Nokia 2100 Service Manual

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Customer Care Europe, Middle East & Africa NAM-2 Repair Hints SCCE Training Group 2100 Version 1.0 2003 Nokia Mobile Phones
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Repair Hints
Service-Level 3 & 4
2100
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Customer Care Europe, Middle East & Africa NAM-2 Repair Hints SCCE Training Group 2100 Version 1.0 2003 Nokia Mobile Phones
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GENERAL
-How to use this document
Put the colored schematics behind this manual. Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components and measuring points.
-Component characteristics
Some components contain important data such as tuning values or security data; therefore several steps described are only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain cases. Please pay attention to separate notes.
-Broken balls / underfill, µBGAs
All replaceable (not underfilled) µBGA components must be renewed after removing. Reflow with uncontrolled hot-air fan is strictly forbidden! It is also not recommended only to reflow the old µBGA using a µBGA rework station! must only be soldered with NMP approved µBGA rework machines (e.g. Zevac/ OK-Metcal/ Martin) to get durable soldering joints. After removing a µBGA check soldering points; if necessary rework oxidated solderings (broken balls) carefully by tinplating these areas with few flux and a hot soldering iron. Before placing a new component remove the tin and clean the PCB; e.g. with help of solder wick and flux cleaner such as “Kontakt LR”. Use only recommended fluxtype and an appropriate amount of it – avoid drowning the PCB in flux as this will result in additional faults! Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair actions as the phone probably was exposed to strong mechanical stress.
“Rework” done with uncontrolled hot air PCB drowned in flux oxidated soldering
µBGA
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-PWB handling & cleaning
To avoid damages of PWB and/ or components through electrostatic discharging, handle the module in ESD protected area. When handling PCBs outside an ESD-bag always wear ESD-bracelets, which must be connected to earth bonding point. Damage by electrostatic discharge often leads to a module not failing directly but in a short period of time! For cleaning use only appropriate materials, do not use scratching or rubbing tools. Useful tools for cleaning are flux cleaners such as “Kontakt LR” or “Electrolube FLU” in connection with ionized compressed air.
-Shieldings, screw torques
To avoid RF-problems it is not allowed to reuse any shielding that once has been removed from PWB. Always use new shieldings after successful repair! To disassemble the phone, use a Torx T6 Plus screwdriver. Unscrew the 6 screws in the order shown in the picture below. To assemble the phone, use the reverse order and torque of 17Ncm.
Disassembling (1-6) and assembling (6-1) order
-Realign after repair
Characteristics of replacement parts may vary. To prevent additional faults after repair (e.g. low standby time, losing network etc.) it is necessary to retune phone values after repair; but never try to cover up a fault by justing the phone settings!
-Fault report in fault log (Phoenix)
It is very important to report all repaired failures in fault log after finishing the complete phone repair. The report content should only In this case the report content should contain the symptom code that is given from the customer e.g “Does not switch on”(2101) and the fault code“no fault found”(470). If the symptom code from the customer is not the same as the observed symptom, use always the self-observed symptom code.
contain the self-observed fault symptom, except “no fault found”.
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ESD PROTECTION REQUIREMENTS

Electrostatic discharge can easily damage the sensitive components of electronic products. Therefore, every Service Partner has to take of at least some precautions, such as ESD restricted area, floor, table, covering, chair(s), shoes or wrist bands.
For further information refer to the Partner Web Site document
“Service Partner Requirements”
example configuration of an epa-area
source: www.armeka.com
example workbench and testers
source: http://www.armekaengineering.com
example configuration of a workbench
source: www.warmbier.com
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Customer Care Europe, Middle East & Africa NAM-2 Repair Hints SCCE Training Group 2100 Version 1.0 2003 Nokia Mobile Phones
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INTRODUCTION

IMPORTANT:
This document is intended for use by authorized NOKIA service centers only.
The purpose of this document is to provide some further service information for NOKIA 2100 phones. It contains a lot of collected tips and hints to find faults and repair solutions easily. It also will give support to inexperienced technicians. Saving process time and improving the repair quality is the aim of this document. It is built up based on fault symptoms (listed in "Contents"), followed by detailed description for further analysis. The document is to be used additionally to the service manual and other service information such as Service Bulletins. For that reason it does not contain any circuit or schematic diagrams.
All measurements are made using following equipment:
Nokia repair SW: WINTESLA Version 6.46.004
MCU SW: 5.11
Nokia module jig: MJS - 9
Digital multimeter: Fluke 73
Oscilloscope: Fluke PM 3380A/B
Spectrum Analyzer: Advantest R3131 with an analog probe
RF-Generator / GSM Tester: Rohde & Schwarz CMU 200
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If the reader finds any errors, NOKIA should be notified in writing, using the following procedure:
Please state: title of the document + issue number/date of publication. page(s) and/or figure(s) in error.
Please send to: Nokia GmbH Service & Competence Center Europe Meesmannstr.103 D-44807 Bochum / Germany Email: training.sace@nokia.com
Copyright © Nokia Mobile Phones This material, including documentation and any related computer programs is protected by copyright, controlled by Nokia Mobile Phones. All rights are reserved. Copying, including reproducing, modifying, storing, adapting or translating any or all of this material requires the prior written consent of Nokia Mobile Phones. This material also contains confidential information, which may not be disclosed to others without the prior written consent of Nokia Mobile Phones.
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Contents
PREFACE
Introduction 5
Repair information 7
Phone hangs up when sending SMS (O-Code: O110) 7 Phone locks up, reboots or does not respond (O-Code: O901) 7
Flash update is not possible 8
Different typs of display failures 9
Change history 11
General 2
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Phone hangs up when sending SMS (O-Code: O110)
Pre-check:
Take the phone, insert a SIM card and try to send an SMS through network.
o If the phone hangs up while sending an SMS, follow repair instructions:
“Phone hangs up when sending SMS”
Phone hangs up when sending SMS (O-Code: O110)
While sending, reading or handling of SMS the phone locks up or hangs up, try to flash the phone with the latest SW version.
o If an error message from the flash prommer is shown, follow repair instructions:
“Flash update is not possible”
Phone locks up, reboots or does not respond (O-Code: O901)
Pre-check:
Take the phone, insert a SIM card and go through the menu.
o If the phone reboots, follow repair instructions:
“Phone locks up, reboots or does not respond (O-Code: O901)”
Phone locks up, reboot or no respond (O-Code: O901)
If the phone locks up after a while or does not respond, reboot or restart without asking for PIN code when starting an application, (e.g. a game or the organizer), try to flash the phone with the latest SW version.
o If an error message from the flash prommer is shown, follow repair instructions:
“Flash update is not possible”
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Flash update is not possible
Pre-check:
-Try to flash the phone. o If “MCU boot failure, serial clock-/ dataline failure” appears from prommer box,
follow repair instructions:
“Flash update not possible”
Flash update is not possible
First of all disable watchdog by connecting R118 to ground, and try to update again. If fault remains, check the following:
- Check VBB 2.8VDC at C107
- Check VCORE 1.7VDC at C140
- Check VXO 2.8VDC at C152
- Check SLEEPX 2.8VDC at J226 and PURX 2.8VDC at J227
- Check 13MHz system clock at C213, 1Vpp sinewave
If only one of the above mentioned signals is not measurable, in all probability CCONT N100 is faulty, but not changeable due to underfilling.
In case that all above mentioned signals are ok but fault persists; check MBUS/FBUS-lines for shorts to ground:
- check MBUS-line (J103) to GND: ~ 50k Ohm
- check FBUS_RX-line (J102) to GND: ~ 220k Ohm
- check FBUS_TX-line (J101) to GND: ~ 70k Ohm
To ensure function also check resistors R109, R201, R203 and R215. If these parts are ok but SW-update still is not possible, in all probability MAD D200 is faulty, but not changeable due to underfilling.
If “Algorithm code fail / alias ID missing” is the failure message during flashing update your prommerbox, and try to flash the phone again. If fault persists even though the prommerbox has been updated, in all probability combo memory is faulty. Save phone data if possible, exchange D210 with µBGA rework station, and try to perform SW-update once more.
In case of failure message “External RAM failure” in all probability combo memory D210 is faulty. Exchange D210 with help of µBGA rework station and try to flash the phone again. Remember that it is necessary to rewrite phone data and perform baseband/RF-tunings after changing D210!
Note that you have to rewrite IMEI and SIM lock data. Furthermore you have to run all RX/TX­tunnings and energy management calibration after changing combo memory (D210).
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Different typs of diplay failures
On the following pages is shown how to use global sympton codes in connection with display failures for Nokia 2100. This document shows how the display failures are looking like.
Segments missing Symptom code: 2214
Fading Sympton code: 2215
Black shadow is also a kind of contrast problem Symptom code: 2216
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Contrast problem Symptom code: 2216
Backlight Symptom code: 2219
Missing LED or even all brightness, color not identical. In this case change the faulty LED, not the display modul.
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CHANGE HISTORY
Originator Status Version Date Comment
TS Training Group
TS Training Group
Draft
Approved
0.1
1.0
19.05.2003
28.05.2003
First draft version for the repair group
First approved version
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