Analog Devices AD5304, AD5324, AD5314 Datasheet

2.5 V to 5.5 V, 500 ␮A, Quad Voltage Output
a
8-/10-/12-Bit DACs in 10-Lead microSOIC
FEATURES AD5304
Four Buffered 8-Bit DACs in 10-Lead microSOIC
AD5314
Four Buffered 10-Bit DACs in 10-Lead microSOIC
AD5324
Four Buffered 12-Bit DACs in 10-Lead microSOIC
Low Power Operation: 500 A @ 3 V, 600 A @ 5 V
2.5 V to 5.5 V Power Supply Guaranteed Monotonic By Design Over All Codes Power-Down to 80 nA @ 3 V, 200 nA @ 5 V Double-Buffered Input Logic Output Range: 0–V
REF
Power-On-Reset to Zero Volts Simultaneous Update of Outputs (LDAC Function) Low Power, SPI™, QSPI™, MICROWIRE™, and
DSP-Compatible 3-Wire Serial Interface On-Chip Rail-to-Rail Output Buffer Amplifiers Temperature Range –40C to +105ⴗC
APPLICATIONS Portable Battery-Powered Instruments Digital Gain and Offset Adjustment Programmable Voltage and Current Sources Programmable Attenuators Industrial Process Control
FUNCTIONAL BLOCK DIAGRAM
AD5304/AD5314/AD5324*
GENERAL DESCRIPTION
The AD5304/AD5314/AD5324 are quad 8-, 10- and 12-bit buffered voltage output DACs in a 10-lead microSOIC package that operate from a single 2.5 V to 5.5 V supply consuming 500 µA at 3 V. Their on-chip output amplifiers allow rail-to­rail output swing to be achieved with a slew rate of 0.7 V/µs. A 3-wire serial interface is used which operates at clock rates up to 30 MHz and is compatible with standard SPI, QSPI, MICROWIRE and DSP interface standards.
The references for the four DACs are derived from one reference pin. The outputs of all DACs may be updated simultaneously using the software LDAC function. The parts incorporate a power-on-reset circuit that ensures that the DAC outputs power up to zero volts and remain there until a valid write takes place to the device. The parts contain a power-down feature that reduces the current consumption of the device to 200 nA @ 5 V (80 nA @ 3 V).
The low power consumption of these parts in normal operation makes them ideally suited to portable battery-operated equipment. The power consumption is 3 mW at 5 V, 1.5 mW at 3 V, reducing to 1 µW in power-down mode.
V
DD
LDAC
INPUT
REGISTER
SCLK
SYNC
DIN
*Protected by U.S. Patent No. 5,969,657; other patents pending.
SPI and QSPI are trademarks of Motorola, Inc. MICROWIRE is a trademark of National Semiconductor Corporation.
INTERFACE
LOGIC
POWER-ON
RESET
INPUT
REGISTER
INPUT
REGISTER
INPUT
REGISTER
AD5304/AD5314/AD5324
GND
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
REFIN
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
DAC
REGISTER
STRING
DAC A
STRING
DAC B
STRING
DAC C
STRING
DAC D
POWER-DOWN
LOGIC
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
BUFFER
V
A
OUT
BBUFFER
V
OUT
V
CBUFFER
OUT
V
DBUFFER
OUT
AD5304/AD5314/AD5324–SPECIFICATIONS
GND; CL = 200 pF to GND; All specifications T
Parameter
1
DC PERFORMANCE
3, 4
B Version Min Typ Max Unit Conditions/Comments
MIN
to T
unless otherwise noted.)
MAX
2
(VDD = 2.5 V to 5.5 V; V
= 2 V; RL = 2 k to
REF
AD5304
Resolution 8 Bits Relative Accuracy ± 0.15 ± 1 LSB Differential Nonlinearity ± 0.02 ± 0.25 LSB Guaranteed Monotonic by Design Over All Codes
AD5314
Resolution 10 Bits Relative Accuracy ± 0.5 ± 4 LSB Differential Nonlinearity ± 0.05 ± 0.5 LSB Guaranteed Monotonic by Design Over All Codes
AD5324
Resolution 12 Bits Relative Accuracy ± 2 ± 16 LSB
Differential Nonlinearity ± 0.2 ± 1 LSB Guaranteed Monotonic by Design Over All Codes Offset Error ± 0.4 ± 3 % of FSR See Figures 2 and 3 Gain Error ± 0.15 ± 1 % of FSR See Figures 2 and 3 Lower Deadband 20 60 mV Lower Deadband Exists Only If Offset Error Is Negative Offset Error Drift Gain Error Drift DC Power Supply Rejection Ratio DC Crosstalk
DAC REFERENCE INPUTS
V
Input Range 0.25 V
REF
V
Input Impedance 37 45 k Normal Operation
REF
5
5
5
5
5
–12 ppm of FSR/°C –5 ppm of FSR/°C –60 dB ∆VDD = ±10% 200 µVR
DD
V
= 2 k to GND or V
L
DD
>10 M Power-Down Mode
Reference Feedthrough –90 dB Frequency = 10 kHz
OUTPUT CHARACTERISTICS
Minimum Output Voltage Maximum Output Voltage
5
6
6
0.001 V This is a measure of the minimum and maximum drive
VDD – 0.001 V capability of the output amplifier. DC Output Impedance 0.5 Short Circuit Current 25 mA VDD = 5 V
16 mA VDD = 3 V Power-Up Time 2.5 µs Coming Out of Power-Down Mode. VDD = 5 V
5 µs Coming Out of Power-Down Mode. VDD = 3 V
LOGIC INPUTS
5
Input Current ± 1 µA VIL, Input Low Voltage 0.8 V VDD = 5 V ± 10%
0.6 V VDD = 3 V ± 10%
0.5 V VDD = 2.5 V
VIH, Input High Voltage 2.4 V VDD = 5 V ± 10%
2.1 V VDD = 3 V ± 10%
2.0 V VDD = 2.5 V
Pin Capacitance 3 pF
POWER REQUIREMENTS
V
DD
IDD (Normal Mode)
7
VDD = 4.5 V to 5.5 V 600 900 µAV VDD = 2.5 V to 3.6 V 500 700 µAV
2.5 5.5 V
= VDD and VIL = GND
IH
= VDD and VIL = GND
IH
IDD (Power-Down Mode)
VDD = 4.5 V to 5.5 V 0.2 1 µAV VDD = 2.5 V to 3.6 V 0.08 1 µAV
NOTES
1
See Terminology.
2
Temperature range: B Version: –40°C to +105°C; typical at 25°C.
3
DC specifications tested with the outputs unloaded.
4
Linearity is tested using a reduced code range: AD5304 (Code 8 to 248); AD5314 (Code 28 to 995); AD5324 (Code 115 to 3981).
5
Guaranteed by design and characterization, not production tested.
6
In order for the amplifier output to reach its minimum voltage, Offset Error must be negative. In order for the amplifier output to reach its maximum voltage,
= VDD and “Offset plus Gain” Error must be positive.
V
REF
7
IDD specification is valid for all DAC codes. Interface inactive. All DACs active. Load currents excluded.
Specifications subject to change without notice.
= VDD and VIL = GND
IH
= VDD and VIL = GND
IH
–2–
REV. B
AD5304/AD5314/AD5324
(VDD = 2.5 V to 5.5 V; RL = 2 k to GND; CL = 200 pF to GND; all specifications T
AC CHARACTERISTICS
Parameter
Output Voltage Settling Time V
2
1
otherwise noted.)
B Version Min Typ Max Unit Conditions/Comments
3
= VDD = 5 V
REF
AD5304 6 8 µs 1/4 Scale to 3/4 Scale AD5314 7 9 µs 1/4 Scale to 3/4 Scale AD5324 8 10 µs 1/4 Scale to 3/4 Scale
Change Change Change
to T
MIN
(40 Hex to C0 Hex) (100 Hex to 300 Hex)
(400 Hex to C00 Hex) Slew Rate 0.7 V/µs Major-Code Transition Glitch Energy 12 nV-s 1 LSB Change Around Major Carry Digital Feedthrough 1 nV-s Digital Crosstalk 1 nV-s DAC-to-DAC Crosstalk 3 nV-s Multiplying Bandwidth 200 kHz V Total Harmonic Distortion –70 dB V
NOTES
1
Guaranteed by design and characterization, not production tested.
2
See Terminology.
3
Temperature range: B Version: –40°C to +105°C
Specifications subject to change without notice.
TIMING CHARACTERISTICS
Limit at T
; typical at 25°C.
1, 2, 3
(VDD = 2.5 V to 5.5 V. All specifications T
, T
MIN
MAX
= 2 V ± 0.1 V p-p
REF
= 2.5 V ± 0.1 V p-p. Frequency = 10 kHz
REF
to T
MIN
unless otherwise noted)
MAX
Parameter VDD = 2.5 V to 3.6 V VDD = 3.6 V to 5.5 V Unit Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
NOTES
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
3
See Figure 1.
Specifications subject to change without notice.
40 33 ns min SCLK Cycle Time 16 13 ns min SCLK High Time 16 13 ns min SCLK Low Time 0 0 ns min SYNC to SCLK Rising Edge Setup Time 5 5 ns min Data Setup Time
4.5 4.5 ns min Data Hold Time 0 0 ns min SCLK Falling Edge to SYNC Rising Edge 80 33 ns min Minimum SYNC High Time
MAX
unless
REV. B
SCLK
SYNC
DIN
t
1
t
t
t
8
DB15
t
4
t
6
t
5
3
2
DB0
t
7
Figure 1. Serial Interface Timing Diagram
–3–
AD5304/AD5314/AD5324
TOP VIEW
(Not to Scale)
10
9
8
7
6
1
2
3
4
5
V
DD
V
OUT
A
GND
DIN
SCLK
SYNC
V
OUT
D
AD5304/ AD5314/
AD5324
V
OUT
B
V
OUT
C
REFIN
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
1, 2
PIN CONFIGURATION
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . –0.3 V to V
V
A–D to GND . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
OUT
+ 0.3 V
DD
+ 0.3 V
DD
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (T
max) . . . . . . . . . . . . . . . . . . 150°C
J
10-Lead microSOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . . (T
max – TA)/θ
J
JA
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
θ
JC
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . 220 +5/–0°C
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
PIN FUNCTION DESCRIPTIONS
Pin No. Mnemonic Function
1V 2V 3V 4V
DD
A Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
OUT
B Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
OUT
C Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
OUT
5 REFIN Reference Input Pin for All Four DACs. It has an input range from 0.25 V to V 6V
D Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
OUT
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V and the supply should be decoupled to GND.
.
DD
7 GND Ground Reference Point for All Circuitry on the Part. 8 DIN Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling edge of
the serial clock input. The DIN input buffer is powered down after each write cycle.
9 SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data
can be transferred at clock speeds up to 30 MHz. The SCLK input buffer is powered down after each write cycle.
10 SYNC Active Low Control Input. This is the frame synchronization signal for the input data. When SYNC goes low, it
enables the input shift register and data is transferred in on the falling edges of the following 16 clocks. If SYNC is taken high before the sixteenth falling edge of SCLK, the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the device.
ORDERING GUIDE
Temperature Package Package Branding
Model Range Description Option Information
AD5304BRM –40°C to +105°C 10-Lead microSOIC RM-10 DBB AD5314BRM –40°C to +105°C 10-Lead microSOIC RM-10 DCB AD5324BRM –40°C to +105°C 10-Lead microSOIC RM-10 DDB
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5304/AD5314/AD5324 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. B
AD5304/AD5314/AD5324
TERMINOLOGY RELATIVE ACCURACY
For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. Typical INL versus Code plots can be seen in Figures 4, 5, and 6.
DIFFERENTIAL NONLINEARITY
Differential Nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed mono­tonic by design. Typical DNL versus Code plots can be seen in Figures 7, 8, and 9.
OFFSET ERROR
This is a measure of the offset error of the DAC and the output amplifier. It is expressed as a percentage of the full-scale range.
GAIN ERROR
This is a measure of the span error of the DAC. It is the devia­tion in slope of the actual DAC transfer characteristic from the ideal expressed as a percentage of the full-scale range.
OFFSET ERROR DRIFT
This is a measure of the change in offset error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
GAIN ERROR DRIFT
This is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
POWER-SUPPLY REJECTION RATIO (PSRR)
This indicates how the output of the DAC is affected by changes in the supply voltage. PSRR is the ratio of the change in V a change in V in dBs. V
for full-scale output of the DAC. It is measured
DD
is held at 2 V and VDD is varied ±10%.
REF
OUT
to
DC CROSSTALK
This is the dc change in the output level of one DAC at midscale in response to a full-scale code change (all 0s to all 1s and vice versa) and output change of another DAC. It is expressed in µV.
REFERENCE FEEDTHROUGH
This is the ratio of the amplitude of the signal at the DAC output to the reference input when the DAC output is not being updated. It is expressed in dBs.
DIGITAL CROSSTALK
This is the glitch impulse transferred to the output of one DAC at midscale in response to a full-scale code change (all 0s to all 1s and vice versa) in the input register of another DAC. It is expressed in nV-secs.
DAC-TO-DAC CROSSTALK
This is the glitch impulse transferred to the output of one DAC due to a digital code change and subsequent output change of another DAC. This includes both digital and analog crosstalk. It is measured by loading one of the DACs with a full-scale code change (all 0s to all 1s and vice versa) with the LDAC bit set low and monitoring the output of another DAC. The energy of the glitch is expressed in nV-secs.
MULTIPLYING BANDWIDTH
The amplifiers within the DAC have a finite bandwidth. The multiplying bandwidth is a measure of this. A sine wave on the reference (with full-scale code loaded to the DAC) appears on the output. The multiplying bandwidth is the frequency at which the output amplitude falls to 3 dB below the input.
TOTAL HARMONIC DISTORTION
This is the difference between an ideal sine wave and its attenuated version using the DAC. The sine wave is used as the reference for the DAC and the THD is a measure of the harmonics present on the DAC output. It is measured in dBs.
GAIN ERROR
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
ERROR
AMPLIFIER
FOOTROOM
(1mV)
NEGATIVE
OFFSET
ERROR
IDEAL
DAC CODE
DEADBAND CODES
OFFSET ERROR
ACTUAL
PLUS
Figure 2. Transfer Function with Negative Offset
MAJOR-CODE TRANSITION GLITCH ENERGY
Major-code transition glitch energy is the energy of the impulse injected into the analog output when the code in the DAC register changes state. It is normally specified as the area of the glitch in nV-secs and is measured when the digital code is changed by 1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00 or 100 . . . 00 to 011 . . . 11).
DIGITAL FEEDTHROUGH
Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital input pins of the device when the DAC output is not being written to (SYNC held high). It is specified in nV-secs and is measured with a worst-case change on the digital input pins, e.g., from all 0s to all 1s or vice versa.
REV. B
–5–
GAIN ERROR
PLUS
OFFSET ERROR
OUTPUT
VOLTAGE
POSITIVE
OFFSET
ACTUAL
IDEAL
DAC CODE
Figure 3. Transfer Function with Positive Offset
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