Analog Devices AD5302 12 22 a Datasheet

2.5 V to 5.5 V, 230 A Dual Rail-to-Rail, Voltage Output 8-/10-/12-Bit DACs
FEATURES AD5302: Two 8-Bit Buffered DACs in 1 Package
A Version: 1 LSB INL, B Version: 0.5 LSB INL
AD5312: Two 10-Bit Buffered DACs in 1 Package
A Version: 4 LSB INL, B Version: 2 LSB INL
AD5322: Two 12-Bit Buffered DACs in 1 Package
A Version: 16 LSB INL, B Version: 8 LSB INL 10-Lead MSOP Package Micropower Operation: 300 A @ 5 V (Including
Reference Current) Power-Down to 200 nA @ 5 V, 50 nA @ 3 V
2.5 V to 5.5 V Power Supply Double-Buffered Input Logic Guaranteed Monotonic by Design over All Codes Buffered/Unbuffered Reference Input Options 0 V to V
Output Voltage
REF
Power-On-Reset to 0 V Simultaneous Update of DAC Outputs via LDAC Low Power Serial Interface with Schmitt-Triggered Inputs On-Chip Rail-to-Rail Output Buffer Amplifiers
APPLICATIONS Portable Battery-Powered Instruments Digital Gain and Offset Adjustment Programmable Voltage and Current Sources Programmable Attenuators
AD5302/AD5312/AD5322

GENERAL DESCRIPTION

The AD5302/AD5312/AD5322 are dual 8-, 10-, and 12-bit buffered voltage output DACs in a 10-lead MSOP package that operate from a single 2.5 V to 5.5 V supply, consuming 230 µA at 3 V. Their on-chip output amplifiers allow the outputs to swing rail-to-rail with a slew rate of 0.7 V/µs. The AD5302/AD5312/AD5322 utilize a versatile 3-wire serial interface that operates at clock rates up to 30 MHz and is compatible with standard SPI
®
, QSPI™,
MICROWIRE™, and DSP interface standards.
The references for the two DACs are derived from two reference pins (one per DAC). The reference inputs may be configured as buffered or unbuffered inputs. The outputs of both DACs may be updated simultaneously using the asynchronous LDAC input. The parts incorporate a power-on reset circuit, which ensures that the DAC outputs power-up to 0 V and remain there until a valid write takes place to the device. The parts contain a power-down feature that reduces the current consumption of the devices to 200 nA at 5V (50 nA at 3 V) and provides software-selectable output loads while in power-down mode.
The low power consumption of these parts in normal operation makes them ideally suited to portable battery operated equipment. The power consumption is 1.5 mW at 5 V, 0.7 mW at 3 V, reducing to 1 µW in power-down mode.

FUNCTIONAL BLOCK DIAGRAM

V
DD
POWER-ON
RESET
REGISTER
SYNC
SCLK
DIN
*Patent Pending; protected by U.S. Patent No. 5684481.
INTERFACE
LOGIC
LDAC
REGISTER
INPUT
INPUT
DAC
REGISTER
DAC
REGISTER
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
V
A
REF
AD5302/AD5312/AD5322
STRING
DAC
POWER-DOWN
LOGIC
STRING
DAC
B
V
REF
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved.
BUFFER
BUFFER
GND
RESISTOR NETWORK
RESISTOR NETWORK
V
A
OUT
B
V
OUT
AD5302/AD5312/AD5322–SPECIFICATIONS
GND; CL = 200 pF to GND; all specifications T
Parameter
1
DC PERFORMANCE
3, 4
A Version Min Typ Max Min Typ Max Unit Conditions/Comments
to T
MIN
, unless otherwise noted.)
MAX
2
B Version
2
(VDD = 2.5 V to 5.5 V; V
= 2 V; RL = 2 k to
REF
AD5302
Resolution 8 8 Bits Relative Accuracy ± 0.15 ± 1 ± 0.15 ± 0.5 LSB Differential Nonlinearity ±0.02 ± 0.25 ±0.02 ±0.25 LSB Guaranteed Monotonic by Design over All Codes
AD5312
Resolution 10 10 Bits Relative Accuracy ± 0.5 ± 4 ± 0.5 ± 2 LSB Differential Nonlinearity ±0.05 ± 0.5 ±0.05 ±0.5 LSB Guaranteed Monotonic by Design over All Codes
AD5322
Resolution 12 12 Bits Relative Accuracy ± 2 ±16 ± 2 ± 8 LSB
Differential Nonlinearity ±0.2 ± 1 ±0.2 ±1LSB Guaranteed Monotonic by Design over All Codes Offset Error ± 0.4 ± 3 ± 0.4 ± 3% of FSR See Figures 2 and 3 Gain Error ± 0.15 ± 1 ± 0.15 ± 1% of FSR See Figures 2 and 3 Lower Deadband 10 60 10 60 mV See Figures 2 and 3 Offset Error Drift Gain Error Drift Power Supply Rejection Ratio DC Crosstalk
DAC REFERENCE INPUTS
VREF Input Range 1 V
5
5
5
5
5
–12 –12 ppm of FSR/°C –5 –5 ppm of FSR/°C –60 –60 dB VDD = ± 10% 30 30 µV
1V
DD
0V
0V
DD
V Buffered Reference Mode
DD
V Unbuffered Reference Mode
DD
VREF Input Impedance >10 >10 M Buffered Reference Mode
180 180 k Unbuffered Reference Mode,
Input Impedance = R
DAC
Reference Feedthrough –90 –90 dB Frequency = 10 kHz Channel-to-Channel Isolation –80 –80 dB Frequency = 10 kHz
OUTPUT CHARACTERISTICS
Minimum Output Voltage Maximum Output Voltage
5
6
6
0.001 0.001 V min This is a measure of the minimum and maximum
VDD – 0.001 VDD – 0.001 V max drive capability of the output amplifier. DC Output Impedance 0.5 0.5 Short Circuit Current 50 50 mA V
DD
= 5 V
20 20 mA VDD = 3 V Power-Up Time 2.5 2.5 µs Coming out of Power-Down Mode. V
DD
55µs Coming out of Power-Down Mode. VDD = 3 V
LOGIC INPUTS
5
Input Current ± 1 ± 1 µA
, Input Low Voltage 0.8 0.8 V VDD = 5 V ± 10%
V
IL
0.6 0.6 V VDD = 3 V ± 10%
, Input High Voltage 2.4 2.4 V VDD = 5 V ± 10%
0.5 0.5 V V
V
IH
= 2.5 V
DD
2.1 2.1 V VDD = 3 V ± 10%
2.0 2.0 V V
= 2.5 V
DD
Pin Capacitance 2 3.5 2 3.5 pF
POWER REQUIREMENTS
V
DD
(Normal Mode) Both DACs active and excluding load currents
I
DD
= 4.5 V to 5.5 V 300 450 300 450 µA Both DACs in unbuffered mode. VIH = VDD and
V
DD
VDD = 2.5 V to 3.6 V 230 350 230 350 µAV
2.5 5.5 2.5 5.5 V IDD specification is valid for all DAC Codes.
= GND. In buffered mode, extra current is
IL
typically x µA per DAC where x = 5 µA + V
(Full Power-Down)
I
DD
VDD = 4.5 V to 5.5 V 0.2 1 0.2 1 µA VDD = 2.5 V to 3.6 V 0.05 1 0.05 1 µA
NOTES
1
See Terminology section.
2
Temperature range: A, B Version: –40°C to +105°C.
3
DC specifications tested with the outputs unloaded.
4
Linearity is tested using a reduced code range: AD5302 (Code 8 to 248); AD5312 (Code 28 to 995); AD5322 (Code 115 to 3981).
5
Guaranteed by design and characterization, not production tested.
6
In order for the amplifier output to reach its minimum voltage, offset error must be negative. In order for the amplifier output to reach its maximum voltage, V
= VDD and offset plus gain error must be positive.
REF
Specifications subject to change without notice.
= 5 V
REF/RDAC
.
REV. A–2–
AD5302/AD5312/AD5322
(VDD = 2.5 V to 5.5 V; RL = 2 k to GND; CL = 200 pF to GND; all specifications T

AC SPECIFICATIONS

Parameter
2
1
otherwise noted.)
A, B Version Min Typ Max Unit Conditions/Comments
3
Output Voltage Settling Time V
= VDD = 5 V
REF
MIN
to T
, unless
MAX
AD5302 6 8 µs 1/4 Scale to 3/4 Scale Change (0x40 to 0xC0) AD5312 7 9 µs 1/4 Scale to 3/4 Scale Change (0x100 to 0x300)
AD5322 8 10 µs 1/4 Scale to 3/4 Scale Change (0x400 to 0xC00) Slew Rate 0.7 V/µs Major-Code Transition Glitch Energy 12 nV-s 1 LSB Change around Major Carry (011 . . . 11 to 100 . . . 00) Digital Feedthrough 0.10 nV-s Analog Crosstalk 0.01 nV-s DAC-to-DAC Crosstalk 0.01 nV-s Multiplying Bandwidth 200 kHz V Total Harmonic Distortion –70 dB V
NOTES
1
Guaranteed by design and characterization, not production tested.
2
See Terminology section.
3
Temperature range: A, B Version: –40°C to +105°C.
Specifications subject to change without notice.
MIN
, T
1, 2, 3
MAX
(VDD = 2.5 V to 5.5 V; all specifications T

TIMING CHARACTERISTICS

Limit at T
= 2 V ± 0.1 V p-p, Unbuffered Mode
REF
= 2.5 V ± 0.1 V p-p, Frequency = 10 kHz
REF
to T
MIN
, unless otherwise noted.)
MAX
Parameter (A, B Version) Unit Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
NOTES
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
See Figure 1.
Specifications subject to change without notice.
33 ns min SCLK Cycle Time 13 ns min SCLK High Time 13 ns min SCLK Low Time 0 ns min SYNC to SCLK Active Edge Setup Time 5 ns min Data Setup Time
4.5 ns min Data Hold Time 0 ns min SCLK Falling Edge to SYNC Rising Edge 100 ns min Minimum SYNC High Time 20 ns min LDAC Pulse Width 20 ns min SCLK Falling Edge to LDAC Rising Edge
REV. A
SCLK
t
8
SYNC
DIN*
LDAC
LDAC
*SEE INPUT SHIFT REGISTER SECTION.
DB15
t
4
t
6
t
5
Figure 1. Serial Interface Timing Diagram
t
1
t
2
DB0
t
7
t
9
t
10
t
3
–3–
AD5302/AD5312/AD5322

ABSOLUTE MAXIMUM RATINGS

(TA = 25°C, unless otherwise noted.)
1, 2
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . . –0.3 V to V
V
OUT
A, V
B to GND . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
OUT
+ 0.3 V
DD
+ 0.3 V
DD
Operating Temperature Range
Industrial (A, B Version) . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (T
Max) . . . . . . . . . . . . . . . . . +150°C
J
10-Lead MSOP Package
Power Dissipation . . . . . . . . . . . . . . . . . . . . (T
Max–TA)/
J

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding
AD5302ARM –40°C to +105°C 10-Lead MSOP RM-10 D5A AD5302ARM-REEL7 –40°C to +105°C 10-Lead MSOP RM-10 D5A AD5312ARM –40°C to +105°C 10-Lead MSOP RM-10 D6A AD5312ARM-REEL7 –40°C to +105°C 10-Lead MSOP RM-10 D6A AD5322ARM –40°C to +105°C 10-Lead MSOP RM-10 D7A AD5322ARM-REEL7 –40°C to +105°C 10-Lead MSOP RM-10 D7A AD5302BRM –40°C to +105°C 10-Lead MSOP RM-10 D5B AD5302BRM-REEL –40°C to +105°C 10-Lead MSOP RM-10 D5B AD5302BRM-REEL7 –40°C to +105°C 10-Lead MSOP RM-10 D5B AD5312BRM –40°C to +105°C 10-Lead MSOP RM-10 D6B AD5312BRM-REEL –40°C to +105°C 10-Lead MSOP RM-10 D6B AD5312BRM-REEL7 –40°C to +105°C 10-Lead MSOP RM-10 D6B AD5322BRM –40°C to +105°C 10-Lead MSOP RM-10 D7B AD5322BRM-REEL –40°C to +105°C 10-Lead MSOP RM-10 D7B AD5322BRM-REEL7 –40°C to +105°C 10-Lead MSOP RM-10 D7B
JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44°C/W
JC
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma­nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
JA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5302/AD5312/AD5322 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION
LDAC
V
REF
V
REF
V
OUT
V
DD
B
A
A
1
2
AD5302/ AD5312/
3
AD5322
TOP VIEW
4
(Not to Scale)
5
10
GND
9
DIN
8
SCLK
7
SYNC
6
V
B
OUT
REV. A–4–
AD5302/AD5312/AD5322

PIN FUNCTION DESCRIPTIONS

Pin No. Mnemonic Function
1 LDAC Active Low Control Input that Transfers the Contents of the Input Registers to their Respective DAC
Registers. Pulsing this pin low allows either or both DAC registers to be updated if the input registers have new data. This allows simultaneous update of both DAC outputs.
2V
3V
4V
5V
6V
DD
BReference Input Pin for DAC B. This is the reference for DAC B. It may be configured as a buffered or
REF
AReference Input Pin for DAC A. This is the reference for DAC A. It may be configured as a buffered or
REF
ABuffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
BBuffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
7 SYNC Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes
8 SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
9DIN Serial Data Input. This device has a 16-bit input shift register. Data is clocked into the register on the
10 GND Ground Reference Point for All Circuitry on the Part.
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be decoupled to GND.
an unbuffered input, depending on the BUF bit in the control word of DAC B. It has an input range from 0 V to V
in unbuffered mode and from 1 V to VDD in buffered mode.
DD
an unbuffered input depending on the BUF bit in the control word of DAC A. It has an input range from 0 V to V
in unbuffered mode and from 1 V to VDD in buffered mode.
DD
low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in on the falling edges of the following 16 clocks. If SYNC is taken high before the 16th falling edge, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device.
input. Data can be transferred at rates up to 30 MHz. The SCLK input buffer is powered down after each write cycle.
falling edge of the serial clock input. The DIN input buffer is powered down after each write cycle.
TERMINOLOGY Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSB, from a straight line passing through the actual endpoints of the DAC transfer function. A typical INL versus code plot can be seen in TPC 1.

Differential Nonlinearity

Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. A typical DNL versus code plot can be seen in TPC 4.

Offset Error

This is a measure of the offset error of the DAC and the output amplifier. It is expressed as a percentage of the full-scale range.

Gain Error

This is a measure of the span error of the DAC. It is the devia­tion in slope of the actual DAC transfer characteristic from the ideal expressed as a percentage of the full-scale range.

Offset Error Drift

This is a measure of the change in offset error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.

Gain Error Drift

This is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.

Major-Code Transition Glitch Energy

Major-code transition glitch energy is the energy of the impulse injected into the analog output when the code in the DAC regis­ter changes state. It is normally specified as the area of the glitch in nV-secs and is measured when the digital code is changed by 1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00 or 100 . . . 00 to 011 . . . 11).

Digital Feedthrough

Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital input pins of the device, but is measured when the DAC is not being written to (SYNC held high). It is specified in nV-secs and is measured with a full-scale change on the digital input pins, i.e., from all 0s to all 1s and vice versa.

Analog Crosstalk

This is the glitch impulse transferred to the output of one DAC due to a change in the output of the other DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s and vice versa) while keeping LDAC high. Then pulse LDAC low and monitor the output of the DAC whose digital code was not changed. The area of the glitch is expressed in nV-secs.
REV. A
–5–
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