To prevent fire or shock hazard, do
not expose the unit to rain on
moisture.
To avoid electrical shock, do not
open the cabinet. Refer servicing to
qualified personnel only.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
This appliance is classified as a
CLASS 1 LASER product.
The CLASS 1 LASER
PRODUCT MARKING is
located on the rear exterior.
The following caution label is
located inside of the unit.
1. GENERAL
Location and Function of Controls .................................... 3
7. ELECTRICAL PARTS LIST ........................................ 29
MODEL IDENTIFICATION
COMPACT DISC PLAYER
SERIAL NO.
MADE IN JAPAN
AEP, UK model :
AC : 220–230V
E model :
AC : 110–120V, 220–240V
MODEL NO.
⁄50/60Hz 10W
CDP-M205
CDP-M305
⁄ Adjustable 50/60Hz 10W
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
MARK
! ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
! OR DO TTED LINE WITH
– 2 –
LOCATION AND FUNCTION OF CONTROLS
Front Panel
123456!§78
!∞!¢!£!™!¡09
SECTION 1
GENERAL
This section is extracted from
instruction manual.
1 POWER switch
2 CONTINUE button
3 SHUFFLE button
4 PROGRAM button
5 DISK tray
6 OPEN/CLOSE button
7 0/) (MANUAL SEARCH) buttons
9 =/+(AMS : AUTOMATIC MUSIC SENSOR) buttons
0 ((PLAY) button
!¡ REPEAT button
!™ TIME button
!£ >10 (OVER 10) button
!¢ NUMBER buttons
!∞ CONTINUE button
– 3 –
SECTION 2
SERVICING NOTE
HOW TO OPEN THE DISC TRAY WHEN POWER SWITCH TURNS OFF
1
Turn in the direction of the arrow
Caution : When you work, keep the set horizontal.
– 4 –
SECTION 3
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
3-1. PANEL, FRONT REMOVAL
5
Panel, Front
6
5
Panel, Loading
4
T wo screws
(+BVTP 3x8TYPE2 N-S)
3-2. CD MECHANISM SECTION REMOVAL
1
Three screws
(+BVTP 3x8 TYPE2 N-S)
3
Wire (Flat type)
(21core)
2
2
1
Turn in the direction
of the arrow
(Refer to page 4)
CD mechanism section
CN151 (5P)
3
Chassis assy
4
– 5 –
Wire (Flat type) (19 core)
SECTION 4
ELECTRICAL ADJUSTMENTS
CD SECTION
Note:
1. CD Block is basically constructed to operate without adjustment.
Therefore, check each item in order given.
2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10M impedance.
4. Clean the object lens by an applicator with neutral detergent when
the signal level is low than specified value with the following
checks.
S Curve Check
oscilloscope
BD board
TP (FEO)
TP (VC)
Procedure :
1. Connect oscilloscope to test point TP (FEO).
2. Connect between test point TP (FOK) and Ground by lead wire.
3. Turn Power switch on.
4. Put disc (YEDS-18) in and turned Power switch on again and
actuate the focus search. (actuate the focus search when disc
table is moving in and out.)
5. Check the oscilloscope waveform (S-curve) is symmetrical between A and B. And confirm peak to peak le vel within 3 ± 1Vp-p.
S-curve waveform
symmetry
E-F Balance (1 Track Jump) check
oscilloscope
BD board
TP (TEO)
TP (VC)
Procedure:
1. Connect oscilloscope to test point TP (TEO) on BD board.
2. Turned Power switch on.
3. Put disc (YEDS-18) in to play the number five track.
4. Press the “P (Pause)” button.
5. Check the level B of the oscilloscope's wa veform and the A (DC
voltage) of the center of the Tr averse waveform.
Confirm the following:
• A/B x 100 = less than ± 7 (%)
1 track jump waveform
Center of the waveform
B
A (DC voitage)
0V
A
within 3 ± 1 Vp-p
B
6. After check, remove the lead wire connected in step 2.
Note: • T ry to measure sev eral times to make sure than the ratio of
A : B or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the brightness to obtain best waveform.
RF Level Check
oscilloscope
BD board
TP (RF)
TP (VC)
Procedure :
1. Connect oscilloscope to test point TP (RF) on BD board.
2. Turned Power switch on.
3. Put disc (YEDS-18) in and playback.
4. Confirm that oscilloscope waveform is clear and check RF signal level is correct or not.
Note: Clear RF signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
3FDFCTICapacitor connection pin for defect time constant.
4FGDIGround this pin through a capacitor for cutting the focus servo high-frequency gain.
5FLBIExternal time constant setting pin for boosting the focus servo low-frequency.
6FE OOFocus drive output.
7FE MIFocus amplifier inverted input.
8SRCHIExternal time constant setting pin for generating focus search waveform.
9TGUIExternal time constant setting pin for switching tracking high-frequency gain.
10TG2IExternal time constant setting pin for switching tracking high-frequency gain.
11FSETIPeak frequency setting pin for focus and tracking phase compensation amplifier.
12TA MITracking amplifier inverted input.
13TA OOTracking drive output.
14SL PISled amplifier non-inverted input.
15SL MISled amplifier inverted input.
16SL OOSled drive output.
17ISETI
18VCCIPositive power supply.
19LOCKIThe sled overrun prevention circuit operates when this pin is Low (No pull-up resistance).
20CLKISerial data transfer clock input from CPU (No pull-up resistance).
21XLTILach input from CPU (No pull-up resistance).
22DATAISerial data input from CPU (No pull-up resistance).
23XRSTIReset input; resets at Low (No pull-up resistance).
24C.OUTOTrack number count signal output.
25SENS1O
26SENS2O
27FOKOFocus OK comparator output.
28CC2IInput for the defect bottom hold output with capacitance coupled.
29CC1O
30CBIConnection pin for defect bottom hold capacitor.
31CPI
32RF IIInput for the RF summing amplifier output with capacitance coupled.
33RF OO
34RF MI
35RFTCIExternal time constant setting pin during RF level control.
36LDOAPC amplifier output.
37PDIAPC amplifier input.
38PD1IRF I-V amplifier inverted input.
39PD2IConnect these pins to the photo diode A+C and B+D pins.
40FE BIASI
Focus error amplifier output.
Connected internally to the window comparator input for bias adjustment.
Connect an external capacitance to set the current which determines the Focus search,
Track jump, and Sled kick heights.
Outputs FZC, DFCT1, TZC, BALH, TGH, FOH, ATSC, and others according to the
command from CPU.
Outputs DFCT2, MIRR, BALL, TGL, FOL,and others according to the command from
CPU.
Defect bottom hold output
Connected internally to the interruption comparator input.
Connection pin for MIRR hold capacitor
MIRR comparator non-inverted input.
RF summing amplifier output
Eye-pattern check point.
RF summing amplifier inverted input.
The RF amplifier gain is determined by the resistance connected between this pin and
RFO pin .
Bias adjustment of focus error amplifier
Leave this pin open for automatic adjustment (not used).
– 7 –
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