MCC UF1B, UF1A, UF1D, UF1J, UF1G Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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UF1A THRU UF1K

Features

∙For surface mounted applications

∙Glass passivated junction

∙Easy pick and place

∙High Temp Soldering: 260°C for 10 Seconds At Terminals

∙Superfast Recovery Times For High Efficiency

Maximum Ratings

∙Operating Temperature: -50°C to +150°C

∙Storage Temperature: -50°C to +150°C

∙Maximum Thermal Resistance; 30°C/W Junction To Lead

MCC	Device	Maximum	Maximum	Maximum
Catalog	Marking	Reccurrent	RMS	DC
Number		Peak Reverse	Voltage	Blocking
		Voltage		Voltage
UF1A	UF1A	50V	35V	50V
UF1B	UF1B	100V	70V	100V
UF1D	UF1D	200V	140V	200V
UF1G	UF1G	400V	280V	400V
UF1J	UF1J	600V	420V	600V
UF1K	UF1K	800V	560V	800V

Electrical Characteristics @ 25°C Unless Otherwise Specified

	Average Forward	IF(AV)	1.0A	TL = 100°C
	Current
	Peak Forward Surge	IFSM	30A	8.3ms, half sine
	Current
	Maximum Instantaneous
	Forward Voltage
	UF1A-D		1.0V
	UF1G	VF	1.4V	IFM = 1.0A;
	UF1J-K		1.7V	°
				TJ = 25 C*
	Maximum DC
	Reverse Current At	IR	10μA	TA = 25°C
	Rated DC Blocking		μ	°
	Voltage		100 A	TA = 125 C
	Maximum Reverse
	Recovery Time		50ns	IF=0.5A, IR=1.0A,
	UF1A-G	Trr
	UF1J-K		100ns	Irr=0.25A
	Typical Junction	CJ	17pF	Measured at
	Capacitance			1.0MHz, VR=4.0V

*Pulse test: Pulse width 200 μsec, Duty cycle 2%

1 Amp Surface Mount

Super Fast

Rectifier

50 to 800 Volts

DO-214AA

(SMBJ) (LEAD FRAME)

H

J

		A	C
	E	D	B
F
G
		DIMENSIONS

	INCHES		MM
DIM	MIN	MAX	MIN	MAX	NOTE
A	.083	.096	2.11	2.44
B	.075	.083	1.91	2.11
C	.002	.008	.05	.20
D	-----	.02	-----	.51
E	.030	.050	.76	1.27
F	.065	.091	1.65	2.32
G	.200	.220	5.08	5.59
H	.160	.185	4.06	4.70
J	.130	.155	3.30	3.94

SUGGESTED SOLDER

PAD LAYOUT

0.085"

0.095”

0.075”

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