MCC SK810, SK845, SK86, SK88, SK82 Datasheet

M C C

omponents 21201 Itasca Street Chatsworth

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Features

∙For Surface Mount Applications

∙Extremely Low Thermal Resistance

∙Easy Pick And Place

∙High Temp Soldering: 250°C for 10 Seconds At Terminals

∙High Current Capability With Low Forward Voltage

Maximum Ratings

∙Operating & Storage Temperature: -55°C to +125°C

∙Maximum Junction Temperature: 150°C

∙Typical Thermal Resistance: 18°C/W Junction To Lead

MST		Maximum	Maximum	Maximum
Part	Device	Recurrent	RMS	DC
Number	Marking	Peak Reverse	Voltage	Blocking
		Voltage		Voltage
SK82	SK82	20V	14V	20V
SK83	SK83	30V	21V	30V
SK84	SK84	40V	28V	40V
SK845	SK845	45V	31.5V	45V
SK85	SK85	50V	35V	50V
SK86	SK86	60V	42V	60V
SK88	SK88	80V	56V	80V
SK810	SK810	100V	70V	100V

Electrical Characteristics @ 25°C Unless Otherwise Specified

Average Forward	IF(AV)	8.0A	TJ = 95°C
Current
Peak Forward Surge	IFSM	200A	8.3ms, half sine
Current
Maximum
Instantaneous
Forward Voltage		.65V	IFM = 8.0A;
SK82-86	VF
SK88-810		.85V	TJ = 25°C*
Maximum DC		1mA	TJ = 25°C
Reverse Current At	IR
Rated DC Blocking		20mA	TJ = 100°C
Voltage
Typical Junction	CJ	400pF	Measured at
Capacitance			1.0MHz, VR=4.0V

SK82

THRU

SK810

8 Amp Schottky

Rectifier 20 to 100 Volts

DO-214AB

(SMCJ) (Round Lead)

H

Cathode Band

J

		A	C
	E	D
F			B
G
		DIMENSIONS

DIM	INCHES		MM		NOTE
	MIN	MAX	MIN	MAX
A	.200	.214	5.08	5.43
B	.177	.203	4.70	5.30
C	.002	.005	.05	.13
D	---	.02	---	.51
E	.053	.067	1.35	1.70
F	.168	.179	4.27	4.55
G	.320	.330	8.13	8.38
H	.239	.243	6.08	6.18
J	.234	.240	5.95	6.10

SUGGESTED SOLDER

PAD LAYOUT

0.190’

0.200”

0.070”

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