Microsemi Corporation SMBG5343B, SMBG5344B, SMBG5345B, SMBG5346B, SMBG5347B Datasheet
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8700 E. Thomas Road
Scottsdale, AZ 85252
Tel: (480) 941-6300
Fax: (480) 947-1503
Features
∙Low profile package for surface mounting (flat handling surface for accurate placement)
∙Zener Voltage 3.3V to 200V
∙High Surge Current Capability
∙For available tolerances – see note 1
∙Available on Tape and Reel (see EIA std RS-481)
Mechanical Data
∙Standard JEDEC outlines as shown
∙Terminals gull-wing or c-bend (modified J-bend) tin-lead plated and solderable per MIL-STD-750, method 2026
∙Polarity is indicated by cathode band
∙Maximum temperature for soldering: 260oC for 10 seconds.
Maximum Ratings @ 25 oC Unless Otherwise Specified
Forward Voltage at 1.0A |
VF |
1.2 Volts |
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Current |
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Steady State Power |
P(AV) |
5 Watts |
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See note 2 |
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Dissipation |
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Operating and Storage |
TJ, TSTG |
-65oC to |
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+ 150oC |
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Temperatures |
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Thermal Resistance |
RθJL |
25oC/W |
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Notes
1.Mounted on copper pads as shown below.
2.Lead temperature at 25oC = TL at mounting plane. Derate linearly above 25oC to zero power at 150 oC
SMBG5333B thru SMBG5388B and
SMBJ5333B thru SMBJ5388B
5 Watt
Surface Mount
Silicon
Zener Diodes
Pad Layout
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Gull Wing |
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Modified J-Bend |
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0.150 |
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0.089 |
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0.085
Datasheet# MSC0302A
Date: 06/26/97
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