Analog Devices AD6624 b Datasheet

Four-Channel, 80 MSPS Digital
a
FEATURES 80 MSPS Wide Band Inputs (14 Linear Bits Plus 3 RSSI) Dual High Speed Data Input Ports Four Independent Digital Receivers in Single Package Digital Resampling for Noninteger Decimation Rates Programmable Decimating FIR Filters Programmable Attenuator Control for Clip Prevention
and External Gain Ranging via Level Indicator
Flexible Control for Multicarrier and Phased Array
3.3 V I/O, 2.5 V CMOS Core User-Configurable Built-In Self-Test (BIST) Capability JTAG Boundary Scan
APPLICATIONS Multicarrier, Multimode Digital Receivers GSM, IS136,
EDGE, PHS, IS95 Micro and Pico Cell Systems Wireless Local Loop Smart Antenna Systems Software Radios In-Building Wireless Telephony

PRODUCT DESCRIPTION

The AD6624 is a four-channel (quad) digital receive signal processor (RSP) with four cascaded signal-processing elements: a frequency translator, two fixed-coefficient decimating filters, and a programmable-coefficient decimating filter.
Receive Signal Processor (RSP)
AD6624
The AD6624 is part of Analog Devices’ SoftCell® multicarrier transceiver chipset designed for compatibility with Analog Devices’ family of high sample rate IF sampling ADCs (AD6640/ AD6644 12- and 14-bit). The SoftCell receiver comprises a digital receiver capable of digitizing an entire spectrum of carriers and digitally selecting the carrier of interest for tuning and channel selection. This architecture eliminates redundant radios in wireless base station applications.
High dynamic range decimation filters offer a wide range of decimation rates. The RAM-based architecture allows easy reconfiguration for multimode applications.
The decimating filters remove unwanted signals and noise from the channel of interest. When the channel of interest occupies less bandwidth than the input signal, this rejection of out-of-band noise is called “processing gain.” By using large decimation factors, this “processing gain” can improve the SNR of the ADC by 30 dB or more. In addition, the programmable RAM coefficient filter allows antialiasing, matched filtering, and static equalization functions to be combined in a single, cost­effective filter.
The AD6624 is compatible with standard ADC converters such as the AD664x, AD9042, AD943x, and the AD922x families of data converters. The AD6624 is also compatible with the AD6600 Diversity ADC, providing a cost and size reduction path.

FUNCTIONAL BLOCK DIAGRAM

16 BITS 18 BITS 20 BITS 24 BITS
INA[13:0]
EXPA[2:0]
IENA
LIA-A
LIA-B
SYNCA SYNCB SYNCC SYNCD
INB[13:0]
EXPB[2:0]
IENB
LIB-A LIB-B
CH A NCO
CH B NCO
INPUT MATRIX
CH C NCO
CH D NCO
EXTERNAL SYNC
RESAMPLER
RESAMPLER
RESAMPLER
RESAMPLER
CIRCUITRY
rCIC2
rCIC2
rCIC2
rCIC2
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
CIC5
CIC5
CIC5
CIC5
JTAG
INTERFACE
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
RAM
COEFFICIENT
FILTER
RAM
COEFFICIENT
FILTER
RAM
COEFFICIENT
FILTER
RAM
COEFFICIENT
FILTER
BUILT-IN
SELF-TEST
SERIAL AND MICROPORT
SDIN[3:0]
SDO[3:0]
DR[3:0]
SDFS[3:0]
SDFE[3:0]
SCLK[3:0]
MODE
DS(RD) CS
RW (WR) DTACK(RDY)
A[2:0]
D[7:0]
AD6624

TABLE OF CONTENTS

FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
PRODUCT DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . 1
FUNCTIONAL BLOCK DIAGRAM . . . . . . . . . . . . . . . . . 1
SPECIFICATIONS/CHARACTERISTICS . . . . . . . . . . . . . 3
GENERAL TIMING CHARACTERISTICS . . . . . . . . . . . . 4
ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . 9
PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . 11
ARCHITECTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
EXAMPLE FILTER RESPONSE . . . . . . . . . . . . . . . . . . . 14
INPUT DATA PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Input Enable Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Gain Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input Data Scaling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Scaling with Fixed-Point ADCs . . . . . . . . . . . . . . . . . . . . 16
Scaling with Floating-Point or Gain-Ranging ADCs . . . . 16
NUMERICALLY CONTROLLED OSCILLATOR . . . . . 17
Frequency Translation . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
NCO Frequency Hold-Off Register . . . . . . . . . . . . . . . . . 17
Phase Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
NCO Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Bypass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Phase Dither . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Amplitude Dither . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Clear Phase Accumulator on HOP . . . . . . . . . . . . . . . . . . 17
Input Enable Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Mode 00: Blank On IEN Low . . . . . . . . . . . . . . . . . . . . . 17
Mode 01: Clock On IEN High . . . . . . . . . . . . . . . . . . . . 18
Mode 10: Clock on IEN Transition to High . . . . . . . . . . 18
Mode 11: Clock on IEN Transition to Low . . . . . . . . . . . 18
WB Input Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Sync Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SECOND ORDER rCIC FILTER . . . . . . . . . . . . . . . . . . . 18
rCIC2 Rejection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Example Calculations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Decimation and Interpolation Registers . . . . . . . . . . . . . . 19
rCIC2 Scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
FIFTH ORDER CASCADED INTEGRATOR COMB
FILTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
CIC5 Rejection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
RAM COEFFICIENT FILTER . . . . . . . . . . . . . . . . . . . . . 20
RCF Decimation Register . . . . . . . . . . . . . . . . . . . . . . . . 21
RCF Decimation Phase . . . . . . . . . . . . . . . . . . . . . . . . . . 21
RCF Filter Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
RCF Output Scale Factor and Control Register . . . . . . . . 21
USER-CONFIGURABLE BUILT-IN SELF-TEST (BIST) 22
RAM BIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
CHANNEL BIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
CHIP SYNCHRONIZATION . . . . . . . . . . . . . . . . . . . . . . 22
Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Hop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SERIAL OUTPUT DATA PORT . . . . . . . . . . . . . . . . . . . 24
Serial Output Data Format . . . . . . . . . . . . . . . . . . . . . . . 24
Serial Data Frame (Serial Bus Master) . . . . . . . . . . . . . . . 24
Serial Data Frame (Serial Cascade) . . . . . . . . . . . . . . . . . 25
Configuring the Serial Ports . . . . . . . . . . . . . . . . . . . . . . . 25
Serial Port Data Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Serial Port to DSP Interconnection . . . . . . . . . . . . . . . . . 25
Serial Slave Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Serial Ports Cascaded . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Serial Output Frame Timing (Master and Slave) . . . . . . . 26
Serial Port Timing Specifications . . . . . . . . . . . . . . . . . . . 26
SBM0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
SCLK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SDIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SDO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SDFS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SDFE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Serial Word Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SDFS Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Mapping RCF Data to the BIST Registers . . . . . . . . . . . . 29
0x00–0x7F: Coefficient Memory (CMEM) . . . . . . . . . . . 29
0x80: Channel Sleep Register . . . . . . . . . . . . . . . . . . . . . 30
0x81: Soft_SYNC Register . . . . . . . . . . . . . . . . . . . . . . . 30
0x82: Pin_SYNC Register . . . . . . . . . . . . . . . . . . . . . . . . 30
0x83: Start Hold-Off Counter . . . . . . . . . . . . . . . . . . . . . 30
0x84: NCO Frequency Hold-Off Counter . . . . . . . . . . . . 30
0x85: NCO Frequency Register 0 . . . . . . . . . . . . . . . . . . 30
0x86: NCO Frequency Register 1 . . . . . . . . . . . . . . . . . . 30
0x87: NCO Phase Offset Register . . . . . . . . . . . . . . . . . . 30
0x88: NCO Control Register . . . . . . . . . . . . . . . . . . . . . . 30
0x90: rCIC2 Decimation – 1 (M 0x91: rCIC2 Interpolation – 1 (L
–1) . . . . . . . . . . . . . 31
rCIC2
–1) . . . . . . . . . . . . 31
rCIC2
0x92: rCIC2 Scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
0x93: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
0x94: CIC5 Decimation – 1 (M
–1) . . . . . . . . . . . . . . 31
CIC5
0x95: CIC5 Scale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
0x96: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
0xA0: RCF Decimation – 1 (M 0xA1: RCF Decimation Phase (P 0xA2: RCF Number of Taps Minus One (N 0xA3: RCF Coefficient Offset (CO
–1) . . . . . . . . . . . . . . . 31
RCF
) . . . . . . . . . . . . . . . 31
RCF
) . . . . . . . . . . . . . . 31
RCF
-1) . . . . . 31
RCF
0xA4: RCF Control Register . . . . . . . . . . . . . . . . . . . . . . 31
0xA5: BIST Register for I . . . . . . . . . . . . . . . . . . . . . . . . 32
0xA6: BIST Register for Q . . . . . . . . . . . . . . . . . . . . . . . 32
0xA7: BIST Control Register . . . . . . . . . . . . . . . . . . . . . 32
0xA8: RAM BIST Control Register . . . . . . . . . . . . . . . . 32
0xA9: Serial Port Control Register . . . . . . . . . . . . . . . . . 32
MICROPORT CONTROL . . . . . . . . . . . . . . . . . . . . . . . . 33
External Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Access Control Register (ACR) . . . . . . . . . . . . . . . . . . . . 33
External Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Channel Address Register (CAR) . . . . . . . . . . . . . . . . . . . 34
SOFT_SYNC Control Register . . . . . . . . . . . . . . . . . . . . 34
PIN_SYNC Control Register . . . . . . . . . . . . . . . . . . . . . . 34
SLEEP Control Register . . . . . . . . . . . . . . . . . . . . . . . . . 34
Data Address Registers . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Write Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Read Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Read/Write Chaining . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Intel Nonmultiplexed Mode (INM) . . . . . . . . . . . . . . . . . 35
Motorola Nonmultiplexed Mode (MNM) . . . . . . . . . . . . 35
Input Port Control Registers . . . . . . . . . . . . . . . . . . . . . . 35
SERIAL PORT CONTROL . . . . . . . . . . . . . . . . . . . . . . . . 36
JTAG BOUNDARY SCAN . . . . . . . . . . . . . . . . . . . . . . . . 36
INTERNAL WRITE ACCESS . . . . . . . . . . . . . . . . . . . . . . 37
Write Pseudocode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
INTERNAL READ ACCESS . . . . . . . . . . . . . . . . . . . . . . . 37
Read Pseudocode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . 38
–2–
REV. B
AD6624

SPECIFICATIONS

(VDD = 2.5 V 5%, VDDIO = 3.3 V 10%. All specifications TA = T
MIN
to T
, unless otherwise noted.)
MAX
RECOMMENDED OPERATING CONDITIONS
Test AD6624AS
Parameter Level Min Typ Max Unit
VDD IV 2.375 2.5 2.675 V VDDIO IV 3.0 3.3 3.6 V T
AMBIENT
IV –40 +25 +70 °C
ELECTRICAL CHARACTERISTICS
Test AD6624AS
Parameter (Conditions) Temp Level Min Typ Max Unit
LOGIC INPUTS
Logic Compatibility Full 3.3 V CMOS Logic “1” Voltage Full IV 2.0 5.0 V Logic “0” Voltage Full IV –0.3 +0.8 V Logic “1” Current Full IV 1 10 µA Logic “0” Current Full IV 1 10 µA Input Capacitance 25°CV 4 pF
LOGIC OUTPUTS
Logic Compatibility Full 3.3 V CMOS/TTL Logic “1” Voltage (I Logic “0” Voltage (IOL = 0.25 mA) Full IV 0.2 0.4 V
IDD SUPPLY CURRENT
CLK = 80 MHz, (VDD = 2.75 V, VDDIO = 3.6 V) Full IV
I
VDD
I
VDDIO
CLK = GSM Example (65 MSPS, VDD = 2.5 V,
VDDIO = 3.3 V, Dec = 2/10/6 120 Taps 4 Channels) 25°CV I
VDD
I
VDDIO
POWER DISSIPATION
CLK = 80 MHz TD-SCDMA Full IV 1.1 W CLK = 65 MHz Sleep Mode Full IV 287 µW
(5 V TOLERANT)
= 0.25 mA) Full IV 2.4 VDD – 0.2 V
OH
400 mA 60 mA
250 mA 24 mA
GSM/EDGE Example V 700 mW
Specifications subject to change without notice.
REV. B
–3–
AD6624–SPECIFICATIONS
GENERAL TIMING CHARACTERISTICS
1, 2
Test AD6624AS
Parameter (Conditions) Temp Level Min Typ Max Unit
CLK Timing Requirements: t
CLK
t
CLKL
t
CLKH
CLK Period Full I 12.5 ns CLK Width Low Full IV 4.5 0.5 × t CLK Width High Full IV 4.5 0.5 × t
CLK
CLK
ns ns
RESET Timing Requirement: t
RESL
RESET Width Low Full I 30.0 ns
Input Wideband Data Timing Requirements: t
SI
t
HI
Input to CLK Setup Time Full IV 0.8 ns Input to CLK Hold Time Full IV 2.0 ns
Level Indicator Output Switching Characteristic: t
DLI
CLK to LI (A–A, B; B–A, B) Output Delay Time Full IV 3.8 12.6 ns
SYNC Timing Requirements: t
SS
t
HS
Serial Port Timing Requirements (SBM = 1): Switching Characteristics:
t
DSCLK1
t
DSCLKH
t
DSCLKL
t
DSCLKLL
t
DSDFS
t
DSDFE
t
DSDO
t
DSDR
t
DDR
SYNC (A, B, C, D) to CLK Setup Time Full IV 1.0 ns SYNC (A, B, C, D) to CLK Hold Time Full IV 2.0 ns
3
CLK to SCLK Delay (Divide by 1) Full IV 3.9 13.4 nsCLK to SCLK Delay (For Any Other Divisor) Full IV 4.4 14.0 nsCLK to SCLK Delay (Divide by 2 or Even #) Full IV 3.25 6.7 nsCLK to SCLK Delay (Divide by 3 or Odd #) Full IV 3.8 6.9 nsSCLK to SDFS Delay Full IV 0.2 5.3 nsSCLK to SDFE Delay Full IV –0.4 +4.7 nsSCLK to SDO Delay Full IV –1.0 +4.0 nsSCLK to DR Delay Full IV –0.3 +4.6 nsCLK to DR Delay Full IV 5.4 17.6 ns
Input Characteristics: t
SSI
t
HSI
Serial Port Timing Requirements (SBM = 0): Switching Characteristics:
t
SCLK
t
SCLKL
t
SCLKH
t
DSDFE
t
DSDO
t
DSDR
SDI to SCLK Setup Time Full IV 2.4 ns SDI to SCLK Hold Time Full IV 3.0 ns
3
SCLK Period Full IV 16 ns SCLK Low Time (When SDIV = 1, Divide by 1) Full IV 5.0 ns SCLK High Time (When SDIV = 1, Divide by 1) Full IV 5.0 ns
SCLK to SDFE Delay Full IV 3.8 15.4 nsSCLK to SDO Delay Full IV 3.7 15.2 nsSCLK to DR Delay Full IV 3.9 15.9 ns
Input Characteristics: t
SSF
t
HSF
t
SSI
t
HSI
NOTES
1
All timing specifications valid over VDD range of 2.375 V to 2.675 V and VDDIO range of 3.0 V to 3.6 V.
2
C
LOAD
3
The timing parameters for SCLK, SDFS, SDFE, SDO, SDI, and DR apply to all four channels (0, 1, 2, and 3). The slave serial port’s (SCLK) operating frequency is
limited to 62.5 MHz.
Specifications subject to change without notice.
SDFS to SCLK Setup Time Full IV 1.9 ns SDFS to SCLK Hold Time Full IV 0.7 ns SDI to SCLK Setup Time Full IV 2.4 ns SDI to SCLK Hold Time Full IV 2.0 ns
= 40 pF on all outputs unless otherwise specified.
–4–
REV. B
AD6624
MICROPROCESSOR PORT TIMING CHARACTERISTICS
1, 2
Test AD6624AS
Parameter (Conditions) Temp Level Min Typ Max Unit
MICROPROCESSOR PORT, MODE INM (MODE = 0)
MODE INM Write Timing: t
SC
t
HC
t
HWR
t
SAM
t
HAM
t
DRDY
t
ACC
Control3 to CLK Setup Time Full IV 5.5 ns Control3 to CLK Hold Time Full IV 1.0 ns WR(RW) to RDY(DTACK) Hold Time Full IV 8.0 ns Address/Data to WR(RW) Setup Time Full IV –0.5 ns Address/Data to RDY(DTACK) Hold Time Full IV 7.0 ns
WR(RW) to RDY(DTACK) Delay Full IV 4.0 ns WR(RW) to RDY(DTACK) High Delay Full IV 4 × t
CLK
5 × t
CLK
9 × t
CLK
ns
MODE INM Read Timing: t
SC
t
HC
t
SAM
t
HAM
t
DRDY
t
ACC
Control3 to CLK Setup Time Full IV 4.0 ns Control3 to CLK Hold Time Full IV 2.0 ns Address to RD(DS) Setup Time Full IV 0.0 ns Address to Data Hold Time Full IV 7.0 ns
RD(DS) to RDY(DTACK) Delay Full IV 4.0 ns RD(DS) to RDY(DTACK) High Delay Full IV 8 × t
CLK
10 × t
CLK
13 × t
CLK
ns
MICROPROCESSOR PORT, MODE MNM (MODE = 1)
MODE MNM Write Timing: t
SC
t
HC
t
HDS
t
HRW
t
SAM
t
HAM
t
ACC
Control3 to CLK Setup Time Full IV 5.5 ns Control3 to CLK Hold Time Full IV 1.0 ns DS(RD) to DTACK(RDY) Hold Time Full IV 8.0 ns RW(WR) to DTACK(RDY) Hold Time Full IV 8.0 ns Address/Data to RW(WR) Setup Time Full IV –0.5 ns Address/Data to RW(WR) Hold Time Full IV 7.0 ns RW(WR) to DTACK(RDY) Low Delay Full IV 4 × t
CLK
5 × t
CLK
9 × t
CLK
ns
MODE MNM Read Timing: t
SC
t
HC
t
SAM
t
HAM
t
ZD
t
ACC
NOTES
1
All timing specifications valid over VDD range of 2.375 V to 2.675 V and VDDIO range of 3.0 V to 3.6 V.
2
C
= 40 pF on all outputs unless otherwise specified.
LOAD
3
Specification pertains to control signals: RW, (WR), DS, (RD), CS.
Specifications subject to change without notice.
Control3 to CLK Setup Time Full IV 4.0 ns Control3 to CLK Hold Time Full IV 2.0 ns Address to DS(RD) Setup Time Full IV 8.0 ns Address to Data Hold Time Full IV 0.0 ns Data Three-State Delay Full IV 7.0 ns DS(RD) to DTACK(RDY) Low Delay Full IV 8 × t
CLK
10 × t
CLK
13 × t
CLK
ns
REV. B
–5–
AD6624
R

TIMING DIAGRAMS

t
CLK
t
CLKL
CLK
t
CLKH
t
LIA-A LIA-B LIB-A LIB-B
Figure 1. Level Indicator Output Switching Characteristics
DLI
CLK
t
DSCLKH
t
SCLKH
SCLK
t
SCLKL
Figure 4. SCLK Switching Characteristics (Divide by 1)
ESET
t
SSF
Figure 2.
CLK
IN[13:0]
EXP[2:0]
RESET
Timing Requirements
tSIt
HI
DATA
Figure 3. Input Data Timing Requirements
SCLK
t
DSDFS
SDFS
SDI
SDFE
t
SSI
t
DATAn
HSI
CLK
t
DSCLKH
SCLK
t
SCLKL
Figure 5. SCLK Switching Characteristic (Divide by 2 or EVEN Integer)
CLK
t
DSCLKH
SCLK
t
DSCLKLL
Figure 6. SCLK Switching Characteristic (Divide by 3 or ODD Integer)
t
DSDFE
Figure 7. Serial Port Switching Characteristics
–6–
REV. B
AD6624
CLK
IN[13:0]
EXP[2:0]
IEN
t
SI
t
HI
t
DSDO
SCLK
SDO
SDFE
I
15
I
14
Q
Figure 8. SDO, SDFE Switching Characteristics
CLK
t
DDR
DR
Figure 9. CLK, DR Switching Characteristics
SCLK
t
DSDR
DR
Figure 10. SCLK, DR Switching Characteristics
t
DSDFE
1
Q
0
SCLK
SDFS
t
SSF
t
HSF
Figure 11. SDFS Timing Requirements (SBM = 0)
Figure 12. Input Timing for A and B Channels
CLK
SYNCA SYNCB SYNCC SYNCD
t
SS
t
HS
Figure 13. SYNC Timing Inputs
REV. B
–7–
AD6624
CLK
RD (DS)
WR (RW)
A[2:0]
D[7:0]
DTACK
(RDY)
t
SC
t
SAM
t
ZD
VA LID DATA
VA LID ADDRESS
t
ACC
t
HC
CS
t
ZD
t
HAM
t
DD
t
DDTACK
t
HDS
NOTES
1.
t
ACC
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. ACCESS TIME IS
MEASURED FROM FE OF DS TO THE FE OF DTACK.
2.
t
ACC
REQUIRES A MAXIMUM 13 CLK PERIODS.
TIMING DIAGRAMS—INM MICROPORT MODE TIMING DIAGRAMS—MNM MICROPORT MODE
CLK
RD (DS)
t
WR (RW)
CS
A[2:0]
D[7:0]
RDY
(DTACK)
NOTES
t
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. ACCESS TIME IS
1.
ACC
MEASURED FROM FE OF WR TO THE RE OF RDY.
t
REQUIRES A MAXIMUM 9 CLK PERIODS.
2.
ACC
SC
VAL I D DATA
t
DRDY
t
ACC
t
t
HAM
HAM
t
SAM
VA LID ADDRESS
t
SAM
t
t
HC
HWR
Figure 14. INM Microport Write Timing Requirements
CLK
t
HC
RD (DS)
t
SC
CLK
t
t
SC
t
VAL I D DATA
t
ACC
t
t
HDS
HAM
HAM
DS (RD)
RW (WR)
CS
t
SAM
A[2:0]
D[7:0]
DTACK
(RDY)
NOTES
t
1.
ACC
MEASURED FROM FE OF DS TO THE FE OF DTACK.
t
2.
ACC
VA LID ADDRESS
t
SAM
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. ACCESS TIME IS
REQUIRES A MAXIMUM 9 CLK PERIODS.
HC
t
HRW
t
DDTACK
Figure 16. MNM Microport Write Timing Requirements
WR (RW)
CS
t
SAM
VA LID ADDRESS
t
ZD
t
DRDY
t
ACC
ACCESS TIME DEPENDS ON THE ADDRESS ACCESSED. ACCESS
REQUIRES A MAXIMUM OF 13 CLK PERIODS AND APPLIES TO
t
DD
A[2:0]
D[7:0]
RDY
(DTACK)
NOTES
t
1.
ACC
TIME IS MEASURED FROM FE OF WR TO THE RE OF RDY.
t
2.
ACC
A[2:0] = 7, 6, 5, 3, 2, 1
Figure 15. INM Microport Read Timing Requirements
t
HAM
VA LID DATA
t
ZD
Figure 17. MNM Microport Read Timing Requirements
–8–
REV. B
AD6624

ABSOLUTE MAXIMUM RATINGS*

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 V
Input Voltage . . . . . . . . . . . . –0.3 V to +5.3 V (5 V Tolerant)
Output Voltage Swing . . . . . . . . . . –0.3 V to VDDIO + 0.3 V
Load Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 pF
Junction Temperature Under Bias . . . . . . . . . . . . . . . . 125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (5 sec) . . . . . . . . . . . . . . . . . . . . . . 280°C
*Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
128-Lead Plastic Quad Flatpack:
= 41°C/W, No Airflow
θ
JA
= 39°C/W, 200
θ
JA
θ
= 37°C/W, 400
JA
LFPM Airflow LFPM Airflow
Thermal measurements made in the horizontal position on a 4-layer board.

ORDERING GUIDE

Model Temperature Range Package Description Option
AD6624AS –40°C to +70°C (Ambient) 128-Lead MQFP (Plastic Quad Flatpack) S-128-1 AD6624S/PCB Evaluation Board with AD6624 and Software

EXPLANATION OF TEST LEVELS

I. 100% Production Tested. II. 100% Production Tested at 25°C, and Sample Tested at
Specified Temperatures.
III. Sample Tested Only.
IV. Parameter Guaranteed by Design and Analysis.
V. Parameter is Typical Value Only. VI. 100% Production Tested at 25°C, and Sample Tested at
Temperature Extremes.
Package
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD6624 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. B
–9–
AD6624
IENB
LIB-B
LIB-A
EXPA0
EXPA1
EXPA2
INA13
INA12
INA11
INA10
VDDIO
VSSIO
IENA
LIA-B
LIA-A
VSS
INB5
INB4
INB3
INB2
INB1
VDD
INB0
VSS
CLK
VDD
INA9
INA8
INA7
INA6
INA5
INA4
INA3
INA2
VDD
INA1
INA0
VSS

PIN CONFIGURATION

VSSIO
INB6
INB7
INB8
INB9
VDDIO
INB10
INB11
INB12
INB13
VDD
EXPB2
EXPB1
EXPB0
DR3
VSS
SDFE3
SDIN3
SDO3
SDFS3
VDDIO
SCLK3
DR2
SDFE2
SDIN2
VSSIO
121
122
123
125
126
128
1
PIN 1
2
IDENTIFIER
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
VSSIO
127
41
40
SYNCD
SYNCC
124
43
42
SYNCB
SYNCA
44
VDD
46
45
D7
RESET
120
47
D6
119
48
D5
116
118
117
AD6624
TOP VIEW
(Not to Scale)
505152
49
D3D2D1
D4
VSS
115
114
53
113
54
VDD
112
55
D0
111
110
565758
DS(RD)
DTACK/RDY
109
RW(WR)
108
107
60
59
MODE
VDDIO
106
61
A2
105
62
A1
104
63
A0
103
102
101
100
98
94
85
83
66
64
VSSIO
99
97
96
95
93
92
91
90
89
88
87
86
84
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
65
VSS
SDO2
SDFS2
SCLK2
DR1
SDFE1
VDD
SDIN1
SDO1
SDFS1
SCLK1
VSSIO
DR0
SDFE0
SDIN0
SDO0
VDDIO
SDFS0
SCLK0
SDIV0
SDIV1
VDD
SDIV2
SDIV3
SBM0
CHIP_ID0
VSS
CHIP_ID1
CHIP_ID2
CHIP_ID3
TDI
VDDIO
TDO
TMS
TCLK
TRST CS
VSS
–10–
REV. B
AD6624

PIN FUNCTION DESCRIPTIONS

Pin No. Mnemonic Type Function
1, 12, 38, 50, 65, 76, 102, 113 VSS G Ground 2–6 INB[5:1] 7, 17, 32, 44, 54, 81, 96, 118 VDD P 2.5 V Supply 8INB0 9 IENB 10 LIB-B O Level Indicator—Input B, Interleaved—Data B 11 LIB-A O Level Indicator—Input B, Interleaved—Data A 13 CLK I Input Clock 14–16 EXPA[0:2] 18–21 INA[13:10] 22, 59, 71, 86, 108, 123 VDDIO P 3.3 V Supply 23–26 INA[9:6] 27, 39, 64, 91, 103, 128 VSSIO G Ground 28–31 INA[5:2] 33–34 INA[1:0] 35 IENA 36 LIA-B O Level Indicator—Input A, Interleaved—Data B 37 LIA-A O Level Indicator—Input A, Interleaved—Data A 40 SYNCD 41 SYNCC 42 SYNCB 43 SYNCA 45 RESET IActive Low Reset Pin 46–49 D[7:4] I/O/T Bidirectional Microport Data 51–53 D[3:1] I/O/T Bidirectional Microport Data 55 D0 I/O/T Bidirectional Microport Data—LSB 56 DS(RD)IActive Low Data Strobe (Active Low Read) 57 DTACK(RDY) 58 RW(WR)IRead Write (Active Low Write) 60 MODE I Intel or Motorola Mode Select 61–63 A[2:0] I Microport Address Bus 66 CS 67 TRST 68 TCLK 69 TMS 70 TDO O/T Test Data Output 72 TDI 73–75 CHIP_ID[3:1] 77 CHIP_ID0 78 SBM0 79–80 SDIV[3:2] 82–83 SDIV[1:0] 84 SCLK0 85 SDFS0 87 SDO0 88 SDIN0 89 SDFE0 O Serial Data Frame End—Channel 0 90 DR0 O Output Data Ready Indicator—Channel 0
1
1
2
1
1
1
1
1
2
1
1
1
1
1
2
1
2
2
1
1
1
1
1
1
1
1
1
IB Input Data (Mantissa)
IB Input Data (Mantissa)—LSB I Input Enable—Input B
IA Input Data (Exponent) IA Input Data (Mantissa)
IA Input Data (Mantissa)
IA Input Data (Mantissa) IA Input Data (Mantissa) I Input Enable—Input A
IAll Sync Pins Go to All Four Output Channels IAll Sync Pins Go to All Four Output Channels IAll Sync Pins Go to All Four Output Channels IAll Sync Pins Go to All Four Output Channels
2
O/T Active Low Data Acknowledge (Microport Status Bit)
IChip Select ITest Reset Pin ITest Clock Input ITest Mode Select Input
ITest Data Input IChip ID Selector IChip ID Selector—LSB I Serial Bus Master—Channel 0 Only I Serial Clock Divisor—Channel 0 I Serial Clock Divisor—Channel 0 I/O Bidirectional Serial Clock—Channel 0 I/O Bidirectional Serial Data Frame Sync—Channel 0 O/T Serial Data Output—Channel 0 I Serial Data Input—Channel 0
REV. B
–11–
AD6624
PIN FUNCTION DESCRIPTIONS (continued)
Pin No. Mnemonic Type Function
92 SCLK1 93 SDFS1 94 SDO1 95 SDIN1 97 SDFE1 O Serial Data Frame End—Channel 1 98 DR1 O Output Data Ready Indicator—Channel 1 99 SCLK2 100 SDFS2 101 SDO2 104 SDIN2 105 SDFE2 O Serial Data Frame End—Channel 2 106 DR2 O Output Data Ready Indicator—Channel 3 107 SCLK3 109 SDFS3 110 SDO3 111 SDIN3 112 SDFE3 O Serial Data Frame End—Channel 3 114 DR3 O Output Data Ready Indicator—Channel 3 115–117 EXPB[0:2] 119–122 INB[13:10] 124–127 INB[9:6]
NOTES
1
Pins with a pull-down resistor of nominal 70 kΩ.
2
Pins with a pull-up resistor of nominal 70 kΩ.
Pin Types: I = Input, O = Output, P = Power Supply, G = Ground, T = Three-State.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
I/O Bidirectional Serial Clock—Channel 1 I/O Bidirectional Serial Data Frame Sync—Channel 1 O/T Serial Data Output—Channel 1 I Serial Data Input—Channel 1
I/O Bidirectional Serial Clock—Channel 2 I/O Bidirectional Serial Data Frame Sync—Channel 2 O/T Serial Data Output—Channel 2 I Serial Data Input—Channel 2
I/O Bidirectional Serial Clock—Channel 3 I/O Bidirectional Serial Data Frame Sync—Channel 3 O/T Serial Data Output—Channel 3 I Serial Data Input—Channel 3
IB Input Data (Exponent) IB Input Data (Mantissa) IB Input Data (Mantissa)
–12–
REV. B
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