MG12/4 PARTS LIST
MG16/4 PARTS LIST
BLOCK DIAGRAM & LEVEL DIAGRAM
(ブロック&レベルダイアグラム)
OVERALL CIRCUIT DIAGRAM
(目次)
(総合仕様)
(寸法図)
(パネルレイアウト)
............................... 12
............................... 14
(MG12/4分解手順)
(MG16/4分解手順)
(ICブロック図)
(シート基板図)
(検査)
(総回路図)
MG16/4
PA
011779
MG12/4: 200304-24800
MG16/4: 200304-34800
Copyright (c) Yamaha Corporation. All rights reserved. PDF-K1411 ’05.06
MG12/4
MG16/4
IMPORTANT NOTICE
This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and
understood by the users, and have therefore not been restated.
WARNING :Failure to follow appropriate service and safety procedures when servicing this product may result in
personal injury, destruction of expensive components and failure of the product to perfor m as
specified. For these reasons, we advise all Yamaha product owners that all ser vice required should
be performed by an authorized Yamaha Retailer or the appointed service representative.
IMPORTANT :This presentation or sale of this manual to any individual or firm does not constitute authorization,
certification, recognition of any applicable technical capabilities, or establish a principal-agent
relationship of any form.
The data provided is believ ed to be accurate and applicab le to the unit (s) indicated on the cov er. The research engineering,
and service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore,
inevitable and changes in specification are subject to change without notice or ob ligation to retrofit. Should any discrepancy
appear to exist, please contact the distributor’s Service Division.
WARNING :Static discharges can destroy expensive components. Discharge any static electricity your body
may have accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires
connect to this bus).
IMPORTANT :Turn the unit OFF dur ing disassembly and parts replacement. Recheck all work before you apply
power to the unit.
WARNING : CHEMICAL CONTENT NO TICE !
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic
(where applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency
(and possibly other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY
REASON WHAT SO EVER!
Avoid prolonged, unprotected contact betw een solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before
handling food.
IMPORTANT NOTICE FOR THE UNITED KINGDOM
Connecting the Plug and Cord
IMPORTANT .The wires in this mains lead are coloured in accordance with the following code:
BLUE:NEUTRAL
BROWN:LIVE
As the colours of the wires in the mains lead of this apparatus may not correspond with the coloured markings identifying
the terminals in your plug proceed as follows:
The wire which is coloured BLUE must be connected to the terminal which is marked with the letter N or coloured BLACK.
The wire which is coloured BROWN must be connected to the terminal which is marked with the letter L or coloured RED.
Making sure that neither core is connected to the earth terminal of the three pin plug.
■ WARNING
Components having special characteristics are marked Z and must be replaced with parts having specification equal to
those originally installed.
ST, GROUP Master fader at nominal level and all Ch
assign SW’s off.
–81 dBu (85 dB S/N)
AUX master control at nominal level; all channel mix
controls at minimum level.
–64 dBu (68 dB S/N)
ST, GROUP Master fader and one Ch fader at nominal
level.
Maximum V oltage Gain
2
60 dB CH MIC INPUT → CH INSERT OUT
84 dB CH MIC INPUT
→
GROUP OUT/ST OUT (CH to ST)
94 dB CH MIC INPUT
→
ST OUT (GROUP to ST)
62.2 dB CH MIC INPUT
→
REC OUT (CH to ST)
76 dB CH MIC INPUT
→
AUX SEND (PRE)
86 dB CH MIC INPUT
→
AUX SEND (POST)
58 dB CH LINE INPUT
→
GROUP OUT/ST OUT (CH to ST)
84 dB ST CH MIC INPUT
→
GROUP OUT/ST OUT (CH to ST)
58 dB ST CH LINE INPUT
→
GROUP OUT/ST OUT (ST CH to ST)
47 dB ST CH LINE INPUT
→
AUX SEND (PRE)
57 dB ST CH LINE INPUT
→
AUX SEND (POST)
34 dB ST CH INPUT
→
GROUP OUT/ST OUT (ST CH to ST)
16 dB RETURN
→
ST OUT
9 dB RETURN
→
AUX SEND
27.8 dB 2TR INPUT
→
ST OUT
Monaural/Stereo Input Gain Control44 dB variable
Monaural/Stereo High Pass Filter80 Hz 12 dB/octave
Crosstalk (1 kHz)
–70 dB between input channels
–70 dB between input/output channels (CH INPUT)
Monaural/Stereo Input Channel Equalization:
Max. V ariation
3
±15 dB
HIGH 10 kHz shelving
MID 2.5 kHz peaking
LOW 100 Hz shelving
Monaural/Stereo Input Peak Indicator
On each channel: red indicator lights if post-EQ signal (on ST channels, if either post-EQ signal or post-mic-amp signal) comes within 3 dB of the clipping level.
Level Meters
Two 12-point LED meters
Peak point: red indicator
+5, +3, +1, and 0 points: yellow indicators
–1, –3, –5, –7, –10, –15, –20: green indicators
Phantom +48 VDC Power (Balanced input)Supplied when Phantom +48 V switch is ON.
Included AccessoryPower adaptor (PA-20)
Power Supply
USA and Canada:120 V AC, 60 Hz
Europe:230 V AC, 50 Hz
Australia:240 V AC, 50 Hz
Korea:220 V AC, 60 Hz
China:220 V AC, 50 Hz
Power ConsumptionMG16/4: 36 WMG12/4: 29 W
Max. Dimensions (W
×H ×
D)MG16/4: 423 ×108 ×416.6 mmMG12/4: 322 ×108×416.6 mm
Weight MG16/4: 5.2 kgMG12/4: 5.0 kg
■
MG12/4
MG16/4
3
MG12/4
MG16/4
Input Specifications
■
Input ConnectorGain
MIC INPUT
(MG16/4: CHs 1 to 8)
(MG12/4: CHs 1 to 4)
LINE INPUT
(MG16/4: CHs 1 to 8)
(MG12/4: CHs 1 to 4)
ST CH MIC INPUT
(MG16/4: CH9(L)/CH10(R),
CH11(L)/CH12(R))
(MG12/4: CH5(L)/CH6(R),
CH7(L)/CH8(R))
ST CH LINE INPUT
(MG16/4: CH9(L)/CH10(R),
CH11(L)/CH12(R))
(MG12/4: CH5(L)/CH6(R),
CH7(L)/CH8(R))
ST CH INPUT
(MG16/4: CH13(L)/CH14(R),
CH15(L)/CH16(R))
(MG12/4: CH9(L)/CH10(R),
CH11(L)/CH12(R))
CH INSERT IN
(MG16/4: CHs 1 to 8)
(MG12/4: CHs 1 to 4)
–60
–16
–34
+10
–60
–16
–34
+10
Input
Impedance
3 k
Ω
10 k
Ω
3 k
Ω
10 k
Ω
10 k
Ω
10 k
Ω
Appropriate
Impedance
50–600 Ω mic
600 Ω line
50–600 Ω mic
600 Ω line
600 Ω line
600 Ω line
Sensitivity*Rated Level
–80 dBu
(0.078 mV)
–36 dBu
(12.3 mV)
–54 dBu
(1.55 mV)
–10 dBu
(245 mV)
–80 dBu
(0.078 mV)
–36 dBu
(12.3 mV)
–54 dBu
(1.55 mV)
–10 dBu
(245 mV)
–30 dBu
(24.5 mV)
–20 dBu
(77.5 mV)
–60 dBu
(0.775 mV)
–16 dBu
(123 mV)
–34 dBu
(15.5 mV)
+10 dBu
(2.45 V)
–60 dBu
(0.775 mV)
–16 dBu
(123 mV)
–34 dBu
(15.5 mV)
+10 dBu
(2.45 V)
–10 dBu
(245 mV)
0 dBu
(0.775 V)
Max. Before
Clipping
–40 dBu
(7.75 mV)
+4 dBu
(1.23 V)
–14 dBu
(155 mV)
+30 dBu
(24.5 V)
–40 dBu
(7.75 mV)
–10 dBu
(245 mV)
–14 dBu
(155 mV)
+30 dBu
(24.5 V)
+10 dBu
(2.45 V)
+20 dBu
(7.75 V)
Connector
Specifications
XLR-3-31 type (balanced)
Phone jack (TRS)
(balanced [T: hot; R: cold;
S: ground])
XLR-3-31 type (balanced)
Phone jack (unbalanced)
Phone jack (unbalanced);
RCA pin jack
Phone jack (TRS)
(unbalanced [T: out; R: in;
S: ground])
RETURN (L, R)10 k
2TR IN (L, R)10 k
Ω
Ω
600 Ω line
600 Ω line
–12 dBu
(195 mV)
–26 dBV
(50.1 mV)
+4 dBu
(1.23 V)
–10 dBV
(316 mV)
+24 dBu
(12.3 V)
+10 dBV
(3.16 V)
Phone jack (TRS) (unbalanced
[T: hot; S: ground])
RCA pin jack
Where 0 dBu = 0.775 V and 0 dBV= 1 V
* Input sensitivity: the lowest level that will produce the nominal output level when the unit is set to maximum gain.
■
Output Specifications
Output Connectors
ST OUT (L, R)150
GROUP OUT (1-2)
AUX SEND (1-2)
CH INSERT OUT
(MG16/4: CHs 1 to 8)
(MG12/4: CHs 1 to 4)
Note: Within this manual, all panel illustrations show the MG16/4 panel.
(パネルイラストはすべてMG16/4です。)
8
MG12/4
MG16/4
■ Master Control Section
y
u
r
(マスターコントロール部)
!2
!1
!0
o
q [ST] Master Fader
w [GROUP 1-2] Fader
e [ TO ST ] Switch
r Master SEND ([AUX1] and [AUX2] Controls)
t RETURN ([AUX1], [AUX2], and [ST] Controls)
y [2TR IN] Control
u [PHANTOM +48V] Switch
i Level-Meter Signal Switches
(ST-GROUP Toggle Switch and 2TR IN Switch)
o [C-R/PHONES] Control
!0 Level Meter
!1 [POWER] Indicator
!2 [PHONES] jack
t
e
wq
i
q [ST]マスターフェーダー
w [GROUP1-2]フェーダー
e [TOST]スイッチ
r SENDマスター
([AUX1]、[AUX2]コントロール)
t RETURN
([AUX1]、[AUX2]コントロール、[ST]コ ントロール)
y [2TRIN]コントロール
u [PHANTOM+48V]スイッチ
i レベルメーター信号切り替えスイッチ
(ST-GROUP切り替えスイッチ、 2TRINスイッチ)
o [C-R/PHONES]コントロール
!0 レベルメーター
!1 [POWER]インジケーター
!2 [PHONES]端子
9
MG12/4
MG16/4
■ Rear Input/Output Section
uio!0
y
!1
!2trq
(リア入出力部)
e
q Channel Input jacks
[MIC] jacks (MG16/4: CHs 1 to 8, 9/10, 11/12.
MG12/4: CHs 1 to 4, 5/6, 7/8)
[LINE] jacks (MG16/4: CHs 1 to 8. MG12/4: CHs
1 to 4)
w [INSERT I/O] Jacks
(MG16/4: CHs 1 to 8. MG12/4: CHs 1 to 4)
e Channel Input jacks
Phone type (MG16/4: CHs 9/10 to 15/16. MG12/4:
CHs 5/6 to 11/12)
RCA pin type (MG16/4: CHs 13/14, 15/16. MG12/
4: CHs 9/10, 11/12)
r [GROUP OUT] (1, 2) Jacks
t [ST OUT] (L, R) Jacks
y [C-R OUT] Jacks
u [SEND] Jacks
i [RETURN L] (MONO), [RETURN R] Jacks
o [REC OUT] (L, R) Jacks
!0 [2TR IN] Jacks
!1 [POWER] Switch
!2 [AC ADAPTOR IN] Connector
r [GROUPOUT](1、2)端子
t [STOUT](L、R)端子
y [C-ROUT]端子
u [SEND]端子
i [RETURNL](MONO)、[RETURNR]端子
o [RECOUT](L、R)端子
!0 [2TRIN]端子
!1 [電源]スイッチ
!2 [ACADAPTORIN]端子
10
Connector Polarities
MG12/4
MG16/4
MIC INPUT, ST OUT
LINE INPUT (monaural channels),
GROUP OUT, ST OUT, C-R OUT
AUX1, AUX2 *
INSERT I/O
PHONES
RETURN
LINE INPUT (stereo channels)
* These jacks will also accept connection to monaural phone plugs. If you use monaural plugs, the connection will be unbalanced.
[430]: Bind Head Tapping Screw-S3.0 x 6MFZN2B3(WE877800)
[500]: Bind Head Tapping Screw-S3.0 x 6MFZN2B3(WE877800)
[510]: Bind Head Screw4.0 x 8MFZN2B3(WE969000)
[510B]
[500]
[500]
[510B]
Sタイト+BIND
Sタイト+BIND
小ネジ+BIND
16
(Fig. 1)
(図1)
MG12/4
MG16/4
3.PS Circuit Board
(Time required : About 4 min.)
3-1.Remove the rack mount angle L and R.
(See procedure 1)
3-2.Remove the bottom cover. (See procedure 2)
3-3.Remove the two (2) screws marked [480]. The PS circuit
board and heat sink can then be removed. (Fig. 2)
*Replacing any part on the PS circuit board requires
removal of the heat sink as well. Use the following
procedure to remove the heat sink.
3-4.Remove the two (2) screws marked [A] fixing IC01 and
IC05. (Photo 1)
3-5.Remove the three (3) screws marked [B]. (Photo 1)
3-6.Remove the solder IC02, IC03 and Q01. The heat sink
can then be removed from the PS circuit board. (Photo 1)
4.Side Cover
(Time required : About 5 minutes each.)
4-1.Remove the rack mount angle L and R.
(See procedure 1)
4-2.Remove the bottom cover. (See procedure 2)
Side Cover L :
4-3.
4-3-1. Remove the screw marked [430A], two (2) screws
marked [430B], three (3) screws marked [440A] and
two (2) screws marked [450A]. The side cover L can
then be removed. (Fig. 2)
Side Cover R :
4-4.
4-4-1. Remove the PS circuit board. (See procedure 3)
4-4-2. Remove the screw marked [430C], two (2) screws
marked [430D], three (3) screws marked [440B] and
two (2) screws marked [450B]. The side cover R can
5-2.Remove the bottom cover. (See procedure 2)
5-3.Remove the PS circuit board. (See procedure 3)
5-4.Remove the side cover L and R. (See procedure 4)
5-5.Pull out the ten (10) fader knobs. (Fig. 2)
5-6.Remove the two (2) screws marked [450C]. (Fig. 2)
5-7.Remove the eighteen (18) screws marked [460] and
twenty-six (26) hexagonal nuts. The MAIN and JACK
1/2, 2/2 circuit boards can then be removed. (Fig. 2)
Disconnect the seven (7) connectors and separate the
MAIN circuit board and the JACK 1/2 circuit board.
*The knobs, buttons and supporting fixtures on the MAIN
circuit board are not components of the circuit board.
When replacing the MAIN circuit board, be sure to
remove these parts according to the following
procedure.
[430]: Bind Head Tapping Screw-S3.0 x 6MFZN2B3(WE877800)
[440]: Bind Head Tapping Screw-S3.0 x 6MFZN2W3(WE877900)
[450]: Hex. Socket Set Screw-S3.0 x 6MFZN2B3(WF419300)
[460]: Bonding Tapping Screw-B3.0 x 10 MFZN2B3(WE878000)
[480]: Bind Head Tapping Screw-B3.0 x 8MFZN2W3(WE774300)
(Fig. 2)
(図2)
Sタイト+BIND
Sタイト+BIND
Sタイト六角孔付き
Bタイト+BOND
Bタイト+BIND
MG12/4
[B]IC01IC02 IC03IC05Q01[B]
[A][A]
PS
PS
MG16/4
*The upper and lower MIX1 support each can then be
removed in the same manner.
5-13. Detach the meter cover from the meter reflector.
(Fig. 3)
[A]:Bind Head Tapping Screw-B3.0 x 8MFZN2W3(WE774300)
[B]:Bind Head Tapping Screw-B3.0 x 8MFZN2W3(WE774300)
Push HPF buttons
(ボタンHPF)
(Photo 1)
(写真1)
※サポートMIX1[lower]も同様に抜き取ります。
5-13. リフレクターMETERからウィンドウMETERをはが
します。(図3)
Bタイト+BIND
Bタイト+BIND
(フック)
Hooks
Push ON buttons
(ボタンONAssy)
Push PFL buttons
(ボタンPFL)
Push HPF buttons
(ボタンHPF)
MIX2 support
(サポートMIX2)
Sleeve ON buttons
(スリーブONボタン)
MAIN
[420]
Hexagonal nuts
(特殊六角ナット)
MIX1 support (upper)
(サポートMIX1[upper])
JACK
2/2
MIX1 support (lower)
(サポートMIX1[lower])
Push PFL buttons
(ボタンPFL)
Meter cover
(ウィンドウMETER)
Meter reflector
(リフレクターMETER)
[420]: Bind Head Tapping Screw-S3.0 x 6MFZN2W3(WE877900)
[420]
Push HPF buttons
[420]
(Fig. 3)
(図3)
(ボタンHPF)
Sタイト+BIND
19
MG12/4
MG16/4
6.Power Switch and AC Connector
(Time required : About 6 minutes each.)
6-1.Remove the rack mount angle L and R.
(See procedure 1)
6-2.Remove the bottom cover. (See procedure 2)
6-3.Remove the PS circuit board. (See procedure 3)
6-4.Remove the side cover R. (See procedure 4)
6-5.Remove the power switch by bending its claw.
(Photo 2)
6-6.To remove the AC connector, remo ve the hexagonal nut
[430]: Bind Head Tapping Screw-S3.0 x 6MFZN2B3(WE877800)
[480]: Bind Head Tapping Screw-B3.0 x 8MFZN2W3(WE774300)
[490]: Bind Head Tapping Screw-S3.0 x 6MFZN2W3(WE877900)
[500]: Bind Head Tapping Screw-S3.0 x 6MFZN2B3(WE877800)
[510]: Bind Head Screw4.0 x 8MFZN2B3(WE969000)
(Fig. 1)
(図1)
[510B]
[500]
PS
[480]
[490]
[500]
[480]
[510B]
Sタイト+BIND
Bタイト+BIND
Sタイト+BIND
Sタイト+BIND
小ネジ+BIND
21
MG12/4
MG16/4
PS
[470]
Spacer
(六角スぺーサー)
Heat sink
[470]: Bind Head Tapping Screw-S3.0 x 6 MFZN2W3 (WE877900)
(Fig. 1-1)
(図1-1)
[A][A]
PS
[B]IC01IC02 IC03IC05Q01[B]
[A]:Bind Head Tapping Screw-B3.0 x 8MFZN2W3(WE774300)
[B]:Bind Head Tapping Screw-B3.0 x 8MFZN2W3(WE774300)
(Photo 1)
(写真1)
(ヒートシンク)
Sタイト+BIND
PS
Bタイト+BIND
Bタイト+BIND
3-5.Remove the three (3) screws marked [B]. (Photo 1)
3-6.Remove the solder IC02, IC03 and Q01. The heat sink
can then be removed from the PS circuit board. (Photo 1)
4.Side Cover
(Time required : About 5 minutes each.)
4-1.Remove the bottom cover. (See procedure 2)
Side Cover L :
4-2.
4-2-1. Remove the rack mount angle L. (See procedure 1)
4-2-2. Remove the screw marked [430A], three (3) screws
marked [430B], three (3) screws marked [440A] and
two (2) screws marked [450A]. The side cover L can
then be removed. (Fig. 2)
Side Cover R :
4-3.
4-3-1. Remove the rack mount angle R. (See procedure 1)
4-3-2. Remove the PS circuit board. (See procedure 3)
4-3-3. Remove the screw marked [430C], three (3) screws
marked [430D], three (3) screws marked [440B] and
two (2) screws marked [450B]. The side cover R can
then be removed. (Fig. 2)
5-1.Remove the bottom cover. (See procedure 2)
5-2.Remove the rack mount angle L and R.
(See procedure 1)
5-3.Remove the PS circuit board. (See procedure 3)
5-4.Remove the side cover L and R. (See procedure 4)
5-5.Pull out the fourteen (14) fader knobs. (Fig. 2)
5-6.Remove the two (2) screws marked [450C]. (Fig. 2)
5-7.Remove the twenty-six (26) screws marked [460] and
thirty-four (34) hexagonal nuts. The MAIN and JACK
1/2, 2/2 circuit boards can then be removed. (Fig. 2)
Disconnect the nine (9) connectors and separate the
MAIN circuit board and the JACK 1/2 circuit board.
*The knobs, buttons and supporting fixtures on the MAIN
circuit board are not components of the circuit board.
When replacing the MAIN circuit board, be sure to
remove these parts according to the following
procedure.
[430]: Bind Head Tapping Screw-S3.0 x 6MFZN2B3(WE877800)
[440]: Bind Head Tapping Screw-S3.0 x 6MFZN2W3(WE877900)
[450]: Hex. Socket Set Screw-S3.0 x 6MFZN2B3(WF419300)
[460]: Bonding Tapping Screw-B3.0 x 10 MFZN2B3(WE878000)
Hexagonal nuts
(特殊六角ナット)
[460][460]
(特殊六角ナット)
(Fig. 2)
(図2)
Volume knobs
(ノブVR)
[450A]
[440A]
[450A]
[440A]
JACK
1/2
[430B]
[430B]
[430B]
Sタイト+BIND
Sタイト+BIND
Sタイト六角孔付き
Bタイト+BOND
23
MG12/4
MG16/4
5-8.Remove the hexagonal nut. The J ACK 2/2 circuit board
can then be removed from the MIX1 support. (Fig. 3)
5-9.Pull out the eighty-nine (89) volume knobs from the
MAIN circuit board. (Fig. 2)
5-10. Remove the twelve (12) push ON buttons, twelve (12)
sleeve ON buttons, thirteen (13) push PFL buttons and
thirty-seven (37) push HPF buttons from the MAIN
circuit board. (Fig. 3)
5-11. Remove the five (5) screws marked [420]. The MIX2
support can then be removed from the MAIN circuit
board. (Fig. 3)
5-12. Twist the eight (8) hooks of the MIX1 support (upper)
to become straight, and the support can be removed from
the MAIN circuit board. (Fig. 3)
*The upper and lower MIX1 support each can then be
removed in the same manner.
5-13. Detach the meter cover from the meter reflector.
(Fig. 3)
MIX1 support (upper)
(サポートMIX1[upper])
Push HPF buttons
(ボタンHPF)
Push PFL buttons
(ボタンPFL)
Push ON buttons
(ボタンONAssy)
5-8.特殊六角ナット1個を外し、JACK2/2シートをサポー
トMIX1から外します。(図3)
5-9.MAINシートからノブVRを89個抜き取ります。(図2)
5-10. MAINシートからボタンON A s syを12個、スリープ
[420]: Bind Head Tapping Screw-S3.0 x 6MFZN2W3(WE877900)
(Fig. 3)
(図3)
Push HPF buttons
(ボタンHPF)
Sタイト+BIND
MG12/4
MG16/4
6.Power Switch and AC Connector
(Time required : About 6 minutes each.)
6-1.Remove the rack mount angle L and R.
(See procedure 1)
6-2.Remove the bottom cover. (See procedure 2)
6-3.Remove the PS circuit board. (See procedure 3)
6-4.Remove the side cover R. (See procedure 4)
6-5.Remove the power switch by bending its claw.
(Photo 2)
6-6.To remove the AC connector, remo ve the he xagonal nut