MXIC MX23L3210YC-12, MX23L3210MC-12, MX23L3210RC-12, MX23L3210TC-10, MX23L3210TC-15 Datasheet
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MX23L3210
32M-BIT (4M x 8 / 2M x 16) Mask ROM
FEATURES
• Bit organization
- 4M x 8 (byte mode)
- 2M x 16 (word mode)
• Fast access time
- Random access:100ns (max.) for 3.0V~3.6V
150ns (max.) for 2.7V~3.6V
• Current
- Operating:40mA
- Standby:15uA
• Supply voltage
- 2.7V~3.6V
• Package
- 44 pin SOP (500mil)
- 48 pin TSOP (12mm x 20mm)
- 44 pin TSOP (Type II)
PIN CONFIGURATION
ORDER INFORMATION
Part No. Access Time Pac ka ge
MX23L3210MC-10 100ns 44 pin SOP
MX23L3210MC-12 120ns 44 pin SOP
MX23L3210MC-15 150ns 44 pin SOP
MX23L3210TC-10 100ns 48 pin TSOP
MX23L3210TC-12 120ns 48 pin TSOP
MX23L3210TC-15 150ns 48 pin TSOP
MX23L3210RC-10 100ns 48 pin TSOP
(Reverse type)
MX23L3210RC-12 120ns 48 pin TSOP
(Reverse type)
MX23L3210RC-15 150ns 48 pin TSOP
(Reverse type)
MX23L3210YC-10 100ns 44 pin TSOP
MX23L3210YC-12 120ns 44 pin TSOP
PIN DESCRIPTION
44 SOP/ 44 TSOP
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
VSS
OE
D0
D8
D1
D9
D2
D10
D3
D11
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
A20
43
A19
42
A8
41
A9
40
A10
39
A11
38
A12
37
A13
36
A14
35
A15
34
A16
33
BYTE
32
MX23L3210
VSS
31
D15/A-1
30
D7
29
D14
28
D6
27
D13
26
D5
25
D12
24
D4
23
VCC
Symbol Pin Function
A0~A20 Address Inputs
D0~D14 Data Outputs
D15/A-1 D15 (Word Mode)/ LSB Address
(Byte Mode)
CE Chip Enable Input
OE Output Enab le Input
Byte Word/ Byte Mode Selection
VCC Po wer Supply Pin
VSS Ground Pin
NC No Connection
MODE SELECTION
CE OE Byte D15/A-1 D0~D7 D8~D15 Mode Power
H X X X High Z High Z - Stand-by
L H X X High Z High Z - Active
L L H Output D0~D7 D8~D15 Word Active
L L L Input D0~D7 High Z Byte Active
P/N:PM0370 REV. 2.8, JUL. 17, 2001
1
48 TSOP (Normal Type)
MX23L3210
BYTE
A16
A15
A14
A13
A12
A11
A10
A9
A8
A19
VSS
A20
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE
48 TSOP (Reverse T ype)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
MX23L3210
(Normal T ype)
48
VSS
47
VSS
46
D15/A-1
45
D7
44
D14
43
D6
42
D13
41
D5
40
D12
39
D4
38
VCC
37
VCC
36
NC
35
D11
34
D3
33
D10
32
D2
31
D9
30
D1
29
D8
28
D0
27
OE
26
VSS
25
VSS
VSS
VSS
D15/A-1
D7
D14
D6
D13
D5
D12
D4
VCC
VCC
NC
D11
D3
D10
D2
D9
D1
D8
D0
OE
VSS
VSS
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
MX23L3210
(Reverse Tp ye)
1
BYTE
2
A16
3
A15
4
A14
5
A13
6
A12
7
A11
8
A10
9
A9
10
A8
11
A19
12
VSS
13
A20
14
A18
15
A17
16
A7
17
A6
18
A5
19
A4
20
A3
21
A2
22
A1
23
A0
24
CE
P/N:PM0370
REV. 2.8, JUL. 17, 2001
2
BLOCK DIAGRAM
MX23L3210
A0/(A-1)
A20
CE
BYTE
OE
Address
Buffer
Memory
Array
Sense
Amplifier
Word/
Byte
ABSOLUTE MAXIMUM RATINGS
Item Symbol Ratings
V oltage on any Pin Relativ e to VSS VIN -0.3V to 3.9V
Ambient Operating Temperature T opr 0°C to 70°C
Storage T emperature Tstg -65°C to 125°C
Output
Buffer
D0
D15/(D7)
DC CHARACTERISTICS (Ta = 0°C ~ 70°C, VCC = 2.7V~3.6V)
Item Symbol MIN. MAX. Conditions
Output High Voltage VOH 2.3V - IOH = -0.4mA
Output Low Voltage VOL - 0.4V IOL = 1.6mA
Input High Voltage VIH 2.1V VCC+0.3V
Input Low Voltage VIL -0.3V 0.2xVCC
Input Leakage Current ILI - 5uA 0V, VCC
Output Leakage Current ILO - 5uA 0V, VCC
Operating Current ICC1 - 40mA tRC = 120ns, all output open
Standby Current (TTL) ISTB1 - 1mA CE = VIH
Standby Current (CMOS) ISTB2 - 15uA CE>VCC-0.2V
Input Capacitance CIN - 10pF Ta = 25°C, f = 1MHZ
Output Capacitance COUT - 10pF Ta = 25°C, f = 1MHZ
P/N:PM0370
3
REV. 2.8, JUL. 17, 2001
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