Nokia 2100 Service Manual

Customer Care Europe, Middle East & Africa NAM-2 Repair Hints
SCCE Training Group 2100 Version 1.0
 2003 Nokia Mobile Phones

CONFIDENTIAL

28/05/2003

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Repair Hints

Service-Level 3 & 4

2100

© NMP 2003

NAM-2

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Customer Care Europe, Middle East & Africa NAM-2 Repair Hints
SCCE Training Group 2100 Version 1.0
 2003 Nokia Mobile Phones

28/05/2003

GENERAL

-How to use this document

Put the colored schematics behind this manual.
Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components
and measuring points.

-Component characteristics

Some components contain important data such as tuning values or security data; therefore several steps described are
only feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain cases. Please pay
attention to separate notes.

-Broken balls / underfill, µBGAs

All replaceable (not underfilled) µBGA components must be renewed after removing. Reflow with uncontrolled hot-air
fan is strictly forbidden! It is also not recommended only to reflow the old µBGA using a µBGA rework station!
must only be soldered with NMP approved µBGA rework machines (e.g. Zevac/ OK-Metcal/ Martin) to get durable
soldering joints.
After removing a µBGA check soldering points; if necessary rework oxidated solderings (broken balls) carefully by
tinplating these areas with few flux and a hot soldering iron. Before placing a new component remove the tin and
clean the PCB; e.g. with help of solder wick and flux cleaner such as “Kontakt LR”.
Use only recommended fluxtype and an appropriate amount of it – avoid drowning the PCB in flux as this will result in
additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair actions as
the phone probably was exposed to strong mechanical stress.

“Rework” done with uncontrolled hot air PCB drowned in flux oxidated soldering

µBGA

© NMP 2003

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Customer Care Europe, Middle East & Africa NAM-2 Repair Hints
SCCE Training Group 2100 Version 1.0
 2003 Nokia Mobile Phones

28/05/2003

-PWB handling & cleaning

To avoid damages of PWB and/ or components through electrostatic discharging, handle the module in
ESD protected area. When handling PCBs outside an ESD-bag always wear ESD-bracelets, which must be connected to
earth bonding point. Damage by electrostatic discharge often leads to a module not failing directly but in a short
period of time!
For cleaning use only appropriate materials, do not use scratching or rubbing tools. Useful tools for cleaning are flux
cleaners such as “Kontakt LR” or “Electrolube FLU” in connection with ionized compressed air.

-Shieldings, screw torques

To avoid RF-problems it is not allowed to reuse any shielding that once has been removed from PWB.
Always use new shieldings after successful repair!
To disassemble the phone, use a Torx T6 Plus screwdriver. Unscrew the 6 screws in the order shown in the picture
below. To assemble the phone, use the reverse order and torque of 17Ncm.

Disassembling (1-6) and assembling (6-1) order

-Realign after repair

Characteristics of replacement parts may vary.
To prevent additional faults after repair (e.g. low standby time, losing network etc.) it is necessary to retune phone
values after repair; but never try to cover up a fault by justing the phone settings!

-Fault report in fault log (Phoenix)

It is very important to report all repaired failures in fault log after finishing the complete phone repair.
The report content should only
In this case the report content should contain the symptom code that is given from the customer
e.g “Does not switch on”(2101) and the fault code“no fault found”(470).
If the symptom code from the customer is not the same as the observed symptom, use always the self-observed
symptom code.

contain the self-observed fault symptom, except “no fault found”.

© NMP 2003

Checked by:

SCCE Training Group

Approved by:
CC Europe, Middle East & Africa

Customer Care Europe, Middle East & Africa NAM-2 Repair Hints
SCCE Training Group 2100 Version 1.0
 2003 Nokia Mobile Phones

CONFIDENTIAL

28/05/2003

4 (11)

ESD PROTECTION REQUIREMENTS

Electrostatic discharge can easily damage the sensitive components
of electronic products. Therefore, every Service Partner has to take of
at least some precautions, such as ESD restricted area, floor, table,
covering, chair(s), shoes or wrist bands.

For further information refer to the Partner Web Site document

“Service Partner Requirements”

example configuration of an epa-area

source: www.armeka.com

example workbench and testers

source: http://www.armekaengineering.com

example configuration of a workbench

source: www.warmbier.com

© NMP 2003

Checked by:

SCCE Training Group

Approved by:
CC Europe, Middle East & Africa