MCC S1Q, S1Y, S1Z, S1ZZ, S1V Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙For Surface Mount Applications

∙Extremely Low Thermal Resistance

∙High Temp Soldering: 250°C for 10 Seconds At Terminals

∙Easy Pick And Place

∙Gull Wing Lead Bend To Prevent Arcing

∙Perfect For Ballast, Television And Monitor Applications

S1Q

THRU

S1ZZ

1 Amp

Silicon Rectifier 1200 to 2000 Volts

Maximum Ratings

∙Operating Temperature: -55°C to +150°C

∙Storage Temperature: -55°C to +150°C

∙Maximum Thermal Resistance; 15°C/W Junction To Lead

MCC		Maximum	Maximum	Maximum
Part	Device	Recurrent	RMS	DC
Number	Marking	Peak Reverse	Voltage	Blocking
		Voltage		Voltage
S1Q	S1Q	1200V	840V	1200V
S1V	S1V	1400V	980V	1400V
S1Y	S1Y	1600V	1120V	1600V
S1Z	S1Z	1800V	1260V	1800V
S1ZZ	S1ZZ	2000V	1400V	2000V

lectrical Characteristics @ 25°C Unless Otherwise Specified

Average Forward	IF(AV)	1.0A	TJ = 75°C
Current
Peak Forward Surge	IFSM	30A	8.3ms, half sine
Current
Maximum
Instantaneous
Forward Voltage	VF	1.10V	IFM = 1.0A;
			TJ = 25°C*
Maximum DC	IR	10.0μA	TJ = 25°C
Reverse Current At
Rated DC Blocking		30μA	TJ = 125°C
Voltage
Maximum Reverse
Recovery Time	Trr	1.8us	IF=0.5A, IR=1.0A,
			Irr=0.25A
Typical Junction	CJ	15pF	Measured at
Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 300 μsec, Duty cycle 2%

DO-214AA

(SMBJ) (Round Lead)

H

Cathode Band

J

																		A											C
											E								D						B
					F
					G
															DIMENSIONS
					INCHES														MM
	DIM					MIN						MAX						MIN					MAX			NOTE
	A			.078							.116						1.98				2.95
	B			.075							.089						1.90				2.25
	C			.002							.008						.05				.20
	D			-----							.02						-----				.51
	E			.035							.055						.90				1.40
	F			.065							.091						1.65				2.32
	G			.205							.224						5.21				5.69
	H			.160							.180						4.06				4.57
	J			.130							.155						3.30				3.94

SUGGESTED SOLDER

PAD LAYOUT

0.090"

0.085”

0.070”

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