Documentation

Contents of UIF Modules DU8, DU9, GU3E

UIF Modules DU8, DU9, GU3E 9–2. . . . . . . . . . . . . . . . . . . . . . . . . . .

General 9–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Hierarchy of Design 9–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mechanics 9–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Specifications 9–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

External Signals and Connectors 9–4. . . . . . . . . . . . . . . . . . . . .

UIF Connector X4 9–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply voltages and power consumption 9–5. . . . . . . . . . . . . .

Control Signals 9–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Warnings and Restrictions 9–5. . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional Description 9–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Keyboard Scanning 9–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Keyboard and Display illumination 9–6. . . . . . . . . . . . . . . . . . . .

Audio Circuitry 9–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

LCD Module Interface 9–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SIM Interface 9–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution Diagram 9–8. . . . . . . . . . . . . . . . . . . . . . . . . .

Circuit Diagram of DU8 (Version 2.7 edit 31) layout 09 9–9. . . . .

Circuit Diagram of DU9 (Version 2.7 edit 36) layout 11 9–10. . . . .

Circuit Diagram of GU3E (Version 1.0 edit 38) layout 06 9–11. . .

Layout Diagrams of DU8 (Version 09) 9–12. . . . . . . . . . . . . . . . . . .

Layout Diagrams of DU9 (Version 11) 9–13. . . . . . . . . . . . . . . . . . .

Layout Diagrams of GU3E (Version 06) 9–14. . . . . . . . . . . . . . . . . .

Parts List of DU8 (EDMS Issue 1.3 Code 0200173) 9–15. . . . . . .

Parts List of DU9 (EDMS Issue 1.2 Code 0200174) 9–18. . . . . . .

Parts List of GU3E (EDMS Issue 1.3 Code 0200516) 9–21. . . . .

9–1

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

06/97JR Technical Documentation

UIF Modules DU8, DU9, GU3E

General

Three modules are described in this document. They are similar in many ways

– the only differences being the keyboard layout. The three modules are used

in the different GSM , PCN and DCS 1900 phones as shown in following pic-

ture:

PHONES

GSM NHE–1XN; 05001 14 NHE–4NX; 0500312

PCN NHK–4XN; 05001 15 NHK–4NX; 0500313

DCS1900 NHB–2NB; 0500498

9–2

UIF MODULE

DU8 0200173

GSM NHE–4NY; 0500314

PCN NHK–4NY; 0500315

GSM NHE–1XA; 05001 17 NHE–4AX; 0500318

PCN NHK–1XA; 0500205 NHK–4AX; 0500319

GSM NHE–1XB; 05001 19 NHE–4BX; 0500316

PCN NHK–1XB; 0500120 NHK–4BX; 0500317

PCN NHK–4PT; 0500489

GU3E 0200516

DU9 0200174

DU9B 0200940

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

Hierarchy of Design

The difference between the three PCB layouts is only the position of the keys &

LEDs (and one less LED on the DU8 version) The DU8 has 20 main keys,

2 volume keys at the side of the flex and a power key in the upper right corner

of the flex. The DU9 has 20 main keys in a slightly different layout and the vol-

ume / power keys combined on one assembly.

The GU3E has one LED less than DU8. Volume and power keys are as in DU8.

Mechanics

06/97JR Technical Documentation

9–3

DU8, DU9 & GU3E Style Flexes

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

06/97JR Technical Documentation

Technical Specifications

External Signals and Connectors

The UIF module has two connectors, display module connector X1 and UIF

connector X4.

UIF Connector X4

Pin Name Description

1 VL1 Logic supply voltage 4.65V

2, 29 GND Ground

3, 30 VBAT Battery voltage

4 BACKLIGHT Backlights on/off

5 – 11 UIF(0:6) Lines for keyboard read and LCD–controller control

9–4

12 MIC_ENA Microphone bias enable

13 – 16 COL(0:3) Lines for keyboard write

17 CALL_LED Call led enable

18 MICP Microphone (positive node)

19 MICN Microphone (negative node)

20 EARP Earpiece (negative node)

21 EARN Earpiece (positive node)

22 BUZZER PWM signal buzzer control

23 XPWRON Power key (active low)

24 VA1 Analog supply voltage 4.65V

25 SIMCLK Clock for SIM data

26 SIMRESET Reset for SIM

27 VSIM SIM voltage supply control

28 SIMDATA Serial data for SIM

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

06/97JR Technical Documentation

Supply voltages and power consumption

Symbol Description Values

VL1 Logic voltage

• typical/nominal

VA Analog voltage

• mic enabled typ/nom current

• max volume level to earphone

typ/nom current

Vbatt Battery voltage

• Buzzer with max volume typ/nom current max current

• display illumination typ/nom current

9–5

1.5 mA

250 µA

25 mA

85 mA 115 mA

40 mA

• keyboard illumination typ/nom current

Control Signals

Symbol Description Values

Mic_Enable Microphone enable

Key and LCD light key and LCD backlightning control

Call_Led Call indicator LED control

Warnings and Restrictions

Limited Bending Ability: The flexible circuits are constructed from a lamination

of three layers of polyamide and two layers of copper tracks. The polyamide

has almost unlimited bending capability – but the copper tracks cannot be bent

to tight radii very often. At all times before the flexi circuit is installed into a

phone, bending of the circuit should be avoided if possible. If the flexi circuit

has already been installed into the phone, then care should be taken not to

continuously fold the flexi circuit out flat and then back to its resting position too

often.

• enabled typ/max

• disabledmin/typ/max

• Lights on min/max

• Lights off min/max

• LED on min/max

• LED off min/max

40 mA

0...3 V VA1–0.4...VA1...VA1+3 V

VA1–1.0...VA1 V

0...2.0 V

VA1–1.0...VA1 V

0...0.4 V

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

Functional Description

The module is connected with 30 pin flex connector to the system board, 24 pin

connector to the LCD module and 6 pin connector to the SIM card.

The module includes following main blocks:

– keyboard – SIM interface – illumination – audio block – LCD Module interface

Keyboard Scanning

COL(0–4) are used as column lines in keyboard. UIF(0–5) are used as row

lines. They are also multiplexed with display driver control signals.

When a key is pressed the ASIC gets an interrupt from a row and the MCU

starts scanning. One column at a time is written to low and rows are used to

read which key it was. The power off detection is multiplexed with one row;

when all keys on the row seems to be pressed the ASIC knows that power key

is pressed. The power key is also connected to PSL+ to switch the power on.

06/97JR Technical Documentation

9–6

Row lines and UIF6 are used for display driver control. UIF(0–3) are used as 4

bit parallel data bus for the driver. UIF4 is used as read/write strobe, UIF5 to

select data or instruction register and UIF6 as enable strobe.

Keyboard and Display illumination

The keyboard illumination is achieved by using two transistors wired as simple

constant current sinks. Each transistor supplies eight leds. The bases of the

transistors are all wired together and supplied by emitter follower V40. The led

current is fixed by the values of R44 and R45 and the ratio of R51 to R52. The

current is about 5 mA/ each LED. Note that on DU9 flexis, the 17

from an additional transistor.

The display illumination operates in a similar way to the keyboard drivers, two

transistors are used to drive eight leds. The current in this case is defined by

the value of R46, R47 and the ratio of R51 to R52. It is about 10 mA/ each LED.

led is driven

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

Audio Circuitry

The earpiece is routed directly via series resistors to connector X4. The ear-

piece is dynamic type. The impedance is 32 Ω and sensitivity 118 dB/1 V.

Microphone is of the electret type and needs a voltage supply for operation.

When MIC_ENA is low bias voltage is connected to the microphone via transis-

tor V8. V2 is wired as a switch for VA1, controlled by the microphone enable

line [MICENA]. VA1 is an analogue rail supplied by the PSL+ chip on the sys-

tem board. It is 4.65 V in magnitude. The sensitivity of the microphone is –62

dB (0 dB = 1V/µbar). C26 and C27 in the MIC nodes act as high pass filter with

pulldown resistors on the baseband side.–3 dB point is about 100Hz.

The buzzer is dynamic one and the impedance is 25 ohm. Buzzer is driven

from a two transistor switch which acts as a buffer for a CMOS output signal

applied at BUZZER. The ringing volume is controlled by pulse width modula-

tion.The diode V37 prevents damage to the transistor when switched off, ab-

sorbing the stored energy in the buzzer inductance and suppressing large posi-

tive going spikes on the transistor collectors.

06/97JR Technical Documentation

9–7

Small value capacitors are fitted at critical points in the circuit to avoid problems

with rf interference. One is placed directly across the microphone (C15). V9 has

a cap to ground from each of its three terminals (C14, C17 and C21). There is

also capacitors in earphone nodes.

LCD Module Interface

The LCD module includes the LCD and the display driver. The driver TAB is

connected with heat seal connection to the LCD. The LCD is FSTN type. The

duty ratio is1/32 and the bias ratio 1/6.7. Viewing direction is 6 o‘clock.

The display driver is NJU6406–02 from JRC. It has internal clock oscillator and

negative voltage generator. It has 9600 bit character generator ROM and 64 * 8

bits character generator RAM. The display module is connected to the UIF

module with 24 pin soldered connection.

The display module contains an oscillator to generate a negative voltage re-

quired for operation. The oscillator frequency is fixed on the UIF module by the

resistance from pins 2 to 3 of X1, with the values of R6 and R16 shown, the fre-

quency is within 180 kHz to 370 kHz. The negative going pulses appear at pin 9

of X1 where they are smoothed by C1 to give a voltage which is nominally

equal but opposite to VL1.

For correct operation of the display, D.C. voltages between –VL1 and VL1 need

to be generated and fed back to the driver chip, at pins 4 to 8 inclusive (of X1).

The exact voltages depend on the relative values of the resistors R21, R37,

R38, R39, R40 and R33.

UIF MODULES DU8, DU9, GU3E

NHE–1/4 NHK–1/4 NHB–2

The display driver is connected to the radio module with a 4 bit data bus. Data

transfer is controlled with the following signals: R/W selects read or write opera-

tion (”0” = write, ”1” = read), Enable activates read/write operations and RS se-

lects the register (”0” : instruction register (writing) or busy flag (reading), ”1” :

data register).

SIM Interface

The SIM interface is the electrical interface between the smart card used in the

GSM and PCN applications and the MCU via the ASIC. Four signals are used

between the SIM card and the ASIC:SIMDATA, SIMCLK, SIMRESET and

VSIM. Serial data is transferred between the card and the ASIC, the clock fre-

quency is 3.25 MHz. When there is no data transfer between the SIM card and

the HP the clock can be reduced to 1.625 MHz. Some cards allow to stop the

clock in that mode. The ASIC also generates the reset for the card and the sup-

ply voltage VSIM.

06/97JR Technical Documentation

9–8

Power Distribution Diagram

VA1

VL1 VSIM

Vbatt

Call LED

GND

AGND

KEY/ LCD Lights

Buzzer

SIM card reader

LCD

Keyboard scan

Audio

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