MCC SMBJ5913, SMBJ5927, SMBJ5914, SMBJ5915, SMBJ5918 Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙Surface Mount Applications

∙3.3 thru 200 Volt Voltage Range

∙Ideal For High Density, Low Profile Mounting

∙Withstands Large Surge Stresses

∙Available on Tape and Reel

Mechanical Data

∙CASE: JEDEC DO-214AA molded Surface Mountable

∙Terminals solderable per MIL-STD-750, Method 2026

∙Polarity is indicated by cathode band

∙Packaging: Standard 12mm Tape (see EIA 481)

∙Maximum temperature for soldering: 260OC for 10 seconds

∙For surface mount applications with flame retardent epoxy Meeting UL94V-0

Maximum Ratings @ 25OC Unless Otherwise Specified

Steady State		P(AV)	3.0W	(Note:1)
Power
Dissipation
Operation And			-55OC to
Storage		TJ, TSTG
Temperature			+150OC
Thermal		R	25OC/W
Resistance
NOTE:
1.	Mounted on 4.0mm2 copper pads to each terminal.
	Lead temperature at TL=75oC

SMBJ5913

THRU

SMBJ5956

Silicon

3.0 Watt

Zener Diode

DO-214AA

(SMBJ) (Round Lead)

H

Cathode Band

J

																				A																				C
												E
																					D										B
								F
								G
																		DIMENSIONS
								INCHES													MM
		DIM						MIN							MAX					MIN									MAX							NOTE
			A				.078					.116							1.98							2.95
			B				.075					.089							1.90							2.25
			C				.002					.008							.05							.20
			D				-----					.02							-----							.51
			E				.035					.055							.90							1.40
			F				.065					.091							1.65							2.32
			G				.205					.224							5.21							5.69
			H				.160					.180							4.06							4.57
			J				.130					.155							3.30							3.94

SUGGESTED SOLDER

PAD LAYOUT

0.090"

0.085”

0.070”

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