Local Control On/Off, Bend Range)
Tuning Control:440Hz ± 100 cents
Terminals:Headphone Jack [Output Impedance: 100 Ω, Output Voltage: 1.7 V(rms)
MAX], Assignable Jack, MIDI Jacks (IN, OUT), AC Adaptor Jack (12V)
Built-In Speakers:12 cm dia. 1.1W Input Rating: 2 pcs.
Power Source:2-way AC or DC source
AC: AC adaptor AD-12
DC: 6 D size dry batteries
Battery life: Approx. 5 hours by manganese batteries R20P(SUM-1)
Approx. 5 hours by alkaline batteries LR20(AM1)
Auto Power Off:Approximately 6 minutes after the last operation
Power Consumption:18 W
Dimentions:141 x 968 x 411 mm (HWD)
(5-11/16 x 38-1/16 x 16-5/16 inches) (HWD)
Weight:7.0 kg (15.5 lbs) excluding batteries
Standard Accessory:Music stand
— 1 —
Electrical
Current Drain with 12V DC:
No Sound Output390 mA ± 20%
Maximum Volume1700 mA ± 20%
with white keys D2 to D3 pressed in Synth-Bass-2 tone
and in Latin Fusion rhythm at initial setup tempo
Volume; maximum, Touch: maximum
Line Output Level (Vrms with 47 KΩ load each cannel):
with key D4 pressed in FSynth-Bass-2 tone on L-ch850 mV ± 20%
with key G4 pressed in FSynth-Bass-2 tone on R-ch800 mV ± 20%
Phone Output Level (Vrms with 8 Ω load each channel):
with key D4 pressed in FSynth-Bass-2 tone on L-ch280 mV ± 20%
with key G4 pressed in FSynth-Bass-2 tone on R-ch260 mV ± 20%
Speaker Input Level:
with key D4 pressed in FSynth-Bass-2 tone on L-ch5200 mV ± 20%
with key G4 pressed in FSynth-Bass-2 tone on R-ch5600 mV ± 20%
Minimum Operating Voltage:5.5 V
REPLACING THE DSP (HG51A115A01FD)
Note: To increase productivity ,the DSP HG51A115A01FD is sticked on the main PCB with a double-side
adhesive tape, then its leads are soldered.
Remove the DSP according to the following procedures.
1. Prepare isopropyl alcohol and a flat IC desoldering machine (Spot Heater HS-600).
2. Apply plenty of the alcohol to the adhesive tape from the reverse side of the main PCB. (Fig. 1)
There is a hole on the PCB just under the LSI, and the adhesive tape can be seen through the hole.
3. Leave it more than one minute so that the alcohol weaken adhesive power fully.
4. Using a proper size of nozzle, apply heat to leads of the LSI with the desoldering machine.
5. Grasp the LSI with tweezers, and using gentle force vibrate the tweezers to feel melting solder. (Fig.2)
6. Remove the LSI after meltingsolder at every leads wholly.
Initial reset
When batteries are set or an AC adapter is connected, the reset IC provides a low pulse to the CPU.
The CPU then initializes its internal circuit and clears data in the working strage RAM.
Power ON reset
When the power switch is pressed, the CPU receives a low pulse of POWER signal. The CPU first raises
APO signal to +5V to generat DVDD voltage, then raises RESET signal to +5V. During this period the
gate array, the DSP and the key touch LSI initializes their internal circuit.
CPU (HD6433298A18P)
The 16-bit CPU contains a 32k-bit ROM, a 1k-bit RAM, seven 8-bit I/O ports, an A/D convertor and serial
interfaces. The CPU accesses to the working strage RAM, the DSP and the key touch LSI. The CPU also
controls buttons, LEDs, bender input and MIDI input/output.
Pin No.TerminalIn/OutFunction
1P40Out KO signal data output
2P41Out Clock for KO signal data
3P42Out APO (Auto Power Off) signal output. ON: High, OFF: Low
4P43Out Read enable signal output
5P44Out Write enable signal output
6P45 Not used.
7P46Out 10MHz clock output
8P47In Wait signal input. Connected to +5V.
9TXDOut MIDI signal output
10RXDIn MIDI signal input
11P52Out Reset signal output
12-RESETIn Reset signal input
13-NMIIn Power ON signal input.
14VCCIn +5V source
15-STBYIn Standby signal input. Connected to +5V.
16VSSIn Ground (0V) source
17XTALIn 20MHz clock input
21AVSSIn Ground (0V) source for internal DAC
22AN0In Analog input. Connected to the bender volume.
23 ~ 29 P71 ~ P77In Button input signal input
30AVCCIn +5V source for internal DAC
31 ~ 38 P60 ~ P67Out LED segment signal output
39VCCIn +5V source
40 ~ 56 P27 ~ P10Out Address bus
48VSSIn Ground (0V) source
57 ~ 64 P30 ~ P37Ijn/Out Data bus
— 6 —
Gate Array (UPD65005C-578)
Functions of the gate array are;
(1) To decode chip select signals for the working strage RAM, the DSP and the key touch LSI.
(2) To hold the following signals on "Low" during power off.
Read/write enable signals for the DSP and the key touch LSI
10MHz clock for the key touch LSI
(3) To generate button scan / LED drive signals.
The following table shows the pin functions of the gate array.
Pin No.TerminalIn/OutFunction
1-RESETIn Reset signal input
2-RDAPOOut Read enable signal output
3-WRAPOOut Write enable signal output
4-LSISOut Chip select signal for the DSP
5-HGOut Chip select signal for the key touch LSI
6PHAPOOut 10MHz clock for the key touch LSI
7-SRAMOut Chip select signal for the working strage RAM
8 ~ 9KO8 ~ KO9 Not used.
10 ~ 17KO7 ~ KO0Out Button scan / LED drive signal output
18 ~ 20 Not used.
21GNDIn Ground (0V) source
22PHAIn 10MHz clock input
23-WRIn Write enable signal input
24-RDIn Read enable signal input
25-APOIn APO (Auto Power Off) signal input
26KOCIn KO signal data input
27KODIn Clock for KO signal data
28 ~ 39A15 ~ A4In Address bus
40, 41D0, D1In Data bus
42VDDIn +5V source
A4 ~ A15
D0, D1
RD
WR
PHA
APO
KOD
KOC
RESET
Address decoder
Controller
Shift register
LSIS
HG
SRAM
RDAPO
WRAPO
PHAPO
KO0 ~ KO7
— 7 —
(Chip select sigal for the DSP)
(Chip select signal for the key touch LSI)
(Chip select signal for the working strage RAM)
(Read enable signal controlled by APO)
(Write enable signal controlled by APO)
(10MHz clock for the key touchLSI.
Controlled by APO)
(Button scan / LED drive signal)
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