FEATURES
100 MSPS Wideband Inputs (14 Linear Bits Plus 3 RSSI)
Dual High-Speed Data Input Ports
Four Independent Digital Receivers in Single Package
Digital Resampling for Noninteger Decimation Rates
Programmable Decimating FIR Filters
Programmable Attenuator Control for Clip Prevention
and External Gain Ranging via Level Indicator
Flexible Control for Multicarrier and Phased Array
3.3 V I/O, 2.5 V CMOS Core
User-Configurable Built-In Self-Test (BIST) Capability
JTAG Boundary Scan
APPLICATIONS
Multicarrier, Multimode Digital Receivers GSM, IS136,
EDGE, PHS, IS95
Micro and Pico Cell Systems
Wireless Local Loop
Smart Antenna Systems
Software Radios
In-Building Wireless Telephony
PRODUCT DESCRIPTION
The AD6624A is a four-channel (quad) digital receive signal
processor (RSP) with four cascaded signal-processing elements:
a frequency translator, two fixed-coefficient decimating filters,
and a programmable-coefficient decimating filter.
Receive Signal Processor (RSP)
AD6624A
The AD6624A is part of Analog Devices’ SoftCell® multicarrier
transceiver chipset designed for compatibility with Analog
Devices’ family of high sample rate IF sampling ADCs (AD6640/
AD6644 12- and 14-bit). The SoftCell receiver comprises a
digital receiver capable of digitizing an entire spectrum of
carriers and digitally selecting the carrier of interest for tuning
and channel selection. This architecture eliminates redundant
radios in wireless base station applications.
High dynamic range decimation filters offer a wide range of
decimation rates. The RAM-based architecture allows easy
reconfiguration for multimode applications.
The decimating filters remove unwanted signals and noise from
the channel of interest. When the channel of interest occupies less
bandwidth than the input signal, this rejection of out-of-band
noise is called “processing gain.” By using large decimation
factors, this “processing gain” can improve the SNR of the
ADC by 30 dB or more. In addition, the programmable RAM
coefficient filter allows antialiasing, matched filtering, and
static equalization functions to be combined in a single, costeffective filter.
The AD6624A is compatible with standard ADC converters such
as the AD664x, AD9042, AD943x and the AD922x families of
data converters. The AD6624A is also compatible with the
AD6600 Diversity ADC, providing a cost and size reduction path.
FUNCTIONAL BLOCK DIAGRAM
16 BITS18 BITS20 BITS24 BITS
INA[13:0]
EXPA[2:0]
IENA
LIA-A
LIA-B
SYNCA
SYNCB
SYNCC
SYNCD
INB[13:0]
EXPB[2:0]
IENB
LIB-A
LIB-B
SoftCell is a registered trademark of Analog Devices, Inc.
INPUT
MATRIX
CH ANCO
CH BNCO
CH CNCO
CH DNCO
EXTERNAL SYNC
RESAMPLER
RESAMPLER
RESAMPLER
RESAMPLER
CIRCUITRY
rCIC2
rCIC2
rCIC2
rCIC2
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
CLK PeriodFullI10ns
CLK Width LowFullIV4.50.5 × t
CLK Width HighFullIV4.50.5 × t
CLK
CLK
ns
ns
RESETTiming Requirement:
t
RESL
RESET Width LowFullI30.0ns
Input Wideband Data Timing Requirements:
t
SI
t
HI
Input to ↑CLK Setup TimeFullIV0.8ns
Input to ↑CLK Hold TimeFullIV2.0ns
Level Indicator Output Switching Characteristic:
t
DLI
↑CLK to LI (A–A, B; B–A, B) Output Delay TimeFullIV3.812.6ns
SYNC Timing Requirements:
t
SS
t
HS
Serial Port Timing Requirements (SBM = 1):
Switching Characteristics:
t
DSCLK1
t
DSCLKH
t
DSCLKL
t
DSCLKLL
t
DSDFS
t
DSDFE
t
DSDO
t
DSDR
t
DDR
SYNC (A, B, C, D) to ↑CLK Setup TimeFullIV1.0ns
SYNC (A, B, C, D) to ↑CLK Hold TimeFullIV2.0ns
3
↑CLK to ↑SCLK Delay (Divide by 1)FullIV3.913.4ns
↑CLK to ↑SCLK Delay (For Any Other Divisor)FullIV4.414.0ns
↑CLK to ↓SCLK Delay (Divide by 2 or Even #)FullIV3.256.7ns
↓CLK to ↓SCLK Delay (Divide by 3 or Odd #)FullIV3.86.9ns
↑SCLK to SDFS DelayFullIV0.25.3ns
↑SCLK to SDFE DelayFullIV–0.4+4.7ns
↑SCLK to SDO DelayFullIV–1.0+4.0ns
↑SCLK to DR DelayFullIV–0.3+4.6ns
↑CLK to DR DelayFullIV5.417.6ns
Input Characteristics:
t
SSI
t
HSI
Serial Port Timing Requirements (SBM = 0):
Switching Characteristics:
t
SCLK
t
SCLKL
t
SCLKH
t
DSDFE
t
DSDO
t
DSDR
SDI to ↓SCLK Setup TimeFullIV2.4ns
SDI to ↓SCLK Hold TimeFullIV3.0ns
3
SCLK PeriodFullIV16ns
SCLK Low Time (When SDIV = 1, Divide by 1)FullIV5.0ns
SCLK High Time (When SDIV = 1, Divide by 1)FullIV5.0ns
↑SCLK to SDFE DelayFullIV3.815.4ns
↑SCLK to SDO DelayFullIV3.715.2ns
↑SCLK to DR DelayFullIV3.915.9ns
Input Characteristics:
t
SSF
t
HSF
t
SSI
t
HSI
NOTES
1
All Timing Specifications valid over VDD range of 2.375 V to 2.675 V and VDDIO range of 3.0 V to 3.6 V.
2
C
LOAD
3
The timing parameters for SCLK, SDFS, SDFE, SDO, SDI, and DR apply to all four channels (0, 1, 2, and 3). The slave serial port’s (SCLK) operating frequency is
limited to 62.5 MHz.
Specifications subject to change without notice.
SDFS to ↑SCLK Setup TimeFullIV1.9ns
SDFS to ↑SCLK Hold TimeFullIV0.7ns
SDI to ↓SCLK Setup TimeFullIV2.4ns
SDI to ↓SCLK Hold TimeFullIV2.0ns
= 40 pF on all outputs unless otherwise specified.
–4–
REV. 0
AD6624A
MICROPROCESSOR PORT TIMING CHARACTERISTICS
1, 2
Test AD6624AS
Parameter (Conditions)TempLevelMinTypMaxUnit
MICROPROCESSOR PORT, MODE INM (MODE = 0)
MODE INM Write Timing:
t
SC
t
HC
t
HWR
t
SAM
t
HAM
t
DRDY
t
ACC
Control3 to ↑CLK Setup TimeFullIV5.5ns
Control3 to ↑CLK Hold TimeFullIV1.0ns
WR(RW) to RDY(DTACK) Hold TimeFullIV8.0ns
Address/Data to WR(RW) Setup TimeFullIV–0.5ns
Address/Data to RDY(DTACK) Hold TimeFullIV7.0ns
WR(RW) to RDY(DTACK) DelayFullIV4.0ns
WR(RW) to RDY(DTACK) High DelayFullIV4 × t
CLK
5 × t
CLK
9 × t
CLK
ns
MODE INM Read Timing:
t
SC
t
HC
t
SAM
t
HAM
t
DRDY
t
ACC
Control3 to ↑CLK Setup TimeFullIV4.0ns
Control3 to ↑CLK Hold TimeFullIV2.0ns
Address to RD(DS) Setup TimeFullIV0.0ns
Address to Data Hold TimeFullIV7.0ns
RD(DS) to RDY(DTACK) DelayFullIV4.0ns
RD(DS) to RDY(DTACK) High DelayFullIV8 × t
CLK
10 × t
CLK
13 × t
CLK
ns
MICROPROCESSOR PORT, MODE MNM (MODE = 1)
MODE MNM Write Timing:
t
SC
t
HC
t
HDS
t
HRW
t
SAM
t
HAM
t
ACC
Control3 to ↑CLK Setup TimeFullIV5.5ns
Control3 to ↑CLK Hold TimeFullIV1.0ns
DS(RD) to DTACK(RDY) Hold TimeFullIV8.0ns
RW(WR) to DTACK(RDY) Hold TimeFullIV8.0ns
Address/Data to RW(WR) Setup TimeFullIV–0.5ns
Address/Data to RW(WR) Hold TimeFullIV7.0ns
RW(WR) to DTACK(RDY) Low DelayFullIV4 × t
CLK
5 × t
CLK
9 × t
CLK
ns
MODE MNM Read Timing:
t
SC
t
HC
t
SAM
t
HAM
t
ZD
t
ACC
NOTES
1
All Timing Specifications valid over VDD range of 2.375 V to 2.675 V and VDDIO range of 3.0 V to 3.6 V.
2
C
= 40 pF on all outputs unless otherwise specified.
LOAD
3
Specification pertains to control signals: RW, (WR), DS, (RD), CS.
Specifications subject to change without notice.
Control3 to ↑CLK Setup TimeFullIV4.0ns
Control3 to ↑CLK Hold TimeFullIV2.0ns
Address to DS(RD) Setup TimeFullIV0.0ns
Address to Data Hold TimeFullIV7.0ns
Data Three-State DelayFullIV7.0ns
DS(RD) to DTACK(RDY) Low DelayFullIV8 × t
*Stresses greater than those listed above may cause permanent damage to the
device. These are stress ratings only; functional operation of the device at these or
any other conditions greater than those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Thermal Characteristics
196-Lead Ball Grid Array:
θ
= 26.3°C/W, No Airflow
JA
= 22°C/W, 200 LFPM Airflow
θ
JA
Thermal measurements made in the horizontal position on
a 4-layer board.
ORDERING GUIDE
ModelTemperature RangePackage DescriptionOption
AD6624AABC–40°C to +85°C (Ambient)196-Lead BGA (Ball Grid Array)BC-196
AD6624AS/PCBEvaluation Board with AD6624A and Software
EXPLANATION OF TEST LEVELS
I.100% Production Tested.
II. 100% Production Tested at 25°C, and Sample Tested at
Specified Temperatures.
III. Sample Tested Only.
IV. Parameter Guaranteed by Design and Analysis.
V. Parameter is Typical Value Only.
VI. 100% Production Tested at 25°C, and Sample Tested at
Temperature Extremes.
Package
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD6624A features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. 0
–9–
AD6624A
A
B
C
D
E
F
G
H
J
K
L
PIN CONFIGURATION
(Top View)
1234567891011121314
15mm SQ.
M
N
P
1.0mm.
1234567891011121314
A
NCINB5INB6INB12EXPB1EXPB0SDIN3SDFS3DR2SDFS2NC
B
INB3INB4INB7INB10INB13DR3SDO3SDFE2SDO2
C
INB1INB8INB9INB11EXPB2SDFE3SCLK3SDIN2SCLK2SDFE1
D
LIB-BINB2INB0SDFS1DR1SDIN1
E
CLKIENBLIB-ASDO1
F
EXPA1EXPA0EXPA2SCLK1DR0SDIN0
G
INA12INA13INA10SDFE0SDO0SCLK0
H
INA11INA9INA7SDFS0SDIV1SDIV0
J
INA8INA6INA4SDIV2SMB0SDIV3
K
INA5INA2INA0CHIP
L
INA1INA3TDITMSCHIP
M
IENASYNCDSYNCAD5D2DS(RD)A0MODETRSTTD0
N
P
NCLIA-BSYNCBRESETD6D3D0RW(WR)A1NC
LIA-ASYNCCD7D4D1DTACK(RDY)A 2CSTCLK
TOP VIEW
VDDIOVDDVDDIOVDDVDDIOVDD
VDDGNDGNDGNDGNDVDDIO
VDDIOGNDGNDGNDGNDVDD
VDDGNDGNDGNDGNDVDDIO
VDDIOGNDGNDGNDGNDVDD
VDDVDDIOVDDVDDIOVDDVDDIO
BALL LEGEND
I/O
GROUND
CORE POWER
RING POWER
NO
ID1 CHIP ID3 CHIP ID0
ID2
NC = NO CONNECT
–10–
REV. 0
PIN FUNCTION DESCRIPTIONS 196-LEAD BGA
Pin No.TypeFunction
POWER SUPPLY
VDDP2.5 V Supply
VDDIOP3.3 V IO Supply
GNDGGround
INPUTS
INA[13:0]
EXPA[2:0]
IENA
INB[13:0]
EXPB[2:0]
IENB
1
1
2
1
1
2
IA Input Data (Mantissa)
IA Input Data (Exponent)
IInput Enable—Input A
IB Input Data (Mantissa)
IB Input Data (Exponent)
IInput Enable—Input B
IAll Sync Pins Go to All Four Output Channels
IAll Sync Pins Go to All Four Output Channels
IAll Sync Pins Go to All Four Output Channels
IAll Sync Pins Go to All Four Output Channels
ISerial Data Input—Channel 0
ISerial Data Input—Channel 1
ISerial Data Input—Channel 2
ISerial Data Input—Channel 3
IChip Select
IChip ID Selector
ISerial Bus Master—Channel 0 only
I/OBidirectional Serial Clock—Channel 0
I/OBidirectional Serial Clock—Channel 1
I/OBidirectional Serial Clock—Channel 2
I/OBidirectional Serial Clock—Channel 3
ISerial Clock Divisor—Channel 0
I/OBidirectional Serial Data Frame Sync—Channel 0
I/OBidirectional Serial Data Frame Sync—Channel 1
I/OBidirectional Serial Data Frame Sync—Channel 2
I/OBidirectional Serial Data Frame SyncvChannel 3
SDFE0OSerial Data Frame End—Channel 0
SDFE1OSerial Data Frame End—Channel 1
SDFE2OSerial Data Frame End—Channel 2
SDFE3OSerial Data Frame End—Channel 3
MICROPORT CONTROL
D[7:0]I/O/TBidirectional Microport Data
A[2:0]IMicroport Address Bus
DS (RD)IActive Low Data Strobe (Active Low Read)
DTACK (RDY)
2
O/TActive Low Data Acknowledge (Microport Status Bit)
RW (WR)IRead Write (Active Low Write)
MODEIIntel or Motorola Mode Select
AD6624A
REV. 0
–11–
AD6624A
PIN FUNCTION DESCRIPTIONS 196-LEAD BGA (continued)
Pin No.TypeFunction
OUTPUT
LIA-AOLevel Indicator—Input A, Interleaved-Data A
LIA-BOLevel Indicator—Input A, Interleaved-Data B
LIB-BOLevel Indicator—Input B, Interleaved-Data B
LIB-AOLevel Indicator—Input B, Interleaved-Data A
1
SDO0
1
SDO1
1
SDO2
1
SDO3
DR0OOutput Data Ready Indicator—Channel 0
DR1OOutput Data Ready Indicator—Channel 1
DR2OOutput Data Ready Indicator—Channel 3
DR3OOutput Data Ready Indicator—Channel 3
JTAG and BIST
2
TRST
1
TCLK
2
TMS
TDOO/TTest Data Output
2
TDI
NOTES
1
Pins with a pull-down resistor of nominal 70 kΩ.
2
Pins with a pull-up resistors of nominal 70 kΩ.
O/TSerial Data Output—Channel 0
O/TSerial Data Output—Channel 1
O/TSerial Data Output—Channel 2
O/TSerial Data Output—Channel 3