MCC S3B, S3A, S3D, S3J, S3K Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

•For Surface Mount Applications

•Extremely Low Thermal Resistance

•Easy Pick And Place

•High Temp Soldering: 250°C for 10 Seconds At Terminals\

•High Current Capability

Maximum Ratings

•Operating Temperature: -55°C to +150°C

•Storage Temperature: -55°C to +150°C

•Maximum Thermal Resistance; 10°C/W Junction To Lead

MCC		Maximum	Maximum	Maximum
Part	Device	Recurrent	RMS	DC
Number	Marking	Peak Reverse	Voltage	Blocking
		Voltage		Voltage
S3A	S3A	50V	35V	50V
S3B	S3B	100V	70V	100V
S3D	S3D	200V	140V	200V
S3G	S3G	400V	280V	400V
S3J	S3J	600V	420V	600V
S3K	S3K	800V	560V	800V
S3M	S3M	1000V	700V	1000V

Electrical Characteristics @ 25°C Unless Otherwise Specified

Average Forward	IF(AV)	3.0A	TJ = 120°C
Current
Peak Forward Surge	IFSM	100A	8.3ms, half sine
Current
Maximum
Instantaneous	VF	1.20V	IFM = 3.0A;
Forward Voltage			TJ = 25°C*
Maximum DC		10 A	TJ = 25°C
Reverse Current At	IR
Rated DC Blocking		250 A	TJ = 125°C
Voltage
Typical Junction	CJ	60pF	Measured at
Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 200 sec, Duty cycle 2%

S3A

THRU

S3M

3 Amp

Silicon Rectifier 50 to 1000 Volts

DO-214AB (SMCJ)

H

J

		A	C
	E	D	B
F
G
		DIMENSIONS

	INCHES		MM
DIM	MIN	MAX	MIN	MAX	NOTE
A	.079	.103	2.00	2.62
B	.108	.128	2.75	3.25
C	.002	.008	.051	.203
D
E	.030	.050	.76	1.27
F
G	.305	.320	7.75	8.13
H	.260	.280	6.60	7.11
J	.220	.245	5.59	6.22

SUGGESTED SOLDER

PAD LAYOUT

0.190

0.125”

0.070”

www.mccsemi.com

Version: 3

2002/12/27