MCC S6A, S6D, S6G, S6J, S6K Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

! "# $% ! "#

Features

•For Surface Mount Applications

•Extremely Low Thermal Resistance

•Easy Pick And Place

• High Temp Soldering: 250° C for 10 Seconds At Terminals

•High Current Capability

Maximum Ratings

•Operating Temperature: -55° C to +150° C

•Storage Temperature: -55° C to +150° C

MCC		Maximum	Maximum	Maximum
Part	Device	Recurrent	RMS	DC
Number	Marking	Peak Reverse	Voltage	Blocking
		Voltage		Voltage
S6A	S6A	50V	35V	50V
S6B	S6B	100V	70V	100V
S6D	S6D	200V	140V	200V
S6G	S6G	400V	280V	400V
S6J	S6J	600V	420V	600V
S6K	S6K	800V	560V	800V
S6M	S6M	1000V	700V	1000V

Electrical Characteristics @ 25° C Unless Otherwise Specified

Average Forward	IF(AV)	6.0A	TJ = 75° C
Current
Peak Forward Surge	IFSM	200A	8.3ms, half sine
Current
Maximum		1.20V	IFM = 6.0A;
Instantaneous	VF
Forward Voltage			TJ = 25° C*
Maximum DC		10 A	TJ = 25° C
Reverse Current At	IR
Rated DC Blocking		100 A	TJ = 100° C
Voltage
Typical Junction	CJ	150pF	Measured at
Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 200 sec, Duty cycle 2%

S6A

THRU

S6M

6 Amp

Silicon Rectifier 50 to 1000 Volts

DO-214AB

(SMCJ) (Round Lead)

H

Cathode Band

J

	A	C
	E
F	D	B
G
	DIMENSIONS

DIM	INCHES		MM		NOTE
	MIN	MAX	MIN	MAX
A	.200	.214	5.08	5.43
B	.177	.203	4.70	5.30
C	.002	.005	.05	.13
D	---	.02	---	.51
E	.053	.067	1.35	1.70
F	.168	.179	4.27	4.55
G	.320	.330	8.13	8.38
H	.239	.243	6.08	6.18
J	.234	.240	5.95	6.10

SUGGESTED SOLDER

PAD LAYOUT

0.190

0.200”

0.070”

www.mccsemi.com