Package Type
QW : WQFN-24L 4x4 (W-Type)
(Exposed Pad-Option 1)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
Function Pin Description
Marking Information
0P= : Product Code
0P=YM
YMDNN : Date Code
DNN
Pin Configurations
(TOP VIEW)
PVCC
LGATE1
PWM3
LGATE2
21 20 19242223
GND
25
TON
VREF
VSNS
RGND
WQFN-24L 4x4
BOOT1
UGATE1
EN
PSI
VID
REFADJ
PHASE1
1
2
3
4
5
6
78910 1211
REFIN
PHASE2
18
BOOT2
17
UGATE2
16
PGOOD
15
VCC/ISEN1
14
TALERT/ISEN2
13
TSNS/ISEN3
SS
Pin No. Pin Name Pin Function
1 BOOT1 Bootstrap Suppl y for PWM 1. This pin powers the high side MOSFE T driver.
2 UGATE1
High Side Gate Driver of PWM 1. This pin prov ides the gate drive for the converter's
high side MOSFET. Connect this pin to the Gate of high s ide MOSFET.
3 EN Enable Contro l I nput. Active hig h input.
Power Saving Interface. When the voltage is pulled below 0.8V, the device will operate
4 PSI
into 1 phase DEM. When the voltage is bet ween 1.2V to 1.8V, the dev ice will operate
into 1 phase f orce CCM. W hen t he voltage is between 2.4V to 5 .5V, the device will
operate into active phase force CCM (only for 2 or 3 phase).
5 VID
Programming Output Voltage Contr ol Input. Ref er to PWM-VID Dynamic Voltage
Control .
6 REFADJ Refere nce Ad justment Output. Refer t o PWM-VID Dynamic Voltage Contro l.
7 REF IN External Reference Input.
8 VREF
9 TON
Refere nce Voltage Output. This is a high precision voltage refere nce (2V ) from VREF
pin to RGND pi n.
On-Time/ Switching Freq uency Adjustment Input. Connect a 100pF capacito r between
C
and gr ound is optional for noise imm unity enhancem ent.
TON
10 RGND Negative Remote Sense Input. Connect this pin to the ground of output lo ad.
11 V SNS Positive Remote Sense Input. Connect t his pin to the positive terminal of output load.
12 SS
Soft-Start Time Sett in g. Connect an ext erna l capacitor to adjust soft -start time.
When the ex ternal capacitor is remove d, t he i nt ernal soft-start function will be chose.
TSNS Temperatu re Sensing Inp ut f or 2/1 Phase Operati on.
13
ISEN3 Phase 3 Current Sense Inp ut f or 3 Phase Operation.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
16 PGOOD Power Good Indicator Output. Active high open drain output.
17 UGATE2
18 BOOT2 Bootstrap Supply for of PWM 2. This pin powers the high side MOSFET driver.
19 PHASE2
20 LG ATE2
21 PVCC
22 PW M 3
23 LG ATE1
24 PHASE1
25 (Exposed Pad) GND
TALERT
ISEN2 Phase 2 Current Sense Input for 3 Phase Operation.
VCC Supply Voltage Input for 2/1 Phase Operation. (Connect to PVCC)
ISEN1 Phase 1 Current Sense Input for 3 Phase Operation. (Connect to PHASE1)
Thermal Alert. Active low open drain output for 2/1 Phase Operation.
High Side Gate Driver of PWM 2. This pin provides the gate drive for the
converter's high side MOSFET. Connect this pin to the Gate of high side
MOS FET.
Switch Node for PWM2. This pin is return node of the high side driver of PWM
2. Connect this pin to the Source of high side MOSFET together with the Drain
of low side MOSFET and the inductor.
Low Side Gate Driver of PWM 2. This pin provides the gate drive for the
converter's low side MOSFET. Connect this pin to the Gate of low side
MOS FET.
Supply Voltage Input. Connect this pin to a 5V bias supply. Place a high quality
bypass capacitor from this pin to GND.
Third Phase PWM Control Signal Output to Driver for 3 Phase Operation. In 2/1
Phase Operation, this pin is high impedance.
Low Side Gate Driver of PWM 1. This pin provides the gate drive for the
converter's low side MOSFET. Connect this pin to the Gate of low side
MOS FET.
Switch Node for PWM1. This pin is return node of the high side driver of PWM
1. Connect this pin to the Source of high side MOSFET together with the Drain
of low side MOSFET and the inductor.
Ground. The Exposed pad should be soldered to a large PCB and connected to
GND for maximum thermal dissipation.
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θ
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Not production tested. Test condition is V
is measured at T
JA
measured at the exposed pad of the package.
R
PVCC to BOOTx, I
BOOT
= 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
A
= 8V, V
IN
OUT
= 1V, I
= 10mA -- 40 80
BOOT
= 20A using application circuit.
OUT
Copyright 2013 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.