2.5 V to 5.5 V, 230 A Dual Rail-to-Rail,
Voltage Output 8-/10-/12-Bit DACs
FEATURES
AD5302: Two 8-Bit Buffered DACs in 1 Package
A Version: ⴞ1 LSB INL, B Version: ⴞ0.5 LSB INL
AD5312: Two 10-Bit Buffered DACs in 1 Package
A Version: ⴞ4 LSB INL, B Version: ⴞ2 LSB INL
AD5322: Two 12-Bit Buffered DACs in 1 Package
A Version: ⴞ16 LSB INL, B Version: ⴞ8 LSB INL
10-Lead MSOP Package
Micropower Operation: 300 A @ 5 V (Including
Reference Current)
Power-Down to 200 nA @ 5 V, 50 nA @ 3 V
2.5 V to 5.5 V Power Supply
Double-Buffered Input Logic
Guaranteed Monotonic by Design over All Codes
Buffered/Unbuffered Reference Input Options
0 V to V
Output Voltage
REF
Power-On-Reset to 0 V
Simultaneous Update of DAC Outputs via LDAC
Low Power Serial Interface with Schmitt-Triggered Inputs
On-Chip Rail-to-Rail Output Buffer Amplifiers
APPLICATIONS
Portable Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
AD5302/AD5312/AD5322
*
GENERAL DESCRIPTION
The AD5302/AD5312/AD5322 are dual 8-, 10-, and 12-bit buffered
voltage output DACs in a 10-lead MSOP package that operate from
a single 2.5 V to 5.5 V supply, consuming 230 µA at 3 V. Their
on-chip output amplifiers allow the outputs to swing rail-to-rail
with a slew rate of 0.7 V/µs. The AD5302/AD5312/AD5322
utilize a versatile 3-wire serial interface that operates at clock rates
up to 30 MHz and is compatible with standard SPI
®
, QSPI™,
MICROWIRE™, and DSP interface standards.
The references for the two DACs are derived from two reference
pins (one per DAC). The reference inputs may be configured as
buffered or unbuffered inputs. The outputs of both DACs may be
updated simultaneously using the asynchronous LDAC input. The
parts incorporate a power-on reset circuit, which ensures that the
DAC outputs power-up to 0 V and remain there until a valid write
takes place to the device. The parts contain a power-down feature
that reduces the current consumption of the devices to 200 nA at
5V (50 nA at 3 V) and provides software-selectable output loads
while in power-down mode.
The low power consumption of these parts in normal operation
makes them ideally suited to portable battery operated equipment.
The power consumption is 1.5 mW at 5 V, 0.7 mW at 3 V, reducing
to 1 µW in power-down mode.
FUNCTIONAL BLOCK DIAGRAM
V
DD
POWER-ON
RESET
REGISTER
SYNC
SCLK
DIN
*Patent Pending; protected by U.S. Patent No. 5684481.
INTERFACE
LOGIC
LDAC
REGISTER
INPUT
INPUT
DAC
REGISTER
DAC
REGISTER
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
Differential Nonlinearity±0.2± 1±0.2±1LSBGuaranteed Monotonic by Design over All Codes
Offset Error± 0.4± 3± 0.4± 3% of FSRSee Figures 2 and 3
Gain Error± 0.15± 1± 0.15± 1% of FSRSee Figures 2 and 3
Lower Deadband10601060mVSee Figures 2 and 3
Offset Error Drift
Gain Error Drift
Power Supply Rejection Ratio
DC Crosstalk
DAC REFERENCE INPUTS
VREF Input Range1V
5
5
5
5
5
–12–12ppm of FSR/°C
–5–5ppm of FSR/°C
–60–60dBVDD = ± 10%
3030µV
0.0010.001V minThis is a measure of the minimum and maximum
VDD – 0.001VDD – 0.001V maxdrive capability of the output amplifier.
DC Output Impedance0.50.5Ω
Short Circuit Current5050mAV
DD
= 5 V
2020mAVDD = 3 V
Power-Up Time2.52.5µsComing out of Power-Down Mode. V
DD
55µsComing out of Power-Down Mode. VDD = 3 V
LOGIC INPUTS
5
Input Current± 1± 1µA
, Input Low Voltage0.80.8VVDD = 5 V ± 10%
V
IL
0.60.6VVDD = 3 V ± 10%
, Input High Voltage2.42.4VVDD = 5 V ± 10%
0.50.5VV
V
IH
= 2.5 V
DD
2.12.1VVDD = 3 V ± 10%
2.02.0VV
= 2.5 V
DD
Pin Capacitance23.523.5pF
POWER REQUIREMENTS
V
DD
(Normal Mode)Both DACs active and excluding load currents
I
DD
= 4.5 V to 5.5 V300450300450µABoth DACs in unbuffered mode. VIH = VDD and
V
DD
VDD = 2.5 V to 3.6 V230350230350µAV
2.55.52.55.5VIDD specification is valid for all DAC Codes.
= GND. In buffered mode, extra current is
IL
typically x µA per DAC where x = 5 µA + V
(Full Power-Down)
I
DD
VDD = 4.5 V to 5.5 V0.210.21µA
VDD = 2.5 V to 3.6 V0.0510.051µA
NOTES
1
See Terminology section.
2
Temperature range: A, B Version: –40°C to +105°C.
3
DC specifications tested with the outputs unloaded.
4
Linearity is tested using a reduced code range: AD5302 (Code 8 to 248); AD5312 (Code 28 to 995); AD5322 (Code 115 to 3981).
5
Guaranteed by design and characterization, not production tested.
6
In order for the amplifier output to reach its minimum voltage, offset error must be negative. In order for the amplifier output to reach its maximum voltage,
V
= VDD and offset plus gain error must be positive.
REF
Specifications subject to change without notice.
= 5 V
REF/RDAC
.
REV. A–2–
AD5302/AD5312/AD5322
(VDD = 2.5 V to 5.5 V; RL = 2 k⍀ to GND; CL = 200 pF to GND; all specifications T
AC SPECIFICATIONS
Parameter
2
1
otherwise noted.)
A, B Version
MinTypMaxUnitConditions/Comments
3
Output Voltage Settling TimeV
= VDD = 5 V
REF
MIN
to T
, unless
MAX
AD530268µs1/4 Scale to 3/4 Scale Change (0x40 to 0xC0)
AD531279µs1/4 Scale to 3/4 Scale Change (0x100 to 0x300)
AD5322810µs1/4 Scale to 3/4 Scale Change (0x400 to 0xC00)
Slew Rate0.7V/µs
Major-Code Transition Glitch Energy12nV-s1 LSB Change around Major Carry (011 . . . 11 to 100 . . . 00)
Digital Feedthrough0.10nV-s
Analog Crosstalk0.01nV-s
DAC-to-DAC Crosstalk0.01nV-s
Multiplying Bandwidth200kHzV
Total Harmonic Distortion–70dBV
NOTES
1
Guaranteed by design and characterization, not production tested.
2
See Terminology section.
3
Temperature range: A, B Version: –40°C to +105°C.
Specifications subject to change without notice.
MIN
, T
1, 2, 3
MAX
(VDD = 2.5 V to 5.5 V; all specifications T
TIMING CHARACTERISTICS
Limit at T
= 2 V ± 0.1 V p-p, Unbuffered Mode
REF
= 2.5 V ± 0.1 V p-p, Frequency = 10 kHz
REF
to T
MIN
, unless otherwise noted.)
MAX
Parameter(A, B Version)UnitConditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
NOTES
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
See Figure 1.
Specifications subject to change without notice.
33ns minSCLK Cycle Time
13ns minSCLK High Time
13ns minSCLK Low Time
0ns minSYNC to SCLK Active Edge Setup Time
5ns minData Setup Time
4.5ns minData Hold Time
0ns minSCLK Falling Edge to SYNC Rising Edge
100ns minMinimum SYNC High Time
20ns minLDAC Pulse Width
20ns minSCLK Falling Edge to LDAC Rising Edge
REV. A
SCLK
t
8
SYNC
DIN*
LDAC
LDAC
*SEE INPUT SHIFT REGISTER SECTION.
DB15
t
4
t
6
t
5
Figure 1. Serial Interface Timing Diagram
t
1
t
2
DB0
t
7
t
9
t
10
t
3
–3–
AD5302/AD5312/AD5322
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C, unless otherwise noted.)
1, 2
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . . –0.3 V to V
V
OUT
A, V
B to GND . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
AD5302ARM–40°C to +105°C10-Lead MSOPRM-10D5A
AD5302ARM-REEL7–40°C to +105°C10-Lead MSOPRM-10D5A
AD5312ARM–40°C to +105°C10-Lead MSOPRM-10D6A
AD5312ARM-REEL7–40°C to +105°C10-Lead MSOPRM-10D6A
AD5322ARM–40°C to +105°C10-Lead MSOPRM-10D7A
AD5322ARM-REEL7–40°C to +105°C10-Lead MSOPRM-10D7A
AD5302BRM–40°C to +105°C10-Lead MSOPRM-10D5B
AD5302BRM-REEL–40°C to +105°C10-Lead MSOPRM-10D5B
AD5302BRM-REEL7–40°C to +105°C10-Lead MSOPRM-10D5B
AD5312BRM–40°C to +105°C10-Lead MSOPRM-10D6B
AD5312BRM-REEL–40°C to +105°C10-Lead MSOPRM-10D6B
AD5312BRM-REEL7–40°C to +105°C10-Lead MSOPRM-10D6B
AD5322BRM–40°C to +105°C10-Lead MSOPRM-10D7B
AD5322BRM-REEL–40°C to +105°C10-Lead MSOPRM-10D7B
AD5322BRM-REEL7–40°C to +105°C10-Lead MSOPRM-10D7B
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
JA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5302/AD5312/AD5322 feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATION
LDAC
V
REF
V
REF
V
OUT
V
DD
B
A
A
1
2
AD5302/
AD5312/
3
AD5322
TOP VIEW
4
(Not to Scale)
5
10
GND
9
DIN
8
SCLK
7
SYNC
6
V
B
OUT
REV. A–4–
AD5302/AD5312/AD5322
PIN FUNCTION DESCRIPTIONS
Pin No.MnemonicFunction
1LDACActive Low Control Input that Transfers the Contents of the Input Registers to their Respective DAC
Registers. Pulsing this pin low allows either or both DAC registers to be updated if the input registers
have new data. This allows simultaneous update of both DAC outputs.
2V
3V
4V
5V
6V
DD
BReference Input Pin for DAC B. This is the reference for DAC B. It may be configured as a buffered or
REF
AReference Input Pin for DAC A. This is the reference for DAC A. It may be configured as a buffered or
REF
ABuffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
BBuffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
7SYNCActive Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes
8SCLKSerial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
9DINSerial Data Input. This device has a 16-bit input shift register. Data is clocked into the register on the
10GNDGround Reference Point for All Circuitry on the Part.
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be
decoupled to GND.
an unbuffered input, depending on the BUF bit in the control word of DAC B. It has an input range
from 0 V to V
in unbuffered mode and from 1 V to VDD in buffered mode.
DD
an unbuffered input depending on the BUF bit in the control word of DAC A. It has an input range from
0 V to V
in unbuffered mode and from 1 V to VDD in buffered mode.
DD
low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in
on the falling edges of the following 16 clocks. If SYNC is taken high before the 16th falling edge, the
rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device.
input. Data can be transferred at rates up to 30 MHz. The SCLK input buffer is powered down after
each write cycle.
falling edge of the serial clock input. The DIN input buffer is powered down after each write cycle.
TERMINOLOGY
Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is
a measure of the maximum deviation, in LSB, from a straight
line passing through the actual endpoints of the DAC transfer
function. A typical INL versus code plot can be seen in TPC 1.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed
monotonic by design. A typical DNL versus code plot can be
seen in TPC 4.
Offset Error
This is a measure of the offset error of the DAC and the output
amplifier. It is expressed as a percentage of the full-scale range.
Gain Error
This is a measure of the span error of the DAC. It is the deviation in slope of the actual DAC transfer characteristic from the
ideal expressed as a percentage of the full-scale range.
Offset Error Drift
This is a measure of the change in offset error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Gain Error Drift
This is a measure of the change in gain error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Major-Code Transition Glitch Energy
Major-code transition glitch energy is the energy of the impulse
injected into the analog output when the code in the DAC register changes state. It is normally specified as the area of the glitch
in nV-secs and is measured when the digital code is changed by
1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00 or
100 . . . 00 to 011 . . . 11).
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the
analog output of the DAC from the digital input pins of the
device, but is measured when the DAC is not being written to
(SYNC held high). It is specified in nV-secs and is measured
with a full-scale change on the digital input pins, i.e., from all 0s
to all 1s and vice versa.
Analog Crosstalk
This is the glitch impulse transferred to the output of one DAC
due to a change in the output of the other DAC. It is measured
by loading one of the input registers with a full-scale code
change (all 0s to all 1s and vice versa) while keeping LDAC
high. Then pulse LDAC low and monitor the output of the
DAC whose digital code was not changed. The area of the glitch
is expressed in nV-secs.
REV. A
–5–
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