INFICON PM-700 User Manual
OPERATION AND SERVICE MANUAL
PM-700 SERIES
PLATING MONITOR
P/N 170800
S/N _____________
MAXTEK, INC.
11980 Tel egr aph Road, Suite 104
Sant a Fe Sprin gs, CA 90670-6084
Tel: (562) 906-1515 • Fax: (562) 906-1622
http://www.maxtekinc.com
Email: sales@maxtekinc.com • support@maxtekinc.com
© 1992-2000 MAXTEK, INC. All rights reserved.
First Edition, August 1992
Second Edition, Revision A, March 1993
Third Edition, Revision B, October 1998
Third Edition, Revision C, March 2000
WARRANTY
Maxtek, Inc. warrants the product to be free of functional defects in material and
workmanship and that it will perform in accordance with its published
specification for a period of (twenty-four) 24 months.
The foregoing warranty is subject to the condition that the product be properly
operated in accordance with instructions provided by Maxtek, Inc. or has not been
subjected to improper installation or abuse, misuse, negligence, accident,
corrosion, or damage during shipment.
Purchaser's sole and exclusive remedy under the above warranty is limited to, at
Maxtek's option, repair or replacement of defective equipment or return to
purchaser of the original purchase price. Transportation charges must be prepaid
and upon examination by Maxtek the equipment must be found not to comply
with the above warranty. In the event that Maxtek elects to refund the purchase
price, the equipment shall be the property of Maxtek.
This warranty is in lieu of all other warranties, expressed or implied and
constitutes fulfillment of all of Maxtek's liabilities to the purchaser. Maxtek does
not warrant that the product can be used for any particular purpose other than that
covered by the applicable specifications. Maxtek assumes no liability in any
event, for consequential damages, for anticipated or lost profits, incidental damage
of loss of time or other losses incurred by the purchaser or third party in
connection with products covered by this warranty or otherwise.
DISCLOSURE
The disclosure of this information is to assist owners of Maxtek equipment to
properly operate and maintain their equipment, and does not constitute the release
of rights thereof. Reproduction of this information and equipment described
herein is prohibited without prior written consent from Maxtek, Inc., 11980
Telegraph Road, Suite 104, Santa Fe Springs, California, 90670.
SAFETY
All standard safety procedures associated with the safe handling of electrical
equipment must be observed. Always disconnect power when working inside
the controller. Only properly trained personnel should attempt to service the
instrument.
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Table of Contents
1. GENERAL DESCRIPTION.................................................................................................1
1.1 SPECIFICATIONS ...................................................................................................................2
2. UNPACKING, INSPECTION AND BENCH CHECKOUT.............................................5
2.1 UNPACKING, INSPECTION.....................................................................................................5
2.2 BENCH CHECKOUT...............................................................................................................5
3. SIMPLIFIED OPERATION...............................................................................................13
3.1 SAMPLE PROCESS ..............................................................................................................15
4. DETAILED OPERATION..................................................................................................18
4.1 INTRODUCTION AND GENERAL CONCEPTS .........................................................................18
4.2 DISPLAYS...........................................................................................................................18
4.3 BUTTONS ...........................................................................................................................18
4.4 OPERATION........................................................................................................................20
4.4.1 Monitor Operating States.............................................................................................21
4.4.1.1 Electroless plating ............................................................................................................21
4.4.1.1.1 Ready State .................................................................................................................21
4.4.1.1.2 Preplate State..............................................................................................................21
4.4.1.1.3 Plate State ...................................................................................................................21
4.4.1.1.4 Deplate State...............................................................................................................21
4.4.1.1.5 Endpoint State.............................................................................................................21
4.4.1.2 Electrolytic plating...........................................................................................................22
4.4.1.2.1 Ready State .................................................................................................................22
4.4.1.2.2 Plate State ...................................................................................................................22
4.4.1.2.3 Deplate State...............................................................................................................22
4.4.1.2.4 Endpoint State.............................................................................................................22
4.4.2 Monitor Measurement Modes ......................................................................................22
4.4.2.1 Single Probe Measurement Modes...................................................................................22
4.4.2.1.1 Continuous.................................................................................................................. 22
4.4.2.1.2 Sample.........................................................................................................................23
4.4.2.1.3 Sample with Deplate ...................................................................................................23
4.4.2.2 Dual Probe Measurement Modes .....................................................................................23
4.4.2.2.1 Auto Probe Swap........................................................................................................ 23
4.4.2.2.2 Alternating Measurement mode..................................................................................23
4.4.2.2.3 Dual Probe Measurement mode..................................................................................23
4.4.3 Probe States and Modes...............................................................................................24
4.4.3.1 Probe States......................................................................................................................24
4.4.3.1.1 Failed state..................................................................................................................24
4.4.3.1.2 Standby state ...............................................................................................................24
4.4.3.1.3 Active state..................................................................................................................24
4.4.3.2 Probe modes.....................................................................................................................24
4.4.3.2.1 Ready mode.................................................................................................................24
4.4.3.2.2 Hold mode...................................................................................................................24
4.4.3.2.3 Deplate mode ..............................................................................................................25
4.4.3.2.4 Preplate mode..............................................................................................................25
4.4.3.2.5 Plate mode...................................................................................................................25
4.4.4 Main Display modes.....................................................................................................25
4.4.4.1 Rate and Thickness...........................................................................................................25
4.4.4.2 Rate and Efficiency..........................................................................................................25
4.4.4.3 Efficiency and Thickness..................................................................................................25
4.4.4.4 Frequency.........................................................................................................................26
4.4.5 Parameter/Status Display modes .................................................................................26
4.4.5.1 Status Display...................................................................................................................26
4.4.5.2 Frequency Display............................................................................................................26
4.4.5.3 Elapsed Time Display.......................................................................................................26
4.4.5.4 Time to Go Display..........................................................................................................26
4.4.5.5 Current Density Display...................................................................................................26
4.4.5.6 A-B)% Display................................................................................................................ 27
4.4.6 Simulation Mode..........................................................................................................27
4.5 PARAMETERS.....................................................................................................................27
4.5.1 Viewing and modifying ................................................................................................27
4.5.2 Hidden parameters.......................................................................................................28
4.5.3 Descriptions.................................................................................................................28
4.5.3.1 Mode Menu..................................................................................................................... 30
4.5.3.2 Process Menu .................................................................................................................. 32
4.5.3.3 Bath Menu...................................................................................................................... .34
4.5.3.4 Display Menu .................................................................................................................. 36
4.5.3.5 Setup Menu..................................................................................................................... 37
4.5.4 Restoring to Default Values.........................................................................................39
4.6 STATUS ASSESSMENT ........................................................................................................39
4.6.1 Monitor Status..............................................................................................................39
4.6.2 Probe Status.................................................................................................................39
4.7 SWAPPING PROBES.............................................................................................................40
4.7.1 Manual probe swapping ..............................................................................................40
4.7.1.1 Assessing the probe status prior to initiating the swap.................................................... 40
4.7.1.2 Preplating prior to swapping............................................................................................ 40
4.7.1.3 Commanding the swap. ................................................................................................... 40
4.7.1.4 Deplating the Standby Probe........................................................................................... 40
4.7.1.5 Manual termination of Preplate or Deplate on the Standby probe. .................................. 40
4.7.2 Automatic probe swapping ..........................................................................................41
4.7.2.1 Auto probe swap on active probe failure......................................................................... 41
4.7.2.2 Alternating Probe mode................................................................................................... 41
4.7.2.3 Failed Standby Probe inhibits automatic swap................................................................ 41
4.8 EXTERNAL INTERFACE.......................................................................................................41
4.8.1 Discrete Inputs.............................................................................................................41
4.8.2 Discrete Outputs ..........................................................................................................43
4.8.3 Digital to Analog Converters.......................................................................................45
4.8.3.1 Thickness DAC................................................................................................................ 45
4.8.3.2 Rate DAC ........................................................................................................................45
4.8.4 Computer Connection ..................................................................................................47
4.8.4.1 RS-232 Interface.............................................................................................................. 48
4.8.4.2 Protocol........................................................................................................................... 48
4.8.4.3 Remote Control ............................................................................................................... 49
4.8.4.3.1 Upload Parameter Store (Instruction 10h).................................................................. 49
4.8.4.3.2 Restore Parameter Store (Instruction 20h) ................................................................. 54
4.8.4.3.3 Remotely Activate (Instruction 30h).......................................................................... 54
4.8.4.4 Remote Monitoring ......................................................................................................... 55
4.8.4.4.1 Upload Machine Status (Instruction 40h) .................................................................. 55
4.8.4.5 Data Logging................................................................................................................... 59
4.8.4.5.1 Establish automatic data logging................................................................................ 59
4.8.4.5.2 Single data log............................................................................................................ 62
5. TROUBLESHOOTING......................................................................................................63
5.1 TROUBLE-SHOOTING AIDS.................................................................................................63
5.2 FAIL MESSAGES FOLLOWING POWER ON...........................................................................64
5.2.1 Power Failure..............................................................................................................64
5.2.2 Sensor Probe Failure...................................................................................................65
5.2.3 Invalid Parameters.......................................................................................................65
5.2.4 RAM Failure................................................................................................................65
5.2.5 ROM Failure................................................................................................................65
5.3 PROBE FAILED INDICATION................................................................................................65
6. APPENDIX ..........................................................................................................................67
6.1 THEORY OF THE QUARTZ CRYSTAL MICROBALANCE ........................................................67
6.1.1 Crystal Frequency........................................................................................................67
6.1.2 Crystal Health Calculation..........................................................................................67
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6.1.3 Thickness Calculation ..................................................................................................67
6.1.4 Rate Calculation...........................................................................................................69
6.2 FINE TUNING WITH EMPIRICAL CALIBRATION ....................................................................69
6.2.1 Density..........................................................................................................................70
6.2.2 Tooling Factor.............................................................................................................70
6.2.3 Acoustic Impedance .....................................................................................................70
6.3 LIST OF MATERIAL CONSTANTS .........................................................................................72
List of Figures
FIGURE 1 POWER SWITCH AND AC CONNECTOR .............................................................................6
FIGURE 2 FRONT PANEL INDICATION, FIRST POWER-ON .................................................................6
FIGURE 3 PM-700 FRONT PANEL OUTLINE......................................................................................8
FIGURE 4 PM-720 & PM-740 REAR PANEL OUTLINE .....................................................................9
FIGURE 5 TYPICAL SYSTEM SETUP ................................................................................................10
FIGURE 6 PARAMETER MENU LAYOUT ..........................................................................................11
FIGURE 7 FRONT PANEL BUTTONS.................................................................................................19
FIGURE 8 GRAPH OF INTERVAL TIME AND DWELL TIME %............................................................29
FIGURE 9 DISCRETE INPUT CONNECTOR, 6 PIN MINI-DIN ..............................................................42
FIGURE 10 DISCRETE OUTPUT CONNECTOR, 8 PIN MINI-DIN ........................................................44
FIGURE 11 DAC I/O CONNECTOR, 7 PIN MINI-DIN .......................................................................46
FIGURE 12 TYPICAL RS-232 INTERFACE CABLE............................................................................47
List of Tables
TABLE 1 PROCESS 2 PARAMETER DEFAULT VALUES.....................................................................14
TABLE 2 SAMPLE PROCESS PARAMETER VALUES..........................................................................15
TABLE 3 DISCRETE INPUT CONNECTOR PIN ASSIGNMENTS ...........................................................42
TABLE 4 DISCRETE OUTPUT CONNECTOR PIN ASSIGNMENTS........................................................44
TABLE 5 DAC I/O CONNECTOR PIN ASSIGNMENTS.......................................................................46
TABLE 6 RS-232 CONNECTOR PIN ASSIGNMENTS .........................................................................47
TABLE 7 UPLOAD PARAMETER STORE...........................................................................................49
TABLE 8 SELECT PARAMETER CODES ............................................................................................51
TABLE 9 REMOTE ACTIVATION COMMAND CODES........................................................................54
TABLE 10 UPLOAD MACHINE STATUS CODES................................................................................55
TABLE 11 MONITOR STATUS REGISTER ......................................................................................... 55
TABLE 12 FAILURE REGISTER........................................................................................................56
TABLE 13 FLAG REGISTER.............................................................................................................56
TABLE 14 MODE REGISTER............................................................................................................56
TABLE 15 RS-232 ERROR REGISTER .............................................................................................57
TABLE 16 OUTPUT #1 STATUS REGISTER ......................................................................................57
TABLE 17 OUTPUT #2 STATUS REGISTER ......................................................................................57
TABLE 18 DATA LOGGING BIT MAP...............................................................................................60
TABLE 19 PROBE FLAG REGISTER .................................................................................................61
TABLE 20 SUMMARY OF CALIBRAT ION ADJUSTMENT....................................................................71
TABLE 21 MATERIAL CONSTANTS .................................................................................................72
ix
PM-700 SERIES PLATING MONITOR
1. GENERAL DESCRIPTION
The PM-700 Series of Plating Monitors act like intelligent electronic coupon
systems. The monitor continuously displays the thickness of the film on the
coupon and the rate of change of that thickness. It does this rapidly, in fractions
of a second, and with very high resolution.
The heart of the intelligent coupon is the quartz crystal mounted in the end of the
probe. It is the film on this crystal whose thickness and rate of change of
thickness is displayed on the monitor.
Use of this technique allows instantaneous measurement and display of the plating
rate of any liquid plating or etching process.
The basic monitoring system consists of the monitor itself, a probe with the
crystal installed and a cable connecting the probe to the monitor.
Various configurations of monitor, probe and crystal are available to meet
different requirements and the monitors incorporate numerous user modifiable
parameters so that they can be tailored to specific processes.
1
PM-700 SERIES PLATING MONITOR
1.1 SPECIFICATIONS
PM-700 Series Common Specifications
Monitor accuracy: 0.5 %
Basic measurement resolution:
Thickness: 0.01 µg/cm2
Frequency: 0.5 Hz @ 5 MHz
Display Resolution:
Weight: 0.01 µg/cm2
Efficiency: 0.1%
Frequency: 0.1 Hz
Discrete Outputs:
Preplate achieved.
Thickness achieved.
Low rate alarm.
High rate alarm.
Crystal failed.
Spare.
Spare.
Level: 0 to 5 Vdc CMOS logic level.
Source impedance: 100 ohm.
Discrete Inputs:
Start Preplate.
Start Plate.
Start Deplate
Stop or Reset.
Spare.
Logic level: Ground true.
Internal 4.7 kς pull-up to 5 Volt.
DAC Interface:
Outputs: Two independent analog outputs
Range: 0 to 5.0 Vdc
Accuracy: ± 3% of range + 1% of full scale.
Linearity: 0.5% of full scale
Output impedance: 10 kς ± 2%
Control inputs: Zero, Full Scale
Logic level: Ground true.
Internal 4.7 kς pull-up to 5 volt.
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PM-700 SERIES PLATING MONITOR
Plate/Deplate Current Supply:
Range: 0 to ± 22.12 ma.
0 to ± 1.615 ASD (amp per sq. decimeter)*
0 to ± 15 ASF (amp per sq. foot)*
* For standard crystal electrode area of 1.37 cm2
Resolution: 0.05%
Linearity: 0.1%
Accuracy: ± (0.5% of value + 0.1% full scale)
Compliance: ± 4 Vdc
RS-232 Interface:
Connector: 9 Pin, Male, D shell (IBM AT type)
Baud Rate: 9600, Full Duplex
Format: 8 bits, No parity, 1 Stop bit
Environmental:
Operating Temperature: 0 to 50o C.
Storage Temperature: -40o to +70o C.
Humidity: Up to 95% relative humidity at or below +40o C;
to 75% relative humidity from +41o to +50o C.
Power requirement: 90 VRMS to 140 VRMS or
200 VRMS to 260 VRMS
at 47 to 63 Hz, 25W.
Physical
Dimensions:
Height: 89 mm (3.5 in.)
Width: 216 mm (8.5 in.)
Depth: 235 mm (9.25 in.)
Net Weight: 8.3 kg (3.75 lbs.)
Shipping Weight: 11.3 kg (5.1 lbs.)
3
PM-700 SERIES PLATING MONITOR
2. UNPACKING, INSPECTION AND BENCH CHECKOUT
2.1 UNPACKING, INSPECTION
Carefully inspect your plating monitor and its shipping container for evidence of
possible shipping damage. If such evidence is present, notify the carrier and
Maxtek as soon as possible. Keep the shipping container as evidence if shipping
damage is present or for possible future return of the monitor. Check the material
received against the packing list to ensure that all materials are accounted for.
Items included with your plating monitor are:
1 Plating Monitor
1 Operation and Service Manual
1 Power cord
In addition, you may have ordered one or more of the accessories. If there is no
evidence of damage, the monitor can now be bench checked.
2.2 BENCH CHECKOUT
Before connecting ac power to your Plating Monitor, make sure input voltage
requirement is correct for your installation. The selected line voltage can be seen
through the plastic window on the monitor rear panel. If it does not correspond to
the power line voltage to be used, follow the steps below to select the correct line
voltage.
1. Slide plastic cover to the left, exposing fuse and voltage selector p.c. board.
2. Remove fuse by pulling "FUSE PULL" lever to the left.
3. Remove voltage selector p.c. board by pulling it with a suitable tool on the
small hole in the center of the board.
4. Select the voltage by positioning the p.c. board so the desired voltage is
indicated on upper left corner. Insert board into place in this position.
5. Install fuse and slide cover to the right. The selected voltage will be visible
through the plastic window.
Connect the ac power cord to the monitor rear panel line connector. Turn on the
monitor via the rear panel rocker switch. When power is applied to the monitor it
goes through an internal test routine during which all displays and indicators are
lit up. This condition lasts approximately six seconds. The Rate and Thickness
displays will begin to flash a P FAIL message indicating that power has been
interrupted. This is normal and it will happen every time the monitor is turned
off.
5
PM-700 SERIES PLATING MONITOR
Figure 1 Power Switch and AC Connector
You may see an E FAIL or I FAIL message for a short time, this is normal.
However, if the display stops on either of those messages, an internal fault has
been detected and the monitor will remain inoperative until the fault has been
corrected. Further details of error messages can be found in the Troubleshooting
Section on page 63.
Figure 2 Front Panel Indication, First Power-On
Press the Stop button to clear the P FAIL message. Now, an O FAIL will be
flashing. The red light in the Probe Status window will be on indicating a probe
failure, because there is no probe with crystal has been connected to the monitor.
Note that during actual operation, a P FAIL message indicates the line power to
6
PM-700 SERIES PLATING MONITOR
the monitor has been interrupted. The red light in the Probe Status window and
the O FAIL message indicates a problem with the probe or the sensor crystal.
The Parameter/Status display will show the last display mode selected prior to
removing power from the monitor. See Parameter/Status Display Modes Section
on page 26 for detail description of the Parameter/Status display.
Using the standard 3 meter triaxial cable and connect the Sensor Probe to the
Plating Monitor rear panel connector labeled PROBE A. Be careful not to touch
the surface of the sensor crystal installed in the crystal holder. After the Sensor
Probe has been connected, pressing the STOP button should step Probe Status
Indicator from red to green indicating a good Sensor Probe is connected and is in
active. The O FAIL message then should be clear.
Pressing PLATE or PREPLATE will reset thickness display to zero. Breathe
lightly onto the sensor crystal surface. The displayed thickness should increase
due to condensed water vapor on the crystal. The thickness then will decrease as
additional water vapor evaporates from the crystal surface.
If your monitor is a dual probe model, you may also want to connect a second
Sensor Probe to the monitor connector labeled PROBE B. You will need to make
Probe B the active probe by pressing PROBE B button follow by PLATE button
(Note that Probe A is now in standby). An O FAIL message should flash in the
main display indicating Probe B has been failing. Press STOP key, the O FAIL
message should be clear and the Probe B Status Indicator should change from red
to green. Probe B is now the active probe. Test Probe B the same way you have
tested Probe A.
If everything responds as described above, the total system is OK. The monitor
can now be programmed to suit your application.
7
PM-700 SERIES PLATING MONITOR
Figure 3 PM-700 Front Panel Outline
8
PM-700 SERIES PLATING MONITOR
Figure 4 PM-720 & PM-740 Rear Panel Outline
9
PM-700 SERIES PLATING MONITOR
10
Figure 5 Typical System Setup
PM-700 SERIES PLATING MONITOR
Figure 6 Parameter Menu Layout
11
PM-700 SERIES PLATING MONITOR
3. SIMPLIFIED OPERATION
This section is designed to help first time user of the PM-700 Series Plating
Monitor to become familiar with viewing, programming and editing of the
monitor parameters.
First, refer to Figure 7 Front Panel Buttons on page 19, locate the four arrow
buttons and study their functions. Next, refer to Figure 6, Parameter Menu
Layout, on page 6 and study the way the menus and parameters are laid out.
Notice that the SELECT buttons (left and right arrows) are used to move
horizontally through the parameters. The two MODIFY buttons (up and down
arrows) are used to vertically step through the menus or to change a parameter
value. Note that these arrow buttons have auto repeat functions. If one of them is
pressed and held down it will scroll to the ultimate limit (i.e. if you are at a
parameter with a numerical value, pressing and holding down the MODIFY UP
arrow will ultimately increase that parameter value to its maximum limit).
PM-700 Series Plating Monitor are shipped with Process Number 2 as the default
process. Process Number 1 may be programmed to your specific plating process
if you requested Maxtek to do so at the time you purchased your monitor. The
following table is a list of parameters default values for Process Number 2. Use
the four arrow buttons you have just learned above to step through the parameters
and check their default values against the list. Also, practice changing some of
the parameter values to get a feel on how to modify them. There are four material
parameters that could be reset to their factory set default values. If you wish to do
so, simply press the STATUS button while both of the Up and Down arrow
buttons are depressed.
13
PM-700 SERIES PLATING MONITOR
Table 1 Process 2 Parameter Default Values
Menu Parameter Default Value
Mode Menu Sample Off
Mode Menu Measure Mode * Single
Mode Menu ProbSwap * Manual
Process Menu Process Number 2
Process Menu Endpoint Setting 10.00
Process Menu Min Rate Alarm 0.000
Process Menu Max Rate Alarm 9.999
Process Menu Plate Current Density 0.001
Bath Menu Bath Special1
Bath Menu Type Elecless
Bath Menu Preplate Thckness 1.000
Bath Menu Preplate Rate 0.200
Bath Menu Deplate Rate 0.100
Bath Menu Density 1. 000
Bath Menu Acoustic Ratio 8.830
Display Menu Main Display Rate Thk
Display Menu Parm Status Display Status
Setup Menu Crystal Type 5 MHz
Setup Menu Crystal Area cm^2 1.370
Setup Menu DAC Thckness Range 5.000
Setup Menu DAC Low Rate 0.000
Setup Menu DAC High Rate 9.999
Setup Menu Simulate Mode Off
* These parameters are only available in dual probe models.
14
The following example is a typical plating process. It is provide for you to
practice parameter programming.
PM-700 SERIES PLATING MONITOR
3.1 SAMPLE PROCESS
Suppose a PM-700 monitor is to be used to continuously measure the plating rate
and thickness in an electroless nickel bath, giving a deposit with 6%
phosphorus. Since this bath will not initiate plating on a pure gold surface, the
sensor crystal will have to be electrolytically preplated with, for example, .5
microns of nickel at a controlled rate in order to support subsequent autocatalytic
electroless plating. Assume that the desired plating thickness endpoint is 20
microns and it is desired that the plating monitor warns the operator if the plating
rate falls outside the normal limits of .100 ±0.02 micron/min. It is also desired
that the total elapsed time since introduction of the work into the plating bath be
displayed. These parameters will be established for process number 3.
Given the above example, the following list of parameters will need to be
programmed into the monitor.
Table 2 Sample Process Parameter Values
Menu Parameter Value
Process Menu Process Number 3
Process Menu Endpoint Setting 20.00
Process Menu Min Rate Alarm 0.080
Process Menu Max Rate Alarm 0.120
Mode Menu Sample Off
Bath Menu Bath Ni 6%P
Bath Menu Type Elecless
Bath Menu Preplate Thckness 0.500
Bath Menu Preplate Rate 0.050
Display Menu Parm Status Display Elaptime
Setup Menu Simulate Off
Since the above parameters will be established for process number 3, the first
thing to do is select process number 3 as the current process. You can do this by
going to the Process parameter in the Process Menu and use the SELECT arrow
buttons to find Number 3. Then follow the above list to program the rest of the
parameters.
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PM-700 SERIES PLATING MONITOR
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