System Module GR88–3
Introduction8–3
Technical Section8–3
WARNINGS8–3
External and Internal Connectors8–3
Internal Signals Between RF and ASIC8–7
Internal Signals Between RF and RFI8–8
Functional Description of Baseband Block8–9
Technical Specifications8–9
Names of Functional Blocks8–9
Clocking Sceme8–10
Reset and Power Control8–11
Watchdog System8–12
CTRLU8–13
PWRU8–19
DSPU8–21
AUDIO8–24
ASIC8–26
RFI8–31
Functional Description of RF block8–33
RF Frequency Plan8–33
Regulators8–33
Power Distribution8–34
Current Consumption8–34
Receiver8–35
Transmitter8–39
Synthesizer8–44
Block Diagram of Baseband8–48
Power Distribution Diagram of Baseband8–49
Block Diagram of RF8–50
Power Distribution Diagram of RF8–51
Connections between System and RF Blocks8–52
Connections between RF and TX Blocks8–53
Circuit Diagram of GR8; System Blocks8–54
Circuit Diagram of GR8; CPU & Memories8–55
Circuit Diagram of GR8; Power Supply IC & Batt. Charg. unit8–56
Circuit Diagram of GR8; DSP, Clock Generator & Memories8–57
Circuit Diagram of GR8; Audio Codec IC8–58
Circuit Diagram of GR8; ASIC IC8–59
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Copyright Nokia Mobile Phones
8–2
Circuit Diagram of GR8; RFI IC8–60
Circuit Diagram of GR8; RF Receiver and Regulator8–61
Circuit Diagram of GR8; RF Transmitter8–62
Layout Diagram of GR8 Side 1 Version 098–63
Layout Diagram of GR8 Side 2 Version 098–64
Parts List of GR8 EDMS Issue: 6.88–65
SYSTEM MODULE GR8
NHE–4
System Module GR8
Introduction
GR8 is the baseband/RF module NHE–4 cellular tranceiver. The GR8 module
carries out all the system and RF functions of the tranceiver. System module
GR8 is designed for a handportable phone, that operate in GSM system.
Technical Section
All functional blocks of the system module are mounted on a single multi layer
printed circuit board. The chassis of the radio unit has separating walls for
baseband and RF. All components of the baseband section are surface mountable. They are soldered using reflow. The connections to accessories are taken
through the bottom connector of the radio unit. The connections to the User Interface module (UIF) are fed through a flex connector. There is no physical connector between the RF and baseband sections.
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WARNINGS
The maximum battery voltage during the transmission should not exceed 8.0 V.
Higher battery voltages may destroy the power amplifier. This will be quaranteed by hardware based limiting which has maximum value 7.6
External and Internal Connectors
The system module has two connector, external bottom connector and internal
UIF module connector.
4
Battery connector
3
2
Antenna
connector
2
1
1
4
X100
Charging connector
3
2
1
±
0.3 V.
16
System connector
9
81
30
X196
UIF module connector
1
D0000323
SYSTEM MODULE GR8
NHE–4
Bottom Connector X100
System Connector
Pin:Name:Description:
1, 9GNDDigital ground
2MIC/JCONNExternal audio input from accessories or
3AGNDAnalog ground for accessories. Connected
4TDATransmitted DBUS data to the accessories.
5M2BUSSerial bidirectional data and control between
6HOOK/RXD2HOOK indication. The phone has a 100 kΩ
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handsfree microphone. Multiplexed with
junction box connection control signal.
16.8 kΩ pull down in phone.
directly to digital ground on the PCB.
the handportable and accessories.
pull–up resistor. Data to flash from flash
programmer.
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7PHFS/TXD2Handsfree device power on/off. Data to flash
programming device.
8, 16VCHARBattery charging voltage.
10EAR/HFPWRExternal audio output to accessories or
handsfree speaker. 100 kΩ pull–down resistor
in phone to turn on the junction box.
11DSYNCDBUS data bit sync clock.
12RDADBUS received data from the accessories.
13NCNot used.
14VFProgramming voltage for flash.
15DCLKDBUS data clock.
SYSTEM MODULE GR8
NHE–4
Battery Connector
Pin:Name:Description:
1GNDGround
2TBATBattery temperature
3BTYPEBattery type
4VBATTBattery voltage
Charging Connector
Pin:Name:Description:
1VCHARBattery charging voltage
2GNDGround
3VCHARBattery charging voltage
4GNDGround
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Antenna Connector
Pin:Name:Description:
1RF EXTExternal antenna signal
2GNDGround
SYSTEM MODULE GR8
NHE–4
UIF Module Connector X196
Pin:Name:Description:
1VL1Logic supply voltage 4.65 V
2GNDGround
3, 30VBATTBattery voltage
4BACKLIGHTBacklights on/off
5 – 8UIF(0;3)Lines for keyboard read and LCD controller
9UIF4Line for keyboard read and LCD controller
13 – 16COL(0;3)Lines for keyboard write
17CALL LEDCall LED enable
18MICPMicrophone (positive node)
19MICNMicrophone (negative node)
20EARPEarpiece (negative node)
21EARNEarpiece (positive node)
22BUZZERPWM signal buzzer control
23XPWRONPower key (active low)
24VA1Analog supply voltage 4.65 V
25SIMCLKClock for SIM data
26SIMRESETReset for SIM
27VSIMSIM voltage supply voltage
28SIMDATASerial data for SIM
29AGNDAnalog ground
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Internal Signals Between RF and ASIC
Symbol:Description:Values:
SCLKSynthesizer clock
• load impedance:
• frequency:
SDATASynthesizer data
• load impedance:
• data rate frequency:
SENA1Synthesizer enable
• PLL contr. disabled:
• PLL activated:
• current:
RXPWRRX supply voltage on/off
• RX supply voltage on:
• RX supply voltage off:
• current:
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10 k
Ω
3.25 MHz
10 k
Ω
3.25 MHz
4.5...4.65...4.8 V
0...0.2...0.7 V
50 µA
4.5...4.65...4.8 V
0...0.2...0.7 V
0.5 mA
SYNTHPWRSupply voltage on/off
• RF regulators on:
• RF regulators off:
• current:
TXPWRTX supply voltage on/off
• TX supply voltage on:
• TX supply voltage off:
• current:
TXPTX enable
• transmitter power enable:
• transmitter power disable:
CLKIN26 MHz clock to ASIC
4.5...4.65...4.8 V
0...0.2...0.7 V
1.0 mA
4.5...4.65...4.8 V
0...0.2...0.7 V
0.5 mA
4.5...4.65...4.8 V
0...0.2...0.7 V
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Internal Signals Between RF and RFI
Symbol:Description:Values:
AFCAutomatic frequency control voltage
• voltage min/max:
• resolution:
• load impedance (dynamic):
TXCTX transmit power control voltage
• voltage range min/max:
• impedance:
TXQP,TXQNDifferential TX quadrature signal
• differential voltage swing:
• D.C. level:
• load impedance:
TXIP,TXINDifferential TX inphase signal
• differential voltage swing:
• D.C. level:
• load impedance:
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0.35...4.35 V
11 bits
10 k
Ω
0.3...4.2 V
10 k
Ω
1.15...1.2...1.25 V
PP
2.30...2.35...2.40 V
30 k
Ω
1.15...1.2...1.25 V
PP
2.30...2.35...2.40 V
30 k
Ω
PDATA0Front end AGC control
• reduced front end gain:
• normal front end gain:
• current:
RXQRX quadrature signal
• output level:
• source impedance:
RXIRX inphase signal
• output level:
• source impedance:470 Ω
0...0.2...0.7 V
4.5...4.65...4.8 V
0.1 mA
25 mV
470
25 mV
PP
Ω
PP
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Functional Description of Baseband Block
The purpose of the baseband module is to control the phone and process audio
signals to and from RF. The module also controls the user interface.
Technical Specifications
There are three different operation modes:
– active mode
– idle mode
– power off mode
In the active state all circuits are powered and part of the module may be in idle
mode.
The module is usually in the idle mode when there is no call and the phone is in
SERV. In the idle mode circuits are reset, powered down and clocks are
stopped or the frequency reduced. All the clocks except the main clock from
VCTCXO can be stopped in that mode. Whether the SIM clock is stopped or
not depends on the network.
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In power off mode only the circuits needed for power up are powered. This
means that only power up block inside the PSL+ is powered. The power key on
the flex is pulled up with a pull up resistor inside the PSL+.
Names of Functional Blocks
Name:Function:
CTRLUControl unit for phone
PWRUPower supply
DSPUDigital signal processing block
AUDIOAudio coding
ASICD2CA GSM/PCN system ASIC; several functions
RFIRF baseband interface
SYSTEM MODULE GR8
NHE–4
Clocking Scheme
DSP Clock
60.2 MHz
differential sine
wave
OSCILLATOR
ear
mouth
AUDIO
CODEC
DSP
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RFI Clock 13 MHz
Sleep Mode: 135.4kHz
enable
RFI
ASIC
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RF System Clock
26 MHz
VCTCXO
SIMCLKSIMCLK
3.25 / 1.625
MHz
Codec Sync Clock
8 kHz
DBUSCLK 512kHz
DBUSSYNC 8kHz
Most of the clocks are generated from the 26 MHz VCTCXO frequency by the
ASIC:
– 26 MHz clock for the MCU. MCU‘s internal clock frequency is half of
– 13 MHz for the RFI. The ASIC also generates 135.4 kHz sleep mode clock
– 3.25 MHz clock for SIM. When there is no data transfer between the SIM
– 512 kHz main clock for the codec and for the data transfer between the DSP
MCU Clock
Codec Main Clock and
data Transfer clock
512kHz
26 MHz
MCU
that (13 MHz).
for the RFI.
card and the HP the clock can be reduced to 1.625 MHz. Some SIM cards
also allows the clock to be stopped in that mode.
and the codec.
– 8 kHz synchronization clock for data transfer between the DSP and the co-
dec.
– 512 kHz clock and 8 kHz sync. clock for the DBUS data transfer.
SYSTEM MODULE GR8
NHE–4
The DSP has its own crystal oscillator which can be turned off and on by the
ASIC. The DSP uses differential sinusoidal clock. The frequency is 60.2 MHz.
The system ASIC generates 8 kHz clock to the codec for the control data transfer.
In the idle mode all the clocks can be stopped except 26 MHz main clock coming from the VCTCXO.
Reset and Power Control
reset in
DSP
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RFI
Reset Out
Reset Out
ASIC
Vcc
Reset in
resetreg
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SIMReset
PSL+
VL1
XRESreset in
XPWRON
XPwrOff
approx 2Hz
There are three different ways to switch power on:
– Power key pressing grounds the XPWRON line. The PSL+ detects that and
switches the power on.
– Charger detection on PSL+ detects that charger is connected and switches
power on.
– PSL+ will switch power on when the battery is connected. After that the
MCU will detect if power key is pressed or charger connected. If not the
power will be switched off.
All devices are powered up at the same time by the PSL+. It supplies the reset
to the ASIC at power up. The ASIC starts the clocks to the DSP and the MCU.
After 100 ms PSL+ releases the reset to ASIC.
XPWRON
MCU
SYSTEM MODULE GR8
NHE–4
ASIC releases MCU and RFI reset after 256 13 MHz clock cycles. DSP reset
release time from DSP clock activation can be selected from 0 to 255 13MHz
clock cycles. In our case it is 255. SIM reset release time is according to GSM
SIM specifications.
To turn power off the user presses the PWR key. The MCU detects this. The
MCU cuts off any ongoing call, exits all tasks, acts inoperative to the user and
leaves the PSL+ watchdog without resets. After power–down delay, the PSL+
cuts off the supply from all circuitry.
If charging is on the phone stays on but it looks to the user like it is powered off
(lights are off and the display is blank) except the charging indicator stays on.
Watchdog System
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reset
DSP
1
ASIC
4
5
2
POWER
PSL
XPWROFF
3
reset
MCU
Normal operation:
1. MCU tests DSP
2. MCU updates ASIC watchdog timer (> 2 Hz)
3. MCU pulses the XPWROFF input on the PSL+ (about 2 Hz)
Failed operation:
4. ASIC resets MCU and DSP after about 0.5 s failure
5. PSL+ switches power off about 1.5 s after the previous XPWROFF pulse
SYSTEM MODULE GR8
NHE–4
CTRLU
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8–13
The Control block contains a microcontroller unit (MCU) and three memory circuits (FLASH, SRAM, EEPROM), a 20 bit address bus, an 8 bit data bus and
memory circuit control signals.
Main Features of the CTRLU block:
MCU functions:
– system control
– communication control
– user interface
– authentication
– RF monitoring
– power up/down control
– accessory monitoring
– battery monitoring and charging control
– self–test and production testing
– flash loading
Main Components of CTRLU
– Hitachi H8/536
H8/536 is a CMOS microcontroller unit (MCU) comprising a CPU
core and on–chip supporting modules with 16–bit architecture. The
data bus to outside world has 8 bits.
– 1024k*8bit FLASH memory
– 150 ns. maximum read access time with 1 wait state
– contains the main program code for the MCU; part of the DSP
program code also located on FLASH
– ASIC can address two 4 Mbit memories or one 8 Mbit memory.
– 32 k x 8 bit SRAM memory
– 100 ns. maximum read access time
– 8 k x 8 bit EEPROM memory
– 250 ns. maximum read access time with 1 wait state
– contains user defined information.
– there is a register bit on the ASIC which must be set before the
write operation to the EEPROM.
SYSTEM MODULE GR8
NHE–4
Input Signals of CTRLU
Name(from):Description:
VL1(PWRU)Power supply voltage for CTRLU block
VREF(PWRU)Reference voltage for MCU A/D converter
VBATDET(PWRU)Battery voltage detection
VC(PWRU)Charger voltage monitoring
ROMAD18(ASIC)ROM address (paging)
EROMSELX(ASIC)Chip select for the EEPROM memory
ROMSELX(ASIC)Chip select for the FLASH memory
ROM2SELX(ASIC)Chip select for the second FLASH memory
RAMSELX(ASIC)Chip select for the SRAM memory
RESETX(ASIC)Reset signal for MCU
NMI(ASIC)Non–maskable interrupt request
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MCUCLK(ASIC)Main clock for MCU
IRQX(ASIC)Interrupt request
PCMCDO(AUDIO)Audio codec control data receiving
TRF(RF)RF module temperature detection
VF(syst.conn.)Programming voltage for FLASH memory
RXD2_HOOKThe use of handsfree monitoring
(syst.conn.)FLASH programming data input on the production line
TBAT(batt.conn.)Battery temperature detection. Vibra cont. for vibrabattery.
BTYPE(batt.conn.)Battery size identification
MIC_JCONNJunction box connection identification
(sys.conn.)
Output Signals of CTRLU
Name(to):Description:
XPWROFF(PWRU) Power off control, PSL+ watchdog reset
PWM(PWRU)Charger on/off control
VOLTLIM(PWRU)Voltage limiting; affects to HW voltage limit level
WSTROBEX(ASIC) MCU write strobe
RSTROBEX(ASIC)MCU read strobe
MCUAD(19:0)(ASIC)20 bit MCU address bus
MBUSDET(ASIC)MBUS activity detection
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BATDET(ASIC)Battery type and SIM card presence detection
PCMCLK(AUDIO)Clock for audio codec control data transfer
PCMCDI(AUDIO)Audio codec control data transmitting
XSELPCMC(AUDIO)Chip select for audio codec
TXD2_PHFSPower on/off control for HF device, verification output
(syst.connector)of the programmed data of FLASH during programming
CALL_LED(UIF)’Incoming’ call indicator light control
BACKLIGHT(UIF)LCD and display backlight on/off control
BUZZER(UIF)Buzzer signal
Bidirectional Signals of CTRLU
Name(to/from):Description:
MCUDA(7;0)(ASIC) MCU’s 8 bit data bus
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M2BUS(sys. conn)Asynchronous serial data bus
Block Description of CTRLU
– MCU – memories
The MCU has a 20 bits wide address bus A(19:0) and an 8 bit data
bus with memories. The address bits A(19:16) are used for chip select decoding. The decoding is done in the D2CA ASIC. The ASIC
can address two 4 Mbit (or smaller) or one 8 Mbit flash memories.
Hitachi HD647536 processor has internal ROM and RAM memories.
One wait state is used with external memory access.
On the Hitachi HD647536 internal memory map there is the following:
• 00000 – 001FFVector tables
• 00200 – 0F67F62 k bytes internal ROM
• 0F680 – 0FE7F2 k bytes internal RAM
• 0FE80 – 0FFFF384 bytes register field
• 10000 – 1FFFF32 k * 8 bytes RAM
• 20000 – 2FFFF8 k * 8 bytes EEPROM
• 30000 – 3FFFF26 * 8 bytes ASIC
• 40000 – 7FFFF2 Mbit Flash, paged by ASIC page bit to 4 Mbit
In flash programming a special flash programming box and a PC is
needed. Loading is done through the bottom connector of HP; multiplexed with HOOK and PHFS line. First MCU goes to minimum
mode (MBUS command from PC or if MBUS is connected to
MIC_JCONN line in power up). Then the flash software is loaded
from PC to flash loading box. When the loading is complete flash
loading to HP can be started by MBUS command from PC to the
MCU. After that the MCU asks the test box to start flash loading to
HP. The box supplies 12 V programming voltage for flash and starts
to send 250 bytes data blocks to the MCU via HOOK line. The baud
rate is 406 kbit/s. The MCU calculates the check sum, sends acknowledge via PHFS line and sends the data to flash. When all the
data is loaded the HP makes reset and tells the flash loading box if
the loading was succeeded or not. Only PSL+, ASIC and MCU must
be active during the loading.
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– CTRLU – PWRU
MCU controls the watchdog timer in PSL+. It sends a positive pulse
at approximately 2 Hz to XPWROFF pin of the PSL+ to keep the
power on. If MCU fails to deliver this pulse, the PSL+ will remove
power from the system. MCU also controls the charger on/off switching in the PWRU block. When power off is requested or MCU leaves
PSL+ watchdog without reset. After the watchdog time has elapsed
PSL+ cuts off the supply voltages from the phone.
SYSTEM MODULE GR8
NHE–4
– CTRLU – ASIC
MCU and ASIC have a common 8–bit data bus and a 9–bit address
bus. Bits A(4:0) are used for normal addressing whereas bits
A(19:16) are decoded in ASIC to chip select inputs for CTRLU memories. ASIC controls the main clock, main reset and interrupts to
MCU. The internal clock of MCU is half the MCUCLK clock speed.
RESETX resets everything in MCU except the contents of the RAM.
IRQX is a general purpose interrupt request line from ASIC. After
IRQX request the interrupt register of the ASIC is read to find out the
reason for interrupt. NMI interrupt is used only to wake up MCU from
software standby mode.
– CTRLU – DSPU
MCU and DSP communicate through ASIC. ASIC has an MCU mailbox and a DSP mailbox. MCU writes data to DSP mailbox where
DSP can only read the incoming data. In MCU mailbox the data
transfer direction is the opposite. When power is switched on the
MCU loads data from the flash memory to DSP‘s external memory
through this mailbox.
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– CTRLU – AUDIO
When the the chip select signal XSELPCMC goes low, MCU writes
or reads control data to or from the speech codec registers at the
rate defined by PCMCLK. PCMCDI is an output data line from MCU
to codec and PCMCDO is an input data line from codec to MCU.
– CTRLU – RF/BATTERY monitoring
MCU has internal 8 channel 10 bit AD converter. Following signals
are used to monitor battery, charging and RF:
– BTYPEbattery size
– TBATbattery temperature (used also for
vibrabattery control)
– VBATDETbattery voltage
– VCcharging voltage
– TRFRF temperature
– CTRLU – keyboard and LCD driver interface
MCU and user interface communication is controlled through ASIC.
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– CTRLU – ACCESSORIES
M2BUS is used to control external accessories. This interface can
also be used for factory testing and maintenance purposes.
There are also some control and indication signals for the accessories:
– PHFS is used to turn power on to HF accessories.
– JCONN is used to indicate that junction box is connected. Phone
can also enter minimum mode when M2BUS is connected to
MIC_JCONN line.
– HOOK is used to indicate accessories hook state.
– TBAT is used to control vibrabattery. (Used also for monitoring
battery temperature.)
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SYSTEM MODULE GR8
NHE–4
PWRU
The power block creates the supply voltages for the baseband block and contains the charging electronics.
Main Components of PWRU
– PSL+ ASIC
Generates voltages, contains power on switch, charger and battery
voltage detector and watchdog.
– Transistor BCP69–25 and schottky STPS340U
The charging current is passed through these components.
– Transistor BCX51 and BCP69–25
VL regulators of PSL+ external output transistors.
Input Signals of PWRU
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Name(from):Description:
XPWRON(UIF)PWR on switch
XPWROFF(CTRLU) Power off control
VOLTLIM(CTRLU)Voltage limiting; affects HW voltage limit level
VBATT(syst.conn.)Battery voltage
PWM(CTRLU)Charger on/off control
VCHAR(syst.conn.) Charging voltage
Output Signals of PWRU
Name(from):Description:
XRES(ASIC)Master reset
CHRDET(ASIC)Battery charger detection
VL1(CTRLU,ASIC,Logic supply voltage, max 150 mA
RFI,UIF)
VL2(DSPU)Logic supply voltage, max 150 mA
VA1(AUDIO,UIF)Analog supply voltage, max 40 mA
VA2(RFI)Analog supply voltage, max 80 mA
VREF(CTRLU,RF)Reference voltage 4.65 V ±2 %, max 5 mA
VBATDET(CTRLU)Switched VBATT divided by 2
VC(CTRLU)Attenuated VCHAR
SYSTEM MODULE GR8
NHE–4
Block Description of PWRU
The PSL+ IC produces the following supply voltages:
Name:Description:
VL1, VL2150 mA for logic
VA140 mA for audios
VA280 mA for RFI
VREF5 mA reference
In addition, it has internal watchdog, voltage detection and charger detection
functions. The watchdog will cut off output voltages if it is not reset once in every 1.5 (±0.75) second. The voltage detector resets the phone if the battery
voltage falls below 4.8 V (±0.2 V). The charger detection starts the phone if it is
in power–off state when the charging voltage is applied.
The charging electronics is controlled by the MCU. When the charging voltage
is applied to the phone and the phone is powered up, the MCU detects it and
starts controlling charging. If MCU detects too high charging voltage (over 14
volts) or current (over 78 A/D bit difference between VC and VBATDET) it will
cut off the charging. The phone will accept charging voltages from 5 to 14 volts.
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If the phone is in power–off state, the PSL+ will detect the charging voltage and
turn on the phone. If the battery voltage is high enough the reset will be released and the MCU will start controlling charging. If the battery voltage is too
low the phone stays in reset state and the charging control circuitry will pass
charging current to the battery. When the battery voltage has reached 5.25 V
(± 0.2 V) the reset will be removed and the MCU starts controlling charging.
MCU controls the charging with pulse width modulation output. Charging voltage is limited by hardware in normal operation to 8.9 V and during a call to
7.6 V.
Battery and charging voltages are calibrated in production; 6V is fed to the bat-
tery and charger pin and the MCU‘s A/D converter values are stored to EEPROM.
SYSTEM MODULE GR8
NHE–4
DSPU
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Main interfaces of the DSP:
– MCU via ASIC mailbox
– ASIC
– audio codec
– data bus interface (DBUS) for accessories
– digital audio interface (DAI) for type approval measurements
Main features of the DSP block:
– speech processing
– speech coding/decoding
– RPE–LTP–LPC (regular pulse excitation long term
prediction linear predictive coding)
– voice activity detection (VAD) for discontinuous transmission
(DTX)
8–21
– comfort noise generation during silence
– acoustic echo cancellation
– channel coding and transmission
– block coding (with ASIC)
– convolutional coding
– interleaving
– ciphering (with ASIC)
– burst building and writing it to ASIC
– Reception
– reading the A/D conversion results from ASIC
– impulse response calculation
– matched filtering
– bit detection (with Viterbi on ASIC)
– deinterleaving of soft decisions
– convolutional decoding (with Viterbi)
– block decoding (with ASIC)
– functions for RF measurements
– debugging functions for product development
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8–22
– synthesizer control
– power ramp programming
– automatic gain control (AGC)
– automatic frequency control (AFC)
– control the operations during a TDMA frame (with ASIC)
– controlling the multiframe structure
– channel configuration control
Main Components of DSPU
– AT&T DSP 1616–S11
– Digital signal processor with 12 kword internal ROM
– Two 32 k * 8 70 ns SRAMs for DSP external memory
– 60.2 MHz crystal osc. to generate differential small signal clock for the DSP
Input Signals of DSPU
Name(from):Description:
VL2(PWRU)Logic supply voltage, max 150 mA
DSPCLKEN(ASIC)Clock enable for DSP clock oscillator circuit
DSP1RSTX(ASIC)Reset for the DSP
PCMDATRCLKXPCM data input clock
(ASIC)DBUS data output clock
CODEC_CLKPCM data output clock
PCMOUT(AUDIO)Received audio in PCM format
DBUSCLKDBUS data output clock
DBUSSYNCDBUS data bit sync clock
RDADBUS received data
INT0, INT1(ASIC)Interrupts for the DSP
PCMCOSYCLKXPCM data bit sync clock
(ASIC)
SYSTEM MODULE GR8
NHE–4
Output Signals of DSPU
Name(to):Description:
PCMIN(AUDIO)Transmitted audio in PCM format
IOX(ASIC)I/O enable, indicates access to DSP address space
RWX(ASIC)Read/write X
DSPAD(16;9)(ASIC) Address bus and control signals
DBUSDET(ASIC)DBUS activity detection
Bidirectional Signals of DSPU
Name(from/to):Description:
DSPDA(15;0)(ASIC) 16 bit data bus
Block Description of DSPU
01/98OJ
Technical Documentation
8–23
Copyright Nokia Mobile Phones
The Control unit communicates with the DSP circuitry through a mailbox in the
D2CA ASIC. The software for the external memories are loaded through this
mailbox in start up.
The DSP includes two serial busses. One is used for speech data transfer between the DSP and the codec. The other is used as an external data bus and it
is connected to the bottom connector. This bus can be used by data accessories and also as a digital audio interface (DAI) in audio type approval measurements. The clocks (512 kHz main clock and 8 kHz sync. clock) are generated
by the ASIC.
In transmit mode the DSP codes the speech and routes the resulting transmit
slots to the D2CA. The D2CA ASIC controls timing, and at specified intervals
sends these bits to the RFI for DA conversion.
In digital receive mode the RFI AD converts the IF signal from the RF unit under the control of the D2CA. The DSP controls the D2CA and receives the converted bits. After channel and speech decoding, bits are converted into an analog signal in the PCM codec, routed and fed to the earpiece.
The DSP controls the RF through the D2CA ASIC, where all necessary timing
functions are implemented, and control I/O lines are provided e.g. for synte
loading.
The DSP emulator can be connected to DSP pins TCK, TMS, TDO, TDI, GND
and VDD.
SYSTEM MODULE GR8
NHE–4
AUDIO
The AUDIO block consists of an audio codec with some peripheral components. The codec contains microphone and earpiece amplifier and all the necessary switches for routing. The codec is controlled by the MCU. The PCM data
comes from and goes to the DSP.
Main Components of AUDIO
– Audio codec ST5080
Includes e.g. PCM codec, audio routing switches, microphone and
earpiece amplifiers for 2 connections (internal and external devices)
and DTMF generator.
Input Signals of AUDIO
Name(from):Description:
01/98OJ
Technical Documentation
8–24
Copyright Nokia Mobile Phones
VA1(PWRU)Analog supply voltage, max 40 mA
PCMIN(DSPU)Received audio in PCM format
SYNC(ASIC)8 kHz frame sync
CODEC_CLK(ASIC) 512 kHz codec main clock
PCMCDI(CTRLU)Audio codec control data
PCMCLK(CTRLU)Clock for audio codec control data transfer
XSELPCMCAudio codec chip select
(CTRLU)
MIC_JCONNExternal microphone
(syst.conn.)
MICN,MICP(UIF)Differential microphone signal
Output Signals of AUDIO
Name(to):Description:
PCMOUT(DSPU)Transmitted audio in PCM format
PCMCDO(CTRLU)Audio codec control data
MIC_ENA(UIF)Microphone enable
EAR_HFPWRExternal received audio
(syst.conn.)
EARN,EARP(UIF)Internal received audio
JCONN(CTRLU)Junction box connected signal (multiplexed with HFMIC)
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