MCC P4SMAJ150CA, P4SMAJ15C, P4SMAJ17CA, P4SMAJ18, P4SMAJ16C Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙For Surface Mount Applications

∙Unidirectional And Bidirectional

∙Low Inductance

∙High Temp Soldering: 250°C for 10 Seconds At Terminals

∙For Bidirectional Devices Add “C” To The Suffix Of The Part Number: i.e. P4SMAJ5.0C or P4SMAJ5.0CA for 5% Tolerance

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•Case: JEDEC DO-214AC

•Terminals: Solderable per MIL-STD-750, Method 2026

•Polarity: Indicated by cathode band except bi-directional types

0D[LPXP 5DWLQJ

•Operating Temperature: -55° C to +150° C

•Storage Temperature: -55° C to +150° C

•Typical Thermal Resistance: 25:/W Junction to Ambient

	Peak Pulse Current on	IPPM	See Table 1	Note 1
	10/1000 V :DYHIRUP
	Peak Pulse Power Dissipation	PPPM	Min 400 W	Note 1, 5
	Steady State Power Dissipation	PM(AV)	1.0 W	Note 2, 4
	Peak Forward Surge Current	IFSM	40A	Note:4

Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above TA=25: per Fig.2.

2.Mounted on 5.0mm2 copper pads to each terminal.

3.8.3ms, single half sine wave duty cycle = 4 pulses per Minutes maximum.

4.Lead temperature at TL = 75:.

5.Peak pulse power waveform is 10/1000 V.

P4SMAJ5.0

THRU

P4SMAJ170CA

400 Watt

Transient Voltage

Suppressors 5.0 to 170 Volts

DO-214AC

(SMAJ)( LEAD FRAME)

												A
																													B
																			C
																															F																				H
																				D																				G
												E
																										DIMENSIONS
												INCHES																				MM
			DIM									MIN										MAX									MIN				MAX											NOTE
				A						.157										.181									4.00				4.60
				B						.098										.114									2.50				2.90
				C						.006										.012									0.152				0.305
				D						.030										.060									0.76				1.. 52
				E						.188										.208									4.80				5.28
				F						.078										.096									2.00				2.44
				G						.055										.062									1.40				1.60
				H						.002										.008									0.051				0.203

SUGGESTED SOLDER

PAD LAYOUT

0.085 ” MA X

0.058 ”MI N

0.05 MI N

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P4SMAJ5.0 thru P4SMAJ170CA

KWPOWER,PULSEPEAK,

OR

IN

100

POWER(Ppp)PULSEPEAK

DERATINGCURRENT(Ipp) %PERCENTAGE

NON-REPETITIVE

PULSE WAVEFORM

SHOWN IN FIGURE 3

10

TA = 25 ¢J

1.0

MOUNTED ON 5.0mm 2

PPM

COPPER LAND AREAS

0.1

P

0.1 £gs

1.0 £gs

10 £gs

100 £gs 1.0ms

10ms

td, PULSE WIDTH, SEC

M C C

100

75

50

25

0

0

25

50

75

100

125

150

175

200

TA, AMBIENT TEMPERATURE, ¢J

Fig. 1-PEAK PULSE POWER RATING CURVE

Ippm, PEAK PULSE CURRENT, %

150

100

50

0

								TA = 25 ¢J
				tf = 10£gsec				Pulse Width(td) is Defined as the
								Point Where the Peak Current
		Peak Value Ippm						Decays to 50% of lpp

Half ValueIpp

2

10/1000 £gsec Waveform as Defined by R.E.A.

										e-kt
			td
0			1.0				2.0	3.0		4.0

t, TIME , ms

Fig. 3-PULSE WAVEFORM

		50
Ifsm, PEAK FORWARD SURGE			T	= T max
			J	J
	CURRENT, AMPERES	40	8.3mss SINGLE HALF
			SINCE-WAVE JEDEC
			METHOD
		30
		20
		10
		0
		1	4	10	20	40	100

NUMBER OF CYCLES AT 60Hz

Fig. 5-MAXIMUM NON-REPETITIVE PEAK FORWARD

SURGE CURRENT

Fig. 2-PULSE RATING CURVE

	10,000
		TJ = 25 ¢J
		f = 1.0MHz
		Vsig = 50mVp-p
pF	1,000				MEASURED AT
					ZERO BIAS
CAPACITANCE,
	100
CJ,
		MEASURED AT
		STAND-OFF
		VOLTAGE(VMW)
	10
	1.0	2.0	5.0	10	20	50	100	200

V(BR), BREAKDOWN VOLTAGE, VOLTS

Fig. 4-TYPICAL JUNCTION CAPACITANCE

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