Datasheet STTH1R02Q Specification

A

K

K

A

SMB

K

A

DO-15

DO-41

K

A

K

A

SMA

200 V - 1.5 A ultrafast recovery diode

Features

• Very low conduction losses

• Negligible switching losses

• Low forward voltage drop

• High junction temperature

• ECOPACK®2

Applications

• Switching diode

• LED Lighting

• Auxiliary power supply

• Flyback diode

STTH1R02

Datasheet

Product status

STTH1R02

Product summary

Symbol Value

I

F(AV)

V

RRM

T

j(max.)

V

F(typ.)

trr(typ.) 15 ns

Description

The STTH1R02 uses ST's new 200 V planar Pt doping technology, and it is specially
suited for switching mode base drive and transistor circuits.

Packaged in SMA, SMB, DO-41 and DO-15, the STTH1R02 is ideal for use low
voltage, high frequency inverters, free wheeling and polarity protection

1.5 A

200 V

175 °C

0.7 V

DS4743 - Rev 4 - December 2018
For further information contact your local STMicroelectronics sales office.

www.st.com

1 Characteristics

Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)

Symbol Parameter Value Unit

V

I

I

Symbol Parameter Max. value Unit

R

R

Repetitive peak reverse voltage 200 V

RRM

Average forward current δ = 0.5, square wave

F(AV)

Surge non repetitive forward current

FSM

T

Storage temperature range -65 to +175 °C

stg

T

Operating junction temperature +175 °C

j

Junction to lead SMA, SMB 30

th(j-l)

Junction to lead Lead length = 10 mm on infinite heatsink DO-15, DO-41 45

th(j-l)

SMA, SMB

DO-41, DO-15

TL = 150 °C

TL = 135 °C

tp = 10 ms sinusoidal

Table 2. Thermal resistance parameter

STTH1R02

Characteristics

1.5 A

60 A

°C/W

For more information, please refer to the following application note :

• AN5088 : Rectifiers thermal management, handling and mounting recommendations

Table 3. Static electrical characteristics

Symbol

I

R

V

F

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

Parameter Test conditions Min. Typ. Max. Unit

(1)

Reverse leakage current

(2)

Forward voltage drop

Tj = 25 °C

Tj = 125 °C

Tj = 25 °C

Tj = 100 °C

Tj = 150 °C

VR = V

RRM

IF = 1.5 A

- 3

- 2 20

- 0.89 1.00

- 0.76 0.85

- 0.70 0.80

To evaluate the conduction losses, use the following equation:

P = 0.68 x I

F(AV)

+ 0.08 x I

F2(RMS)

For more information, please refer to the following application notes related to the power losses :

• AN604: Calculation of conduction losses in a power rectifier

• AN4021: Calculation of reverse losses on a power diode

µA

V

DS4743 - Rev 4

page 2/15

STTH1R02

Characteristics

Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated)

Symbol Parameters Test conditions Min. Typ. Max. Unit

t

Reverse recovery time

rr

I

Reverse recovery current

RM

t

Forward recovery time

fr

V

Forward recovery voltage

FP

IF = 1 A, dIF/dt = -50 A/μs,VR = 30 V

IF = 1 A, dIF/dt = -100 A/μs, VR = 30 V

IF = 1.5 A, dIF/dt = -200 A/μs, VR = 160 V, Tj = 125 °C

IF =1.5 A, dIF/dt = 100 A/μs, VFR = 1.1 V

F(max.)

IF =1.5 A, dIF/dt = 100 A/μs

- 23 30
ns

- 15 20

- 3 4 A

- 50 ns

- 2.1 V

DS4743 - Rev 4

page 3/15

1.1 Characteristics (curves)

0

5

10

15

20

25

30

35

40

45

50

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

IM(A)

T

d

=tp/T

tp

I

M

T

δ

=tp/T

tp

I

M

P = 2 WP = 2 W

P = 1 WP = 1 W

P = 5 WP = 5 W

δ

0

10

20

30

40

50

0.0 0.5 1.0 1.5 2.0 2.5

IF(A)

Tj=25°C

Tj=150°C

VF(V)

0

10

20

30

40

50

0.0 0.5 1.0 1.5 2.0 2.5

IFM(A)

Tj=25°C

Tj=150°C

VFM(V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Z

th(j-a)/Rth(j-a)

Single pulse

SMA

Scu=1cm²

tP(s)

STTH1R02

Characteristics (curves)

Figure 1. Peak current versus duty cycle

Figure 3. Forward voltage drop versus forward current

(maximum values)

Figure 2. Forward voltage drop versus forward current

(typical values)

Figure 4. Relative variation of thermal impedance junction

to lead versus pulse duration (SMA)

DS4743 - Rev 4

page 4/15

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E -02 1.E -01 1.E +00 1.E +01 1.E+02 1.E +03

Z

th(j-a)/Rth(j-a)

Single pulse

SM B

Scu=1cm²

tP(s)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

Z

th(j-a)/Rth(j-a)

Single pulse

DO-41

Lleads=10mm

tP(s)

0. 0

0. 1

0. 2

0. 3

0. 4

0. 5

0. 6

0. 7

0. 8

0. 9

1. 0

1. E-03 1.E- 02 1. E- 01 1.E+ 00 1.E+ 01 1.E+ 02 1.E+ 03

Z

th(j-a)/Rth(j-a)

Single pulse

DO-15

Leads =10mm

tP(s)

1

10

100

1 10 100 1000

C(pF)

F=1MHz

V

osc

=30mV

RMS

Tj=25°C

VR(V)

0

10

20

30

40

50

60

70

80

10 100 1000

QRR(nC)

IF=1.5A

VR=160V

Tj=125°C

Tj=25°C

dIF/dt(A/ µs)

0

10

20

30

40

50

60

70

80

10 100 1000

tRR(ns)

IF=1.5A

VR=160V

Tj=125°C

Tj=25°C

dIF/dt(A/ µs)

STTH1R02

Characteristics (curves)

Figure 5. Relative variation of thermal impedance junction

to lead versus pulse duration (SMB)

Figure 7. Relative variation of thermal impedance junction

to lead versus pulse duration (DO-15)

Figure 6. Relative variation of thermal impedance junction

to lead versus pulse duration (DO-41)

Figure 8. Junction capacitance versus reverse voltage

applied (typical values)

Figure 9. Reverse recovery charges versus dIF/dt (typical

values)

DS4743 - Rev 4

Figure 10. Reverse recovery time versus dIF/dt (typical

values)

page 5/15

0

1

2

3

4

5

6

7

8

10 100 1000

IRM(A)

IF=1.5A

VR=160V

Tj=125°C

Tj=25°C

dIF/dt(A/ µs)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

25 50 75 100 125 150

QRR; IRM[Tj] / QRR; IRM[Tj=125°C]

I

RM

Q

RR

IF=1.5A

VR=160V

Tj(°C)

R

th(j-a)

(°C/W)

0

50

100

150

200

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMB

SCu(cm²)

Epoxy printed board FR4, eCu = 35 µm

R

th(j-a)

(°C/W)

0

50

100

150

200

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

SMA

SCu(cm²)

Epoxy printed board FR4, eCu = 35 µm

0

10

20

30

40

50

60

70

80

90

100

0 1 2 3 4 5 6 7 8 9 10

R

th(j-a)

(°C/W)

DO-41

L

leads

(mm)

0

20

40

60

80

100

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

R

th(j-a)

(°C/W)

DO-15

L

leads

(mm)

STTH1R02

Characteristics (curves)

Figure 11. Peak reverse recovery current versus dIF/dt

(typical values)

Figure 13. Thermal resistance junction to ambient versus

copper surface under each lead (typical values)

Figure 12. Relative variations of dynamic parameters

versus junction temperature

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (typical values)

Figure 15. Thermal resistance junction to ambient versus

lead length (DO-41)

DS4743 - Rev 4

Figure 16. Thermal resistance junction to ambient versus

lead length (DO-15)

page 6/15

2 Package information

E1

E

D

C

L

A1

A2

b

STTH1R02

Package information

2.1

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK

®

packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.

SMB package information

• Epoxy meets UL94, V0

• Lead-free package

Figure 17. SMB package outline

DS4743 - Rev 4

page 7/15

2.60

(0.102)

5.84

(0.230)

1.62

2.18

(0.086)

1.62

)640.0()460.0(

STTH1R02

SMB package information

Table 5. SMB package mechanical data

Dimensions

Ref.

A1 1.90 2.45 0.074 0.097

A2 0.05 0.20 0.001 0.008

b 1.95 2.20 0.076 0.087

c 0.15 0.40 0.005 0.016

D 3.30 3.95 0.129 0.156

E 5.10 5.60 0.200 0.221

E1 4.05 4.60 0.159 0.182

L 0.75 1.50 0.029 0.060

Figure 18. SMB recommended footprint

Millimeters Inches (for reference only)

Min. Max. Min. Max.

DS4743 - Rev 4

page 8/15

2.2 SMA package information

E1

E

D

C

L

A1

A2

b

• Epoxy meets UL94, V0

• Cooling method : by conduction (C)

STTH1R02

SMA package information

Figure 19. SMA package outline

Table 6. SMA package mechanical data

Dimensions

Ref.

A1 1.90 2.45 0.074 0.097

A2 0.05 0.20 0.001 0.008

b 1.25 1.65 0.049 0.065

c 0.15 0.40 0.005 0.016

D 2.25 2.90 0.088 0.115

E 4.80 5.35 0.188 0.211

E1 3.95 4.60 0.155 0.182

L 0.75 1.50 0.029 0.060

Millimeters Inches (for reference only)

Min. Max. Min. Max.

DS4743 - Rev 4

page 9/15

Figure 20. SMA recommended footprint in mm (inches)

2.63

(0.104)

5.43

(0.214)

1.4

1.64

(0.065)

1.4

)550.0()550.0(

STTH1R02

SMA package information

DS4743 - Rev 4

page 10/15

2.3 DO-41 package information

ØB

ØD

AC

C

• Epoxy meets UL 94, V0

STTH1R02

DO-41 package information

Figure 21. DO-41 package outline

Table 7. DO-41 package mechanical data

Dimensions

Ref.

Min. Typ. Max. Min. Typ. Max.

A 4.07 - 5.20 0.160 - 0.205

B 2.04 - 2.71 0.080 - 0.107

C 25.40 - 1.000 -

D 0.71 - 0.86 0.028 - 0.0034

Millimeters Inches (for reference only)

DS4743 - Rev 4

page 11/15

2.4 DO-15 package information

ØB

ØD

AC

C

• Epoxy meets UL 94, V0

STTH1R02

DO-15 package information

Figure 22. DO-15 package outline

Table 8. DO-15 package mechanical data

Dimensions

Ref.

Min. Typ. Max. Min. Typ. Max.

A 6.05 - 6.75 0.238 - 0.266

B 2.95 - 3.53 0.116 - 0.139

C 26.00 - 31.00 1.024 - 1.220

D 0.71 - 0.88 0.028 - 0.0035

Millimeters Inches (for reference only)

DS4743 - Rev 4

page 12/15

3 Ordering information

Order code Marking Package Weight Base qty. Delivery mode

STTH1R02A R1A SMA 0.068 g 5000 Tape and reel

STTH1R02U 1R2S SMB 0.107 g 2500 Tape and reel

STTH1R02 STTH1R02 DO-41 0.34 g 2000 Ammopack

STTH1R02RL STTH1R02 DO-41 0.34 g 5000 Tape and reel

STTH1R02Q STTH1R02Q DO-15 0.40 g 1000 Ammopack

STTH1R02QRL STTH1R02Q DO-15 0.40 g 6000 Tape and reel

STTH1R02

Ordering information

Table 9. Ordering information

DS4743 - Rev 4

page 13/15

Revision history

03-May-2006 1 First issue.

13-Oct-2006 2 Added DO-15 and SMB packages.

08-Mar-2007 3 Replaced Figure 8. Replaced ecu with copper thickness.

05-Dec-2018 4 Updated Section Applications. Minor text changes.

STTH1R02

Table 10. Document revision history

Date Revision Changes

DS4743 - Rev 4

page 14/15

STTH1R02

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DS4743 - Rev 4

page 15/15