Microsemi Corporation SG1626J, SG1626J-883B, SG1626J-DESC, SG1626L-883B, SG1626R Datasheet

SG1626/SG2626/SG3626

DUAL HIGH SPEED DRIVER

DESCRIPTION

FEATURES

The SG1626, 2626, 3626 is a dual inverting monolithic high speed driver that is pin for pin compatible with the DS0026, TSC426 and ICL7667. This device utilizes high voltage Schottky logic to convert TTL signals to high speed outputs up to 18V. The totem pole outputs have 3A peak current capability, which enables them to drive 1000pF loads in typically less than 25ns. These speeds make it ideal for driving power MOSFETs and other large capacitive loads requiring high speed switching.

In addition to the standard packages, Silicon General offers the 16 pin S.O.I.C. (DW-package) for commercial and industrial applications, and the Hermetic TO-66 (R-package) for military use. These packages offer improved thermal performance for applications requiring high frequencies and/or high peak currents.

∙Pin for pin compatible with DS0026, TSC426 and ICL7667.

∙Totem pole outputs with 3.0A peak current capability.

∙Supply voltage to 22V.

∙Rise and fall times less than 25ns.

∙Propagation delays less than 20ns.

∙Inverting high-speed high-voltage Schottky logic.

∙Efficient operation at high frequency.

∙Available in:

8 Pin Plastic and Ceramic DIP

14 Pin Ceramic DIP

16 Pin Plastic S.O.I.C.

20 Pin LCC

TO-99

TO-66

HIGH RELIABILITY FEATURES - SG1626

♦Available to MIL-STD-883

♦Radiation data available

♦LMI level"S" processing available

EQUIVALENT CIRCUIT SCHEMATIC

VCC

6.5V

VREG

2.5K

3K

INV. INPUT	OUTPUT

GND

9/91 Rev 1.1 2/94

LINFINITY Microelectronics Inc.

Copyright ã 1994	11861 Western Avenue ∞ Garden Grove, CA 92841
1	[phone] ∞ FAX: [phone]

SG1626/SG2626/SG3626

	ABSOLUTE MAXIMUM RATINGS (Note 1)
	Supply Voltage (VCC) ...........................................................			22V	Operating Junction Temperature					150°C
	Logic Input Voltage ...............................................................			7V	Hermetic (J, T, Y, R-Packages) ...................................
	Source/Sink Output Current (Each Output)			±0.5A	Plastic (M, DW, L-Packages)	.......................................				150°C
	Continuous ...................................................................				Storage Temperature Range ............................				-65°C to 150°C
	Pulse, 500ns ................................................................			±3.0A	Lead Temperature (Soldering, 10 Seconds) ...................					300°C
	Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect to ground. All currents are positive into the
	specified terminal.
	THERMAL DATA
	J Package:
	Thermal Resistance-Junction to Case, θJC ..................			30°C/W	R Package:
	Thermal Resistance-Junction to Ambient, θ	JA ..............		80°C/W	Thermal Resistance-Junction to Case, θJC .................					5.0°C/W
	Y Package:				Thermal Resistance-Junction to Ambient, θJA					40°C/W
	Thermal Resistance-Junction to Case, θJC ..................			50°C/W	L Package:
	Thermal Resistance-Junction to Ambient, θ	JA ............		130°C/W	Thermal Resistance-Junction to Case, θJC ..................					35°C/W
	M Package:				Thermal Resistance-Junction to Ambient, θJA					120°C/W
	Thermal Resistance-Junction to Case, θJC ..................			60°C/W	Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).
	Thermal Resistance-Junction to Ambient, θJA			95°C/W
					Note B. The above numbers for θJC are maximums for the limiting
	DW Package:
	Thermal Resistance-Junction to Case, θJC			40°C/W	thermal resistance of the package in a standard mount-
					ing configuration. The	θJA numbers are meant to be
	Thermal Resistance-Junction to Ambient, θJA			95°C/W
					guidelines for the thermal performance of the device/pc-
	T Package:
					board system. All of the above assume no ambient
	Thermal Resistance-Junction to Case, θJC			25°C/W
					airflow.
	Thermal Resistance-Junction to Ambient, θJA			130°C/W
	RECOMMENDED OPERATING CONDITIONS (Note 2)
	Supply Voltage (VCC) ..................................	4.5V to 20V (Note 3)			Operating Ambient Temperature Range (TJ)				-55°C to 125°C
	Frequency Range ...............................................			DC to 1.5MHz	SG1626 .........................................................
	Peak Pulse Current ............................................................			±3A	SG2626 ...........................................................				-25°C to 85°C
	Logic Input Voltage ................................................			-0.5 to 5.5V	SG3626 ..............................................................				0°C to 70°C
	Note 2. Range over which the device is functional.
	Note 3. AC performance has been optimized for VCC = 8V to 20V.
	ELECTRICAL CHARACTERISTICS
	(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1626 with -55°C ≤ TA ≤ 125°C, SG2626 with -
	25°C ≤ TA ≤ 85°C, SG3626 with 0°C ≤ TA ≤ 70°C, and VCC = 20V. Low duty cycle pulse testing techniques are used which maintains junction and case
	temperatures equal to the ambient temperature.)
	Parameter				Test Conditions		SG1626/2626/3626			Units
							Min.	Typ.	Max.
	Static Characteristics
	Logic 1 Input Voltage						2.0			V
	Logic 0 Input Voltage								0.7	V
	Input High Current			VIN = 2.4V					500	μA
	Input High Current			VIN = 5.5V					1.0	mA
	Input Low Current			VIN = 0V					-4	mA
	Input Clamp Voltage			IIN = -10mA					-1.5	V
	Output High Voltage (Note 4)			IOUT = -200mA			VCC-3			V
	Output Low Voltage (Note 4)			IOUT = 200mA					1.0	V
	Supply Current Outputs Low			VIN = 2.4V (both inputs)				18	27	mA
	Supply Current Outputs High			VIN = 0V (both inputs)				7.5	12	mA
	Note 4. VCC = 10V to 20V.
9/91 Rev 1.1 2/94							LINFINITY		Microelectronics Inc.

Copyright ã 1994	11861 Western Avenue ∞ Garden Grove, CA 92841
2	[phone] ∞ FAX: [phone]

SG1626/SG2626/SG3626

ELECTRICAL CHARACTERISTICS (continued)

		SG1626/2626/3626				SG1626
Parameter	Test Conditions (Figure 1)	TA= 25°C				TA=-55°C to 125°C			Units
		Min.	Typ.	Max.		Min.	Typ.	Max.
Dynamic Characteristics (Note 6)
Propagation Delay High-Low	CL = 1000pF (Note 5)				18			30	ns
(TPHL)	CL = 2500pF		17		25			40	ns
Propagation Delay Low-High	CL = 1000pF (Note 5)				25			40	ns
(TPLH)	CL = 2500pF		25		35			50	ns
Rise Time (TTLH)	CL = 1000pF (Note 5)				30			35	ns
	CL = 2500pF		30		40			50	ns
Fall Time (TTHL)	CL = 1000pF (Note 5)				20			30	ns
	CL = 2500pF		30		40			50	ns
Supply Current (ICC)	CL = 2500pF, Freq. = 200KHz
(both outputs)	Duty Cycle = 50%		30		35			40	mA

Note 5. These parameters, specified at 1000pF, although guaranteed over recommended operating conditions, are not 100% tested in production.

Note 6. VCC = 15V.

AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS - FIGURE 1

SG1626

CHARACTERISTIC CURVES

FIGURE 2.	FIGURE 3.	FIGURE 4.
TRANSITION TIMES VS. SUPPLY VOLTAGE	PROPAGATION DELAY VS. SUPPLY VOLTAGE	TRANSITION TIMES VS. AMBIENT TEMPERATURE

9/91 Rev 1.1 2/94 LINFINITY Microelectronics Inc.

Copyright ã 1994	11861 Western Avenue ∞ Garden Grove, CA 92841
3	[phone] ∞ FAX: [phone]