Analog Devices AD5601 11 21 a Datasheet

2.7 V to 5.5 V, <100 µA, 8-/10-/12-Bit
nano
DAC™, SPI® Interface in SC70 Package

FEATURES

6-lead SC70 package Micropower operation: 100 µA max at 5 V Power-down typically to 0.2 µA at 3 V
2.7 V to 5.5 V power supply Guaranteed monotonic by design Power-on reset to 0 V with brownout detection 3 power-down functions Low power serial interface with Schmitt-triggered inputs On-chip output buffer amplifier, rail-to-rail operation SYNC
interrupt facility Minimized zero-code error AD5601 buffered 8-bit DAC in SC70:
B Version: ±0.5 LSB INL
AD5611 buffered 10-bit DAC in SC70:
A Version: ±4 LSB INL
AD5621 buffered 12-bit DAC in SC70:
A Version: ±6 LSB INL

APPLICATIONS

Voltage level setting Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators

GENERAL DESCRIPTION

The AD5601/AD5611/AD5621, members of the nanoDAC family, are single, 8-/10-/12-bit, buffere d, voltage-out DACs that operate from a single 2.7 V to 5.5 V supply, consuming typically 75 µA at 5 V. The parts come in a tiny SC70 package. Their on­chip precision output amplifier allows rail-to-rail output swing to be achieved. The AD5601/AD5611/AD5621 utilize a versatile 3-wire serial interface that operates at clock rates up to 30 MHz and is compatible with SPI, QSPI™, MICROWIRE™, and DSP interface standards.
The reference for the AD5601/AD5611/AD5621 is derived from the power supply inputs and, therefore, gives the widest dynamic output range. The parts incorporate a power-on reset circuit, which ensures that the DAC output powers up to 0 V and remains there until a valid write to the device takes place.
The AD5601/AD5611/AD5621 contain a power-down feature that reduces current consumption to typically 0.2 µA at 3 V, and provides software-selectable output loads while in power-down mode. The parts are put into power-down mode over the serial interface.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
AD5601/AD5611/AD5621

FUNCTIONAL BLOCK DIAGRAM

V
DD
GND
POWER-ON
RESET
REF(+)
14-BIT
SYNC
DAC
REGISTER
INPUT
CONTROL
LOGIC
SCLK SDIN
Table 1. Related Devices
Part Number Description
AD5641 2.7 V to 5.5 V, <100 µA, 14-Bit nanoDAC in SC70
Package
The low power consumption of these parts in normal operation makes them ideally suited to portable battery-operated equip­ment. The combination of small package and low power makes these nanoDAC devices ideal for level-setting requirements such as generating bias or control voltages in space-constrained and power-sensitive applications.

PRODUCT HIGHLIGHTS

1. Available in a space-saving, 6-lead SC70 package.
2. Low power, single-supply operation. The AD5601/
AD5611/AD5621 operate from a single 2.7 V to 5.5 V supply and with a maximum current consumption of 100 µA, making them ideal for battery-powered applications.
3. The on-chip output buffer amplifier allows the output of
the DAC to swing rail-to-rail with a typical slew rate of
0.5 V/µs.
4. Reference derived from the power supply.
5. High speed serial interface with clock speeds up to
30 MHz. Designed for very low power consumption. The interface powers up only during a write cycle.
6. Power-down capability. When powered down, the DAC
typically consumes 0.2 µA at 3 V. Power-on reset with brownout detection.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.3113 © 2005 Analog Devices, Inc. All rights reserved.
www.analog.com
AD5601/AD5611/AD5621
OUTPUT
DAC
POWER-DOWN
CONTROL LOGIC
BUFFER
Figure 1.
RESISTOR NETWORK
V
OUT
04783-001
AD5601/AD5611/AD5621
TABLE OF CONTENTS
Specifications..................................................................................... 3
Timing Characteristics ................................................................ 4
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Te r m in o l o g y ...................................................................................... 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 14
D/A Section ................................................................................. 14
Resistor String............................................................................. 14
Output Amplifier........................................................................ 14
Serial Interface............................................................................ 14
Input Shift Register..................................................................... 14
REVISION HISTORY
3/05—Rev. 0 to Rev. A
Changes to Timing Characteristics................................................ 4
Changes to Absolute Maximum Ratings ....................................... 5
Changes to Full Scale Error Section............................................... 7
Changes to Figure 20...................................................................... 10
Changes to Theory of Operation.................................................. 14
Changes to Power Down Modes................................................... 15
SYNC
Interrupt .......................................................................... 14
Power-On Reset .......................................................................... 15
Power-Down Modes .................................................................. 15
Microprocessor Interfacing....................................................... 16
Applications..................................................................................... 18
Choosing a Reference as Power Supply for the AD5601/AD5611/AD5621
Bipolar Operation Using the AD5601/AD5611/AD5621
Using the AD5601/AD5611/AD5621 with an Opto-Isolated Interface
Power-Supply Bypassing and Grounding ............................... 19
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20
....................................................... 18
....................................................... 18
.............................................................. 19
1/05—Revision 0: Initial Version
Rev. A | Page 2 of 20
AD5601/AD5611/AD5621

SPECIFICATIONS

VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T
Table 2.
A Grade
1, 2
B Grade2
Parameter Min Typ2 Max Min Typ2 Max Unit Test Conditions/Comments
STATIC PERFORMANCE
AD5601
Resolution 8 Bits Relative Accuracy3 (INL) ±0.5 LSB Differential Nonlinearity
±0.5 LSB Guaranteed monotonic by design
(DNL)
AD5611
Resolution 10 Bits Relative Accuracy3 (INL) ±4 LSB Differential Nonlinearity
±0.5 LSB Guaranteed monotonic by design
(DNL)
AD5621
Resolution 12 Bits Relative Accuracy3 (INL) ±6 LSB Differential Nonlinearity
±0.5 LSB Guaranteed monotonic by design
(DNL) Zero-Code Error * * 0.5 10 mV All 0s loaded to DAC register Full-Scale Error * ±0.5 mV All 1s loaded to DAC register Offset Error * * ±0.063 ±10 mV Gain Error * * ±0.0004 ±0.037 %FSR Zero-Code Error Drift * 5. 0 µV/°C
Gain Temperature Coefficient * 2. 0
OUTPUT CHARACTERISTICS
Output Voltage Range * * Output Voltage Settling
4
0 V
DD
* * 6 10 µs Code ¼ scale to ¾ scale
Time Slew Rate * 0. 5 V/µs Capacitive Load Stability * 470 pF RL = ∞ * 1000 pF RL = 2 kΩ Output Noise Spectral
* 120
Density Noise * 2 µV
Digital-to-Analog Glitch
* 5 nV-s 1 LSB change around major carry
Impulse Digital Feedthrough * 0.2 nV-s Short-Circuit Current * 15 mA VDD = 3 V/5 V DC Output Impedance * 0.5
LOGIC INPUTS
Input Current V
, Input High Voltage * 1.8 V VDD = 4.7 V to 5.5 V
INH
5
* ± 2 µA
* 1.4 V VDD = 2.7 V to 3.6 V V
, Input Low Voltage * 0.8 V VDD = 4.7 V to 5.5 V
INL
* 0.6 V VDD = 2.7 V to 3.6 V Pin Input Capacitance * 3 pF
MIN
ppm
to T
, unless other wise noted.
MAX
FSR/°C
V
nV/√Hz
DAC code = midscale,1 kHz
DAC code = midscale, 0.1 Hz to 10 kHz bandwidth
Rev. A | Page 3 of 20
AD5601/AD5611/AD5621
A Grade
1, 2
B Grade2
Parameter Min Typ2 Max Min Typ2 Max Unit Test Conditions/Comments
POWER REQUIREMENTS
V
DD
* * 2.7 5.5 V All digital inputs at 0 V or V
DD
IDD (Normal Mode) DAC active and excluding load current
VDD = ±4.5 V to ±5.5 V * * 75 100 µA VIH = VDD and VIL = GND VDD = ±2.7 V to ±3.6 V * * 60 90 µA VIH = VDD and VIL = GND
IDD (All Power-Down Modes) VIH = VDD and VIL = GND
VDD = ±4.5 V to ±5.5 V * 0.5 µA VIH = VDD and VIL = GND VDD = ±2.7 V to ±3.6 V * 0.2 µA VIH = VDD and VIL = GND
POWER EFFICIENCY
I
OUT/IDD
1
Asterisk (*) = specifications same as B grade.
2
Temperature range for A/B grades is –40°C to +125°C, typical at +25°C.
3
Linearity calculated using a reduced code range: AD5621 from Code 64 to Code 4032; AD5611 from Code 16 to Code 1008; AD5601 from Code 4 to Code 252.
4
Guaranteed by design and characterization, not production tested.
5
Total current flowing into all pins.
* 96 % I
= 2 mA and VDD = ±5 V
LOAD

TIMING CHARACTERISTICS

VDD = 2.7 V to 5.5 V; all specifications T
Table 3.
Parameter Limit
2
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
1
All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
Maximum SCLK frequency is 30 MHz.
1
33 ns min SCLK cycle time 5 ns min SCLK high time 5 ns min SCLK low time 10 ns min
5 ns min Data setup time
4.5 ns min Data hold time 0 ns min 20 ns min
13 ns min
MIN
to T
, unless otherwise noted. See Figure 2.
MAX
Unit Test Conditions/Comments
SYNC to SCLK falling edge setup time
SCLK falling edge to Minimum
SYNC high time
SYNC rising edge
SYNC rising edge to next SCLK falling edge ignored
SCLK
SYNC
SDIN
t
4
t
8
t
t
2
1
t
3
t
6
t
5
t
9
t
7
D0D1D2D14D15
D15 D14
04783-002
Figure 2. Timing Diagram
Rev. A | Page 4 of 20
AD5601/AD5611/AD5621

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7.0 V Digital Input Voltage to GND –0.3 V to VDD + 0.3 V V
to GND –0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range
Industrial (A/B Grades) –40°C to +125°C
Storage Temperature Range –65°C to +160°C Maximum Junction Temperature 150°C SC70 Package
θJA Thermal Impedance 433.34°C/W θJC Thermal Impedance 149.47°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C
ESD 2.0 kV
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada­tion or loss of functionality.
Rev. A | Page 5 of 20
AD5601/AD5611/AD5621

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

16
SYNC
SDIN
AD5601/ AD5611/
25
AD5621
TOP VIEW
34
(Not to Scale)
V
OUT
GNDSCLK
V
DD
04783-003
Figure 3. 6-Lead SC70 Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Function
1
2 SCLK
SYNC Level-Triggered Control Input (Active Low). This is the frame synchronization signal for the input data. When SYNC
goes low, it enables the input shift register, and data is transferred in on the falling edges of the clocks that follow. The DAC is updated following the 16 rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the DAC.
th
clock cycle unless SYNC is taken high before this edge, in which case the
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates up to 30 MHz.
3 SDIN
Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling edge of the serial clock input.
4 V
DD
Power Supply Input. The AD5601/AD5611/AD5621 can be operated from 2.7 V to 5.5 V. VDD should be decoupled
to GND. 5 GND Ground Reference Point for All Circuitry on the AD5601/AD5611/AD5621. 6 V
OUT
Analog Output Voltage from the DAC. The output amplifier has rail-to-rail operation.
Rev. A | Page 6 of 20
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